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Winbond Electronics Corporation W29GL128CH9B TR
- Part No.:
- W29GL128CH9B TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
W29GL128CH9B TR.pdf
- Description:
- IC FLASH 128MBIT PAR 64LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,463
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Product details
Overview
W29GL128CH9B TR from Winbond is a 128-Mbit (16 MB) parallel NOR Flash memory IC with uniform 128k-byte sectors, 90 ns random access time, 25 ns page access time, and single 3.0 V supply (2.7–3.6 V) operation. It supports byte/word mode via #BYTE pin, includes hardware write protection (#WP/ACC), and is used in embedded boot code storage for industrial controllers and network equipment.
For engineers reviewing the W29GL128CH9B TR datasheet, W29GL128CH9B TR pinout, W29GL128CH9B TR application, or W29GL128CH9B TR equivalent, key selection criteria include sector erase speed (1.5× faster than industry standard), write buffer size (32-word), deep power-down current (≤1 µA), CFI compliance, and TSOP-56 package compatibility with legacy 3V parallel Flash designs.
Technical Context
This device implements a uniform-sector architecture with 128 independent 128-kilobyte sectors, enabling selective erasure without affecting adjacent data. Its Enhanced Variable IO (EVIO) input sets all I/O voltage thresholds between 1.65 V and VCC, supporting mixed-voltage system interfacing.
It executes embedded algorithms-including automatic sector/chip erase, write buffer programming, and erase/program suspend/resume-using status polling (DQ5/DQ6) or RY/#BY output. The secured silicon sector provides factory- or customer-programmable 256-byte identification space with 16-byte electronic serial number.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 128 Mbit (16 MB); supports full boot image storage for ARM Cortex-M4/M7 microcontrollers. |
| Access Time | 90 ns random read; ensures deterministic timing for real-time firmware execution from XIP (execute-in-place) configurations. |
| Page Access Time | 25 ns; accelerates sequential instruction fetch during boot loader initialization or firmware update routines. |
| Write Buffer Size | 32-word (64-byte); reduces total programming time by >60% for multi-word updates compared to single-word writes. |
| Erase Endurance | 100,000 cycles per sector; qualifies for field-updatable industrial firmware with 10+ year service life. |
| Data Retention | 20 years at +85°C; meets long-term reliability requirements for unattended infrastructure equipment. |
| Deep Power-Down Current | ≤1 µA; enables ultra-low-power sleep states in battery-backed or energy-harvesting edge nodes. |
Pinout & Package
W29GL128CH9B TR is packaged in a 56-pin TSOP-I (14 × 20 mm), compliant with JEDEC MO-141BA. Pin functions are electrically defined per Winbond's official datasheet Rev. H (Aug 2013).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low chip select; must be asserted before #OE/#WE to enable internal address decoding and memory access. |
| #OE | Output Enable | Active-low control for data bus drivers; tri-states DQ[15:0] when deasserted to prevent bus contention. |
| #WE | Write Enable | Active-low strobe for latching address/data during programming/erase commands and status register reads. |
| #WP/ACC | Hardware Write Protect / Acceleration | Low = protects top/bottom sector; high + VHH = enables accelerated programming for production throughput. |
| #RESET | Hardware Reset | Pull low ≥tRP (100 ns) to force return to Read mode after failed erase/program or CFI exit. |
| RY/#BY | Ready/Busy Status | Open-drain output; low = device busy executing embedded algorithm; high = ready for next command. |
| #BYTE | Byte/Word Mode Select | Low = byte mode (DQ[7:0] active, A-1 = DQ15); high = word mode (DQ[15:0] active, A0–A22 addressed). |
| EVIO | Enhanced Variable I/O Supply | Input reference voltage (1.65–VCC) setting logic thresholds for all address/control/data pins-enables mixed-voltage interface. |
Key Features
| Feature | Design Value |
|---|---|
| Uniform Sector Architecture | 128 × 128 kB sectors enable granular firmware partitioning-e.g., separate bootloader, app, and config sectors-with independent protection. |
| Secured Silicon Sector | 256-byte factory- or customer-lockable region stores immutable device ID, calibration data, or cryptographic keys-immune to accidental erase. |
| Erase/Program Suspend | Allows temporary interruption of background erase to service high-priority read/write requests-critical for real-time OS coexistence. |
| CFI (Common Flash Interface) | Standardized query mode (JEDEC JESD68) enables automatic driver detection and configuration in Linux/U-Boot without hard-coded parameters. |
| Hardware Write Protection | #WP/ACC pin + lock register support both volatile (power-cycle reset) and non-volatile (permanent) sector locking-meets IEC 62443 secure boot requirements. |
Applications
| Industrial PLC Firmware Storage | Network Router Boot Memory |
|---|---|
|
Use Scenario: Storing boot loader and real-time control firmware in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Primary XIP-capable boot memory providing deterministic 90 ns instruction fetch latency to ARM-based MCU. Use Value: Uniform sector erase enables safe field updates without disrupting running control loops; 20-year data retention eliminates recalibration intervals. |
Use Scenario: Holding U-Boot, kernel, and rootfs images in enterprise-grade Layer 3 switches requiring fast boot and secure firmware rollback. IC Role / Device Role / Timing Role: Parallel NOR Flash serving as primary boot device with CFI auto-detection for vendor-agnostic Linux BSP integration. Use Value: Secured silicon sector stores immutable MAC address and device serial; write buffer cuts firmware update time by 65% vs. legacy Flash. |
| Medical Imaging System BIOS | Automotive ADAS Camera Module |
|
Use Scenario: Hosting diagnostic BIOS and FPGA configuration bitstreams in portable ultrasound machines with strict EMC and thermal constraints. IC Role / Device Role / Timing Role: Non-volatile storage for safety-critical startup code; operates across –40°C to +85°C with guaranteed 100K erase cycles. Use Value: Deep power-down mode (<1 µA) extends battery life during standby; hardware write protect prevents corruption during ESD events. |
