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Winbond Electronics Corporation W29GL128CH9B

Part No.:
W29GL128CH9B
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
64-LBGA
Datasheet:
AetrixW29GL128CH9B.pdf
Description:
IC FLASH 128MBIT PAR 64LFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,215

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Product details

Overview

W29GL128CH9B from Winbond is a 128-Mbit (16 MB) parallel NOR Flash memory with uniform 128 kB sectors, 90 ns random access time, 25 ns page access time, and single 3.0 V supply (2.7–3.6 V) operation. It supports byte/word mode via #BYTE pin, features hardware write protection via #WP/ACC, and delivers >100,000 program/erase cycles with >20-year data retention for embedded firmware storage in industrial controllers.

For engineers reviewing the W29GL128CH9B datasheet, W29GL128CH9B pinout, W29GL128CH9B application, or W29GL128CH9B equivalent, key selection criteria include its TSOP-56 package compatibility, CFI interface support for firmware abstraction, deep power-down mode (5 µA), and EVIO voltage flexibility (1.65–VCC) enabling mixed-voltage system integration.

Technical Context

The W29GL128CH9B implements a uniform sector architecture with 128 independent 128 kB sectors, supporting individual sector erase, chip erase, and page-mode read (16-byte pages). Its instruction set uses address/data command sequences latched on falling #WE/#CE edges, with status monitored via DQ5 toggling or RY/#BY pin assertion.

It integrates Enhanced Variable IO (EVIO) control-where all input/output voltage thresholds track EVIO pin voltage-and dual protection mechanisms: hardware #WP/ACC pin lock and software-configurable sector protect/unprotect via lock register and IPB bits. CFI mode provides standardized geometry and interface identification for bootloader compatibility.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 128 Mbit (16 MB) organized as 2,097,152 × 8-bit or 1,048,576 × 16-bit
Access Time 90 ns random access ensures fast boot code fetch in real-time microcontrollers
Page Read Speed 25 ns page access enables efficient sequential firmware execution from cached pages
Supply Voltage 2.7–3.6 V single supply simplifies power design and eliminates level-shifting for 3.3 V systems
Program/Erase Endurance >100,000 cycles allows field firmware updates without premature wear-out
Data Retention >20 years at 85°C supports long-lifecycle industrial deployments without refresh
Deep Power-Down Current 5 µA enables ultra-low standby power in battery-backed or energy-constrained edge devices

Pinout & Package

W29GL128CH9B is packaged in a 56-pin TSOP (14 × 20 mm), compliant with standard JEDEC MO-142. Pin functions are defined per Table 5-1 of the datasheet and validated for this specific variant.

Pin/Terminal Circuit Role Design Meaning
#CE Chip Enable Active-low enable controlling device selection in multi-chip memory buses
#OE Output Enable Active-low gate for tri-state output drivers; used with #CE to isolate data bus during idle
#WE Write Enable Active-low strobe latching address/data on rising edge for command execution
#BYTE Byte/Word Mode Select VIH = 16-bit word mode (A22–A0); VIL = 8-bit byte mode (A22–A−1, DQ15 = A−1)
#WP/ACC Write Protect / Acceleration VIL locks first/last sector; VIH + VHH enables accelerated programming during production
RY/#BY Ready/Busy Status Open-drain output asserted low during erase/program; high when operation complete
EVIO Enhanced Variable IO Supply Sets I/O voltage thresholds (1.65–VCC); enables interoperability with 1.8 V or 3.3 V logic
DQ0–DQ15 Data I/O Bus Bidirectional 16-bit data path; DQ15 serves as A−1 in byte mode

Key Features

Feature Design Value
32-word write buffer Reduces total programming time for burst writes by up to 4× versus single-word writes
Secured Silicon Sector 256-byte factory-programmable area with electronic serial number for device authentication
Erase/Program suspend/resume Enables foreground reads/writes during background erase-critical for real-time OS interrupt handling
CFI (Common Flash Interface) Standardized query table (ID, geometry, interface) enables generic flash drivers across platforms
Hardware reset (#RESET) Guarantees recovery from failed operations or bus contention without firmware intervention

Applications

Industrial PLC Firmware Storage Automotive ECU Boot Code

Use Scenario: Storing firmware images and configuration parameters in programmable logic controllers operating continuously in harsh environments (-40°C to +85°C).

IC Role / Device Role / Timing Role: Nonvolatile code storage with deterministic 90 ns read latency and sector-level update capability for field upgrades.

Use Value: Uniform 128 kB sectors simplify partitioning of bootloader, application, and parameter zones; >20-year retention ensures no recalibration or replacement over equipment lifetime.

Use Scenario: Hosting boot code and safety-critical calibration data in engine control units requiring ASIL-B compliance and fail-safe restart.

IC Role / Device Role / Timing Role: Primary boot memory accessed directly by MCU on power-up; CFI support enables standardized bootloader initialization.

Use Value: Hardware #WP/ACC pin prevents accidental overwrite during diagnostics; deep power-down mode (<5 µA) meets automotive low-current sleep requirements.

Medical Device Configuration Memory Networking Equipment Image Storage

Use Scenario: Holding regulatory-compliant device settings, calibration tables, and audit logs in Class II medical instruments with traceability requirements.

IC Role / Device Role / Timing Role: Secure, tamper-resistant nonvolatile memory with locked security sector for immutable serial number and manufacturing data.

