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Winbond Electronics Corporation W29GL032CH7B

Part No.:
W29GL032CH7B
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixW29GL032CH7B.pdf
Description:
IC FLASH 32MBIT PARALLEL 64LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,109

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Product details

Overview

W29GL032CH7B from Winbond is a 32-Mbit (4 MB) parallel NOR Flash memory IC with uniform and boot-sector architecture, 70 ns random access time, 25 ns page read speed, and single 3.0 V supply (2.7–3.6 V). It supports byte/word configuration via #BYTE pin, includes a 16-word write buffer and 8-word page read buffer, and is used in embedded firmware storage for industrial controllers and network boot loaders.

For engineers reviewing the W29GL032CH7B datasheet, W29GL032CH7B pinout, W29GL032CH7B application, or W29GL032CH7B equivalent, key selection criteria include sector protection granularity (uniform vs. top/bottom boot), EVIO voltage flexibility (1.65–VCC), deep power-down mode (≤1 µA), CFI interface compatibility, and hardware write-protect acceleration via #WP/ACC.

Technical Context

The W29GL032CH7B implements a dual-mode address/data bus with DQ15/A−1 supporting both data I/O and byte-mode address extension. Its Enhanced Variable IO (EVIO) input dynamically sets all input/output voltage thresholds across 1.65–VCC, enabling interoperability with mixed-voltage host systems without level shifters.

It features three sector architectures-High/Low uniform (64 × 64 KB), Top Boot (62 × 64 KB + 8 × 4 KB), and Bottom Boot (62 × 64 KB + 8 × 4 KB)-each with independent lock register and individual non-volatile protection. Erase suspend/resume and program suspend/resume are supported, along with CFI-compliant identification and geometry reporting.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density32 Mbit (4 MB) organized as 2M × 16 or 4M × 8
Access Time70 ns random read - meets real-time boot latency requirements for ARM Cortex-M and RISC-V SoCs
Page Read Speed25 ns - enables high-throughput firmware image streaming during system initialization
Write Buffer Size16-word (32-byte) - reduces multi-word programming time by up to 6× versus single-word writes
Erase Endurance100,000 cycles - supports field firmware updates over 10+ years in industrial gateways
Data Retention20 years at 85°C - qualified for extended-life automotive and telecom infrastructure applications
Deep Power-Down Current≤1 µA - enables ultra-low-power sleep states in battery-backed edge nodes
Supply Voltage2.7–3.6 V - compatible with 3.3 V LDOs and tolerant of brown-out conditions

Pinout & Package

W29GL032CH7B is packaged in a 48-pin TSOP (12 × 20 mm) with standard JEDEC footprint. Pin functions align with industry-standard parallel Flash interfaces, enabling drop-in replacement in legacy designs.

Pin/TerminalCircuit RoleDesign Meaning
A0–A20Address Inputs21-bit address bus; A−1 multiplexed on DQ15 in byte mode (#BYTE = VIL)
DQ0–DQ14Data I/O (X8/X16)8-bit or 16-bit bidirectional data path; DQ15 serves as A−1 in byte mode
#CEChip EnableActive-low chip select; controls device activation and power state transitions
#OEOutput EnableActive-low output control; isolates DQ pins during standby or write operations
#WEWrite EnableActive-low write strobe; latches address and data for program/erase commands
#WP/ACCWrite Protect / AccelerationHardware sector lock when low; applies VHH for accelerated programming when high
#BYTEBus Width SelectHigh = 16-bit word mode (A20–A0); Low = 8-bit byte mode (A20–A−1)
RY/#BYReady/Busy StatusOpen-drain output indicating active erase/program cycle (low) or completion (high)

Key Features

FeatureDesign Value
Enhanced Sector ProtectionCombines volatile dynamic protect (DPB) and non-volatile individual protect (IPB) for flexible, field-updatable security policies
Secured Silicon Sector256-byte factory-programmable region with 16-byte electronic serial number - enables secure device identity binding
CFI Interface SupportFull Common Flash Interface compliance (JEDEC JESD68) - enables OS-agnostic flash management in Linux/U-Boot
Suspend/Resume OperationsIndependent suspend/resume for erase and program - allows foreground task execution during background flash operations
EVIO Voltage FlexibilityInput/output thresholds track EVIO pin (1.65–VCC), eliminating external level shifters in mixed-voltage systems
Hardware Reset Input#RESET pin forces immediate return to read mode - critical for recovery after power glitches or watchdog timeouts

Applications

Industrial PLC Firmware StorageNetwork Router Boot Image

Use Scenario: Storing and executing firmware for programmable logic controllers operating in harsh environments with wide temperature swings.

IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic 70 ns read latency and 20-year data retention at 85°C.

Use Value: Eliminates need for external voltage supervisors or refresh circuitry due to built-in hardware reset and deep power-down modes.

Use Scenario: Hosting boot loader and kernel images in enterprise-grade routers requiring fast, reliable firmware updates.

IC Role / Device Role / Timing Role: Parallel NOR Flash providing CFI-identified geometry and sector-locked update partitions.

Use Value: Enables atomic firmware swaps using suspend/resume and write buffer abort, minimizing downtime during remote upgrades.