Use Scenario: Storing camera calibration data and firmware patches in automotive surround-view systems subject to AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Reliable, high-endurance Flash for over-the-air (OTA) update staging area-supports dual-bank firmware swapping. Use Value: Erase suspend/resume allows concurrent image capture and patch validation; individual sector lock prevents tampering with safety-critical modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR Flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL128S11TFI010 | 128 Mbit, 110 ns access, 3.0 V, 56-pin TSOP; lacks EVIO and deep power-down mode. | No mixed-voltage I/O support; higher standby current (10 µA) limits battery-powered use. | Choose only if EVIO and sub-µA sleep are not required; verify firmware compatibility with slower timing. |
| MX29GL128FHT2I-90G | 128 Mbit, 90 ns access, 3.0 V, 56-pin TSOP; includes CFI but no secured silicon sector or erase suspend. | Cannot store immutable device IDs; no background erase interruption capability for real-time systems. | Select when cost is primary constraint and security/real-time features are unnecessary; confirm absence of lock register dependencies. |
Compared with S29GL128S11TFI010 and MX29GL128FHT2I-90G, W29GL128CH9B TR uniquely combines EVIO voltage flexibility, secured silicon sector, and erase suspend-making it optimal for mixed-voltage, safety-critical, or real-time embedded designs where firmware integrity and deterministic responsiveness are mandatory.
Availability
W29GL128CH9B TR is available at Aetrix Electronics and suitable for industrial automation, networking infrastructure, and medical electronics requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for W29GL128CH9B TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM for embedded and communications markets.
The W29GL128C family was designed for high-reliability embedded boot code storage, targeting applications demanding fast random access, robust data retention, and hardware-level security features like secured silicon and dynamic sector protection.
FAQ
What is the operating voltage range for W29GL128CH9B TR?
W29GL128CH9B TR operates from 2.7 V to 3.6 V DC on VCC. Its Enhanced Variable IO (EVIO) pin accepts 1.65 V to VCC, allowing interface compatibility with 1.8 V, 2.5 V, or 3.3 V logic families without level shifters-critical for mixed-voltage board designs where W29GL128CH9B TR serves as shared boot memory.
Does W29GL128CH9B TR support both byte and word data access modes?
Yes, W29GL128CH9B TR supports configurable byte/word mode via the #BYTE pin: when #BYTE = VIL, it operates in byte mode (DQ[7:0] active, A-1 = DQ15); when #BYTE = VIH, it operates in word mode (DQ[15:0] active, full A0–A22 addressing). This dual-mode capability allows W29GL128CH9B TR to interface seamlessly with 8-bit or 16-bit microcontroller buses without redesign.
How does the secured silicon sector function in W29GL128CH9B TR?
The secured silicon sector in W29GL128CH9B TR is a dedicated 256-byte region that can be permanently locked by the factory or customer. It stores immutable data such as electronic serial numbers, calibration constants, or cryptographic keys. Once locked, this region cannot be erased or rewritten-even by global erase commands-ensuring W29GL128CH9B TR meets traceability and anti-tampering requirements in regulated industries.
What is the purpose of the #WP/ACC pin on W29GL128CH9B TR?
The #WP/ACC pin on W29GL128CH9B TR serves two roles: when pulled low, it hardware-protects the top or bottom sector regardless of software lock settings; when driven high with VHH (12 V), it accelerates programming time for high-throughput manufacturing. This dual functionality makes W29GL128CH9B TR suitable for both field-deployed devices requiring robust protection and production lines needing rapid firmware loading.
Is W29GL128CH9B TR compatible with Common Flash Interface (CFI) standards?
Yes, W29GL128CH9B TR fully supports CFI (JEDEC JESD68) through its Query mode, enabling automatic detection of device geometry, timing parameters, and command sets by host bootloaders like U-Boot or Linux MTD subsystems. This eliminates manual driver configuration and ensures W29GL128CH9B TR interoperability across diverse embedded platforms without firmware modification.
W29GL128CH9B TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 64-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8, 8M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 90ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-LFBGA (11x13)
W29GL128CH9B TR FAQ
1.How can I place an order for W29GL128CH9B TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W29GL128CH9B TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29GL128CH9B TR reliable?
The price and inventory of W29GL128CH9B TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29GL128CH9B TR is usually 5 days.
3.What payment methods are accepted for W29GL128CH9B TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29GL128CH9B TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29GL128CH9B TR?
W29GL128CH9B TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29GL128CH9B TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29GL128CH9B TR?
For technical support, including W29GL128CH9B TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29GL128CH9B TR requirements.
6.How does Aetrix verify that W29GL128CH9B TR is sourced from the original manufacturer or authorized distributors?
All W29GL128CH9B TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29GL128CH9B TR meets industry standards.
7.What is the process for return or replacement of W29GL128CH9B TR?
All W29GL128CH9B TR units undergo pre-shipment inspection (PSI). If there is an issue with W29GL128CH9B TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29GL128CH9B TR part is unused and in its original packaging.
Return procedure for W29GL128CH9B TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29GL128CH9B TR Tags
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