Winbond Electronics Corporation W25X80VSSIG T&R
- Part No.:
- W25X80VSSIG T&R
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
W25X80VSSIG T&R.pdf
- Description:
- IC FLASH 8MBIT SPI 75MHZ 8SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W25X80VSSIG T&R from Winbond is an 8M-bit (1MB) serial flash memory IC with SPI and dual-output SPI interface, organized into 4096 pages of 256 bytes each and 256 uniform 4KB sectors. It operates from 2.7V to 3.6V, supports up to 75MHz clock (150Mbps dual-output read), and delivers 100,000 program/erase cycles with 20-year data retention. It is used for code storage and parameter retention in space-constrained embedded boot systems.
For engineers reviewing the W25X80VSSIG T&R datasheet, W25X80VSSIG T&R pinout, W25X80VSSIG T&R application, or W25X80VSSIG T&R equivalent, key selection factors include its SOIC-208-mil (SS) package, hardware/software write protection via /WP and status register, sector-level erase granularity, dual-output read performance, and JEDEC-compliant identification support.
Technical Context
The W25X80VSSIG T&R implements a standard SPI Mode 0/3 interface with four dedicated pins: /CS, CLK, DIO (bidirectional), and DO (dedicated output). Its dual-output capability activates only during Fast Read Dual Output (3Bh) instruction, repurposing DIO as a second data output line to double throughput without requiring additional I/O lines.
Internal architecture includes a 256-byte page buffer, programmable block protect bits (BP2–BP0) with top/bottom selection (TB), and a non-volatile status register with SRP-controlled write lock. Write enable state (WEL) is automatically cleared after any program/erase/write-status operation, enforcing explicit re-enablement before subsequent writes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 M-bit (1,048,576 bytes), enabling full firmware image storage for mid-tier microcontrollers |
| Page Size | 256 bytes per programmable page - minimum write unit; supports partial-page updates within buffer limits |
| Sector Size | 4 KB uniform sectors - allows fine-grained data/parameter partitioning without erasing entire device |
| Max Clock Frequency | 75 MHz - enables 150 Mbps effective read rate using Fast Read Dual Output (3Bh) |
| Write Endurance | 100,000 program/erase cycles - sufficient for field-updatable firmware and logging applications |
| Data Retention | 20 years at +25°C - ensures long-term reliability in industrial and automotive control modules |
| Supply Voltage | 2.7 V to 3.6 V - compatible with 3.3 V logic systems and tolerant of brown-out conditions |
| Operating Temp | –40°C to +85°C - qualified for extended industrial temperature range deployment |
Pinout & Package
W25X80VSSIG T&R is packaged in an 8-pin SOIC 208-mil (Package Code SS), measuring 5.3 mm × 5.3 mm × 1.9 mm, with gull-wing leads and surface-mount compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 /CS | Chip Select Input | Active-low enable; must transition high→low after power-up before first instruction; controls device selection on shared SPI bus |
| 2 DO | Serial Data Output | Dedicated output for standard SPI reads; outputs data on falling CLK edge; high-impedance when /CS high or /HOLD active |
| 3 /WP | Hardware Write Protect Input | Active-low pin that, when combined with SRP bit, locks status register writes - prevents accidental configuration changes |
| 4 GND | Ground Reference | Primary return path for VCC and all I/O signals; requires low-impedance PCB connection to minimize noise coupling |
| 5 DIO | Serial Data I/O | Bidirectional SPI data line; inputs instructions/addresses on rising CLK edge; outputs data during Fast Read Dual Output (3Bh) |
| 6 CLK | Serial Clock Input | Master-generated timing signal; supports Mode 0 (CLK idle low) and Mode 3 (CLK idle high); defines data sampling and shifting edges |
| 7 /HOLD | Hold Control Input | Active-low pause signal; suspends ongoing SPI transaction without resetting internal state - essential for multi-device bus arbitration |
| 8 VCC | Power Supply | Single 2.7–3.6 V supply; draws 5 mA typical active current and 1 µA in power-down mode |
Key Features
| Feature | Design Value |
