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Winbond Electronics Corporation W29GL256PH9B
- Part No.:
- W29GL256PH9B
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
W29GL256PH9B.pdf
- Description:
- IC FLASH 256MBIT PAR 64LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,180
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Product details
Overview
W29GL256PH9B from Winbond is a 256-Mbit (32 MB) parallel NOR Flash memory with uniform 128-KByte sectors, 90 ns random access time, 25 ns page access time, and single 3.0 V supply (2.7–3.6 V). It supports page mode read, write buffer programming (32-word), sector erase suspend/resume, and CFI interface - deployed in boot code storage for industrial microcontroller-based systems requiring deterministic nonvolatile code execution.
For engineers reviewing the W29GL256PH9B datasheet, W29GL256PH9B pinout, W29GL256PH9B application, or W29GL256PH9B equivalent, key selection criteria include TSOP-56 package compatibility, #BYTE-configurable x8/x16 bus interface, hardware write protection via #WP/ACC, deep power-down mode (≤1 µA), and verified 100,000 program/erase cycles with 20-year data retention.
Technical Context
This device implements a parallel asynchronous interface with dedicated control pins (#CE, #OE, #WE, #RESET, RY/#BY) and EVIO voltage-controlled I/O levels (1.65 V to VCC). Its architecture features 256 uniform sectors (128 KByte each), a 32-word write buffer for burst programming, and an 8-word page read buffer enabling fast sequential access within a 16-byte page.
Functional operation relies on command register programming (e.g., unlock-bypass-write sequences), status polling via DQ5/DQ6 toggling or RY/#BY assertion, and hardware-assisted protection using #WP/ACC for top/bottom sector lock. Sector erase suspend allows temporary interruption to service high-priority reads or writes in unprotected regions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB) - supports full firmware images for mid-complexity embedded controllers without external expansion. |
| Access Time | 90 ns random / 25 ns page - enables direct XIP (eXecute-In-Place) from flash in real-time systems with tight timing budgets. |
| Supply Voltage | 2.7–3.6 V - compatible with standard 3.3 V logic rails and tolerant of brown-out conditions during power sequencing. |
| Write Buffer Size | 32 words (64 bytes) - reduces total programming time by >60% vs. byte-by-byte writes for firmware patch updates. |
| Erase Cycles | 100,000 min - qualifies for field-updatable industrial equipment with 10+ years of service life and quarterly firmware revisions. |
| Data Retention | 20 years at 85°C - ensures boot code integrity across extended thermal stress in enclosed enclosures or outdoor deployments. |
| Deep Power-Down Current | ≤1 µA - enables ultra-low standby power in battery-backed or energy-harvesting edge nodes during idle periods. |
Pinout & Package
W29GL256PH9B is packaged in a 56-pin TSOP-I (14 × 20 mm), RoHS-compliant surface-mount package with standard lead pitch (0.5 mm) and JEDEC MO-142AC footprint. Pin assignment follows industry-standard parallel NOR Flash layout for drop-in compatibility with legacy designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus supporting full 32 MB addressing; A-1 multiplexed as DQ15 in byte mode when #BYTE = VIL. |
| DQ0–DQ14 | Data I/O (x16) | 15-bit bidirectional data bus; DQ15 functions as A-1 in byte mode, enabling x8/x16 configuration flexibility. |
| #CE | Chip Enable | Active-low chip select - enables device for read/write operations; critical for multi-device bus arbitration. |
| #OE | Output Enable | Active-low output gate - controls tri-state behavior of DQ pins independent of #CE, allowing shared bus contention management. |
| #WE | Write Enable | Active-low write strobe - latches address/data on falling edge; used with #CE to initiate command sequences. |
| #WP/ACC | Write Protect / Acceleration | Hardware lock for top/bottom sector; applies VHH during production to accelerate programming throughput. |
| #BYTE | Bus Width Select | Configures x8 (VIL) or x16 (VIH) interface mode - determines A-1 usage and DQ15 function per JEDEC JESD21-C. |
| RY/#BY | Ready/Busy Status | Open-drain output indicating active erase/program cycle (low) or completion (high); used for polling or interrupt-driven flow control. |
| #RESET | Hardware Reset | Forces return to Read mode; required after timeout/failure or exit from CFI/Auto-Select modes - ensures deterministic boot state. |
| EVIO | Enhanced Variable I/O Supply | Sets input/output voltage thresholds (1.65–VCC); enables interoperability with mixed-voltage SoC interfaces without level shifters. |
Key Features
| Feature | Design Value |
|---|---|
| Uniform 128-KByte Sectors (256 total) | Enables granular firmware partitioning - e.g., separate boot loader, application, and parameter sectors - with consistent erase timing (≤1 s/sector). |
| 32-Word Write Buffer | Reduces average programming time per 64-byte block by 72% vs. single-word writes - critical for OTA update latency in industrial gateways. |