Automotive Infotainment Boot ROMMedical Device Configuration Memory

Use Scenario: Storing boot code and safety-critical configuration parameters in head unit ECUs certified to AEC-Q100 Grade 3.

IC Role / Device Role / Timing Role: Secure, high-reliability Flash with factory-locked security sector and individual sector protection.

Use Value: Meets ISO 26262 ASIL-B requirements via hardware write protection and tamper-resistant silicon ID.

Use Scenario: Retaining calibrated sensor offsets and regulatory-compliant device settings across power cycles in portable diagnostic equipment.

IC Role / Device Role / Timing Role: Low-power, long-retention non-volatile memory with ≤1 µA deep power-down current.

Use Value: Extends battery life in handheld devices while preserving calibration integrity through 20-year data retention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR Flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S29GL032N90TFI01048-pin TSOP, 70 ns access, but lacks EVIO and deep power-down mode; requires fixed 3.0 V ±5% supplyNo hardware-accelerated programming; no CFI support for automatic geometry detectionChoose only if legacy design mandates identical timing and no low-power or mixed-voltage operation needed
MX29GL32EHXFI-90G48-pin TSOP, 70 ns access, supports CFI and sector protection, but no write buffer or suspend/resumeSlower multi-word programming; no background operation capability during firmware updatesSelect when cost sensitivity outweighs need for advanced program/erase management features

Compared with S29GL032N90TFI010 and MX29GL32EHXFI-90G, the W29GL032CH7B delivers superior system-level efficiency via its 16-word write buffer, EVIO adaptability, and full suspend/resume support-reducing firmware update time by >40% and enabling seamless integration into voltage-flexible, power-constrained designs.

Availability

W29GL032CH7B is available at Aetrix Electronics and suitable for industrial PLC firmware storage, network router boot image hosting, and automotive infotainment boot ROM applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for W29GL032CH7B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and communications markets.

The W29GL series is designed specifically for embedded systems requiring high reliability, low power, and robust firmware storage-featuring enhanced sector protection, CFI compatibility, and hardware-accelerated programming for production throughput.

FAQ

What is the pin-compatible package option for W29GL032CH7B?

The W29GL032CH7B uses a 48-pin TSOP (12 × 20 mm) package per JEDEC MO-142AC. This matches industry-standard footprints used by S29GL032N and MX29GL32E families. Pin mapping-including #CE, #OE, #WE, DQ0–DQ15/A−1, and #BYTE-is electrically and mechanically compatible, enabling direct PCB-level substitution where voltage and timing margins permit.

Does W29GL032CH7B support both byte and word addressing modes?

Yes, W29GL032CH7B supports dual bus widths via the #BYTE pin: when #BYTE = VIH, it operates in 16-bit word mode with addresses A20–A0; when #BYTE = VIL, it operates in 8-bit byte mode with addresses A20–A−1 (where A−1 is multiplexed onto DQ15). This eliminates need for external data-width translation logic.

How does the #WP/ACC pin function in W29GL032CH7B?

In W29GL032CH7B, the #WP/ACC pin serves two roles: when held low, it hardware-locks the first or last sector (depending on boot configuration); when driven high with VHH (12 V), it accelerates programming time by ~2×. This dual functionality enables both security enforcement and production-line throughput optimization without changing firmware.

What is the purpose of the EVIO pin on W29GL032CH7B?

The EVIO pin on W29GL032CH7B sets the reference voltage for all input thresholds and output drive levels. Ranging from 1.65 V to VCC, it allows the device to interface directly with 1.8 V, 2.5 V, or 3.3 V hosts without external level shifters-critical for mixed-voltage embedded systems where signal integrity and BOM count must be minimized.

Can W29GL032CH7B be used in deep power-down mode for battery-powered applications?

Yes, W29GL032CH7B supports deep power-down mode with typical current draw ≤1 µA. Entry is triggered by specific command sequences while #CE is high; exit requires #RESET assertion or power cycle. This mode preserves stored data while enabling multi-year battery life in portable medical and IoT edge devices.

W29GL032CH7B Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
64-LBGA
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
32Mbit
Memory Organization:
4M x 8, 2M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
70ns
Access Time:
70 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFBGA (11x13)

W29GL032CH7B FAQ

1.How can I place an order for W29GL032CH7B through Aetrix?

Please submit a Request for Quotation (RFQ) for W29GL032CH7B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W29GL032CH7B reliable?

The price and inventory of W29GL032CH7B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29GL032CH7B is usually 5 days.

3.What payment methods are accepted for W29GL032CH7B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29GL032CH7B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W29GL032CH7B?

W29GL032CH7B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W29GL032CH7B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W29GL032CH7B?

For technical support, including W29GL032CH7B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29GL032CH7B requirements.

6.How does Aetrix verify that W29GL032CH7B is sourced from the original manufacturer or authorized distributors?

All W29GL032CH7B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29GL032CH7B meets industry standards.

7.What is the process for return or replacement of W29GL032CH7B?

All W29GL032CH7B units undergo pre-shipment inspection (PSI). If there is an issue with W29GL032CH7B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W29GL032CH7B part is unused and in its original packaging.

Return procedure for W29GL032CH7B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W29GL032CH7B Tags

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