|---|---|
| Dual Output SPI (3Bh) | Enables 150 Mbps read throughput by using DIO as secondary output - eliminates need for parallel interface in boot code shadowing |
| Uniform 4KB Sectors | Allows independent erase of parameter blocks without disturbing firmware - critical for OTA update safety and data logging integrity |
| Hardware + Software Write Protection | Combines /WP pin with BP2–BP0 and TB bits to lock specific address ranges (e.g., bootloader region) against overwrite during field operation |
| JEDEC ID & Device ID Support | Provides standardized identification (Manufacturer ID = EFh, Device ID = 13h) - enables automated BOM verification and firmware auto-detection |
| Power-down Mode (B9h) | Reduces current to 1 µA while preserving memory contents - extends battery life in always-on sensor nodes and IoT endpoints |
| Auto Write-Disable | Clears WEL bit after every Page Program, Sector Erase, Block Erase, Chip Erase, or Write Status Register - enforces explicit re-enablement for safety |
Applications
| Boot Code Storage | Firmware Update Partitioning |
|---|---|
|
Use Scenario: Storing primary bootloader and application firmware in embedded systems where external memory is required due to MCU internal flash limitation. IC Role / Device Role / Timing Role: Non-volatile code storage device accessed via SPI during cold start; provides sequential read access with fast dual-output capability for rapid code shadowing into RAM. Use Value: Enables deterministic boot time under 100 ms for 512 KB firmware images using Fast Read Dual Output (3Bh) at 75 MHz clock. |
Use Scenario: Isolating firmware update payload in dedicated memory regions to support atomic over-the-air (OTA) updates with rollback capability. IC Role / Device Role / Timing Role: Parameter and image storage partitioned across 4KB sectors; supports independent erase/program of update slot without affecting active firmware. Use Value: Guarantees safe update execution by allowing simultaneous storage of active and candidate firmware images in separate, hardware-protected sectors. |
| Industrial Sensor Configuration | Automotive Diagnostic Data Logging |
|
Use Scenario: Retaining calibrated sensor offsets, compensation tables, and operational thresholds across power cycles in factory automation equipment. IC Role / Device Role / Timing Role: Persistent configuration storage accessed infrequently but requiring high endurance and sector-level write granularity. Use Value: Supports >10,000 reconfiguration events over product lifetime using 4KB sector erase - avoids unnecessary wear on unrelated firmware regions. |
Use Scenario: Recording fault codes, CAN bus diagnostic snapshots, and environmental timestamps in vehicle telematics modules. IC Role / Device Role / Timing Role: Circular buffer implemented across multiple 4KB sectors; erased and rewritten in sequence during continuous logging. Use Value: Achieves 20-year data retention at +85°C ambient - meets ISO 16750-4 requirements for under-hood automotive electronics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AT25DF081A-SSH-T | 8 M-bit SPI flash with 4KB sectors; supports 85 MHz max clock but lacks dual-output mode; uses different status register layout and command set. | Requires firmware driver modification for erase/write sequences; no Fast Read Dual Output acceleration - slower boot times. | Select if legacy Atmel toolchain compatibility or existing AT25DF design reuse is prioritized over peak read speed. |
| S25FL008A0XMFI001 | 8 M-bit Quad SPI flash with 4KB sectors; supports QSPI x4 mode (up to 80 MHz x4 = 320 Mbps); includes SFDP register for auto-configuration. | Delivers higher bandwidth than W25X80VSSIG T&R but requires QSPI-capable host controller and updated driver stack. | Select when migrating to QSPI-enabled MCUs (e.g., STM32L4+, i.MX RT) and system-level throughput exceeds 150 Mbps requirement. |
Compared with AT25DF081A-SSH-T and S25FL008A0XMFI001, the W25X80VSSIG T&R offers optimal balance of SPI compatibility, dual-output acceleration, and minimal host driver changes - making it ideal for cost-sensitive, pin-constrained designs retaining standard SPI controllers.