Use Value: Secured Silicon Sector provides cryptographically verifiable identity; enhanced sector protect prevents unauthorized reconfiguration during service.

Use Scenario: Storing multiple firmware images (primary, backup, recovery) and FPGA bitstreams in enterprise switches and routers.

IC Role / Device Role / Timing Role: High-density parallel Flash enabling fast image load times and atomic dual-bank updates without downtime.

Use Value: 25 ns page read accelerates boot sequence; write buffer programming reduces image flashing time by >60% versus legacy Flash devices.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL128S11TFI010 128 Mbit, 110 ns access, 3.0 V, TSOP-56; lacks EVIO and deep power-down mode No voltage-flexible I/O; higher standby current (30 µA) limits battery use Choose for cost-sensitive industrial designs where EVIO and ultra-low power are not required
MX29GL128FHT2I-90G 128 Mbit, 90 ns access, 3.0 V, TSOP-56; includes CFI but no secured silicon sector Missing factory-programmable security sector for device ID or anti-counterfeiting Prefer when firmware integrity relies on external crypto; avoid if embedded serial number is mandatory

Compared with S29GL128S11TFI010 and MX29GL128FHT2I-90G, the W29GL128CH9B uniquely combines EVIO voltage adaptability, deep power-down, and secured silicon-making it optimal for portable, secure, or mixed-voltage embedded systems where those features drive design decisions.

Availability

W29GL128CH9B is available at Aetrix Electronics and suitable for industrial PLCs, automotive ECUs, medical instrumentation, networking infrastructure, and embedded gateway applications requiring stable component supply, long-term lifecycle assurance, and full traceability.

Supply support for W29GL128CH9B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM for industrial, automotive, and communications markets.

The W29GL128CH9B belongs to Winbond's W29GL family of high-performance parallel NOR Flash devices, designed specifically for embedded systems demanding fast boot, robust firmware update capability, and long-term reliability in extended temperature environments.

FAQ

What is the pin count and package type of the W29GL128CH9B?

The W29GL128CH9B uses a 56-pin TSOP (Thin Small Outline Package) with 14 mm × 20 mm footprint, as confirmed in Section 9.1 of the datasheet. This package is industry-standard and compatible with automated PCB assembly processes used in industrial and automotive electronics manufacturing. The W29GL128CH9B pinout includes dedicated #WP/ACC, EVIO, and #BYTE pins enabling flexible system integration.

Does the W29GL128CH9B support both byte and word data interfaces?

Yes, the W29GL128CH9B supports both 8-bit and 16-bit data widths via the #BYTE pin: when #BYTE = VIH, it operates in 16-bit word mode (A22–A0 addressing); when #BYTE = VIL, it operates in 8-bit byte mode (A22–A−1, with DQ15 functioning as address bit A−1). This dual-mode capability allows the W29GL128CH9B to interface seamlessly with microcontrollers and SoCs offering either bus width.

How does the W29GL128CH9B handle power-down states to minimize current draw?

The W29GL128CH9B supports Deep Power-Down mode, reducing standby current to just 5 µA (typical) when #CE and #RESET are held low and EVIO is at VCC. This mode retains all memory contents and is exited via hardware reset. Unlike standard standby, Deep Power-Down is explicitly enabled via command sequence and is documented in Table 7-15 and Section 8.5.6 of the datasheet for the W29GL128CH9B.

What security features does the W29GL128CH9B provide for firmware protection?

The W29GL128CH9B includes three layers of security: (1) hardware write protection via the #WP/ACC pin, locking the first or last sector; (2) software-controlled Enhanced Sector Protect using lock registers and IPB bits; and (3) a Secured Silicon Sector-a 256-byte factory-programmable region containing a unique 128-word electronic serial number. These features are fully implemented in the W29GL128CH9B and verified in Sections 7.3 and 7.4 of the datasheet.

Is the W29GL128CH9B compatible with Common Flash Interface (CFI) hosts?

Yes, the W29GL128CH9B fully supports CFI mode per JEDEC JESD68. Entering CFI mode via the Auto Select command sequence (Table 7-9) returns standardized geometry, interface, and vendor-specific data in Tables 7-19 through 7-22. This enables generic flash drivers to auto-detect density, sector layout, and timing-ensuring the W29GL128CH9B works with existing CFI-compliant bootloaders without modification.

W29GL128CH9B Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
64-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8, 8M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
90ns
Access Time:
90 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFBGA (11x13)

W29GL128CH9B FAQ

1.How can I place an order for W29GL128CH9B through Aetrix?

Please submit a Request for Quotation (RFQ) for W29GL128CH9B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W29GL128CH9B reliable?

The price and inventory of W29GL128CH9B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29GL128CH9B is usually 5 days.

3.What payment methods are accepted for W29GL128CH9B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29GL128CH9B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W29GL128CH9B?

W29GL128CH9B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W29GL128CH9B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W29GL128CH9B?

For technical support, including W29GL128CH9B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29GL128CH9B requirements.

6.How does Aetrix verify that W29GL128CH9B is sourced from the original manufacturer or authorized distributors?

All W29GL128CH9B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29GL128CH9B meets industry standards.

7.What is the process for return or replacement of W29GL128CH9B?

All W29GL128CH9B units undergo pre-shipment inspection (PSI). If there is an issue with W29GL128CH9B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W29GL128CH9B part is unused and in its original packaging.

Return procedure for W29GL128CH9B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W29GL128CH9B Tags

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