Availability
W25X80VSSIG T&R is available at Aetrix Electronics and suitable for industrial control panels, automotive telematics modules, and medical sensor hubs requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.
Supply support for W25X80VSSIG T&R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics Corporation is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND flash, SRAM, and mobile DRAM for industrial, communications, and consumer markets.
The W25X series was designed specifically for embedded code storage and data logging applications demanding high reliability, low power, and SPI interface simplicity - targeting resource-constrained microcontroller platforms.
FAQ
What is the package type and lead count of the W25X80VSSIG T&R?
The W25X80VSSIG T&R uses an 8-pin SOIC package with 208-mil width (Package Code SS), featuring gull-wing leads and surface-mount compatibility. Its dimensions are 5.3 mm × 5.3 mm × 1.9 mm, and it is supplied in tape-and-reel format per the "T&R" suffix. This package is distinct from the 150-mil SOIC used for lower-density W25X10/W25X20 variants.
Does the W25X80VSSIG T&R support dual-output read mode, and how is it enabled?
Yes, the W25X80VSSIG T&R supports dual-output read mode via the Fast Read Dual Output instruction (0x3B). When this command is issued, the DIO pin functions as a second data output alongside DO, doubling effective read throughput to 150 Mbps at 75 MHz clock. No configuration register setting is required - activation is instruction-driven and automatic during 0x3B execution.
How many program/erase cycles does the W25X80VSSIG T&R guarantee, and what is its data retention period?
The W25X80VSSIG T&R guarantees a minimum of 100,000 program/erase cycles per sector and 20 years of data retention at +25°C. Retention remains validated at 10 years at +85°C per manufacturer specifications, making it suitable for industrial and automotive applications where long-term data integrity is critical.
Can the W25X80VSSIG T&R be hardware write-protected, and which pins control this?
Yes, the W25X80VSSIG T&R supports hardware write protection using the /WP (pin 3) in conjunction with the Status Register Protect (SRP) bit. When SRP = 1 and /WP is driven low, writes to the status register - including block protect bit configuration - are disabled. This prevents unauthorized modification of memory protection settings during system operation.
What JEDEC identifiers does the W25X80VSSIG T&R report, and how are they read?
The W25X80VSSIG T&R reports Manufacturer ID = 0xEF and Device ID = 0x13 (16-bit ID = 0x3014) via the Release Power-down / Device ID instruction (0xAB) and Read Manufacturer/Device ID instruction (0x90). These values are fixed and factory-programmed, enabling unambiguous device identification in automated test and firmware initialization routines.
W25X80VSSIG T&R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- SpiFlash®
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH
- Memory Size:
- 8Mbit
- Memory Organization:
- 1M x 8
- Memory Interface:
- SPI
- Clock Frequency:
- 75 MHz
- Write Cycle Time - Word, Page:
- 3ms
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
W25X80VSSIG T&R FAQ
1.How can I place an order for W25X80VSSIG T&R through Aetrix?
Please submit a Request for Quotation (RFQ) for W25X80VSSIG T&R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W25X80VSSIG T&R reliable?
The price and inventory of W25X80VSSIG T&R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W25X80VSSIG T&R is usually 5 days.
3.What payment methods are accepted for W25X80VSSIG T&R?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W25X80VSSIG T&R transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W25X80VSSIG T&R?
W25X80VSSIG T&R orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W25X80VSSIG T&R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W25X80VSSIG T&R?
For technical support, including W25X80VSSIG T&R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W25X80VSSIG T&R requirements.
6.How does Aetrix verify that W25X80VSSIG T&R is sourced from the original manufacturer or authorized distributors?
All W25X80VSSIG T&R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W25X80VSSIG T&R meets industry standards.
7.What is the process for return or replacement of W25X80VSSIG T&R?
All W25X80VSSIG T&R units undergo pre-shipment inspection (PSI). If there is an issue with W25X80VSSIG T&R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W25X80VSSIG T&R part is unused and in its original packaging.
Return procedure for W25X80VSSIG T&R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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