| Erase Suspend/Resume | Pauses active sector erase within 20 µs to allow immediate read/write in other sectors - essential for real-time logging during background firmware updates. |
| CFI (Common Flash Interface) | Provides standardized JEDEC JESD68 query table at known address - eliminates hardcoded timing/register assumptions in bootloader porting across vendors. |
| Secured Silicon Sector (256-byte) | Factory- or customer-programmable one-time-lockable region storing immutable serial numbers or cryptographic keys - prevents cloning or unauthorized reprogramming. |
| Deep Power-Down Mode | Reduces ICC to ≤1 µA while preserving all memory contents - extends battery life in wireless sensor nodes between scheduled wake-ups. |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Loader |
|---|---|
|
Use Scenario: Stores certified boot firmware and safety-critical application code in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with XIP-capable 90 ns access - directly executed by ARM Cortex-M7 MCU without RAM copy. Use Value: Uniform sector erase enables safe dual-bank firmware updates; 20-year data retention guarantees compliance with IEC 61508 SIL-3 lifecycle requirements. |
Use Scenario: Holds FDA-cleared boot loader and diagnostic firmware in portable ultrasound and infusion pumps requiring traceable, tamper-proof startup code. IC Role / Device Role / Timing Role: Secure boot source with Secured Silicon Sector storing device-specific cryptographic keys and serial ID - validated at every power-on reset. Use Value: Hardware write protection (#WP/ACC) prevents accidental overwrite during field servicing; CFI support simplifies regulatory revalidation across product variants. |
| Automotive Body Control Module | Network Router Configuration Storage |
|
Use Scenario: Stores vehicle-specific calibration tables and CAN protocol stack in body control modules exposed to -40°C to +105°C ambient. IC Role / Device Role / Timing Role: Industrial-temp parallel Flash interfaced to Infineon AURIX TC3xx via dedicated ASCLIN peripheral - accessed only during initialization. Use Value: 100,000 erase cycles accommodate lifetime ECU reflashing; deep power-down mode meets ISO 16750-2 quiescent current limits (<5 µA). |
Use Scenario: Retains routing tables, VLAN configurations, and TLS certificates in enterprise-grade Layer 3 switches requiring zero-downtime failover. IC Role / Device Role / Timing Role: Dual-image storage with sector-level protection - primary image runs while secondary is updated; RY/#BY signals enable atomic switchover. Use Value: Erase suspend allows live packet forwarding during config reload; write buffer accelerates certificate rotation during security audits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S11TFIV10 | 48-pin TSOP, 110 ns access, no EVIO, requires 3.0 V ±0.3 V (tighter tolerance) | Lacks deep power-down mode and write buffer; lower program speed (2× slower) | Use where cost sensitivity outweighs power/performance needs and existing PCB uses 48-pin footprint. |
| MX29GL256FHI-90G | 56-pin TSOP, 90 ns access, same sector size, but no CFI support and no erase suspend | No standardized JEDEC query interface; no ability to pause erase for urgent reads/writes | Select when CFI portability and real-time interruptibility are not required, and legacy driver support exists. |
Compared with S29GL256S11TFIV10 and MX29GL256FHI-90G, W29GL256PH9B delivers superior system responsiveness via 25 ns page read, deterministic low-power operation with deep power-down, and field-proven erase suspend for mission-critical multitasking - making it optimal for next-generation industrial and medical platforms.
Availability
W29GL256PH9B is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot loaders, automotive body control modules, and network router configuration storage requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant manufacturing.
Supply support for W29GL256PH9B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and communications markets since 1987.
The W29GL series targets high-reliability embedded systems requiring deterministic boot performance, robust data retention, and flexible bus interfacing - designed specifically for applications where firmware integrity, update agility, and thermal resilience are non-negotiable.
FAQ
What is the operating temperature range for W29GL256PH9B?
W29GL256PH9B is rated for industrial temperature operation from –40°C to +85°C. This range is validated per JEDEC JESD22-A104 and supports deployment in enclosed control cabinets, outdoor telecom shelters, and medical equipment with passive thermal management. The device maintains full AC/DC specifications across this range, including 90 ns access time and 100,000 erase cycles.
Does W29GL256PH9B support both x8 and x16 bus widths?
Yes, W29GL256PH9B supports configurable x8/x16 operation via the #BYTE pin. When #BYTE = VIL, the device operates in x8 mode with DQ0–DQ7 active and A-1 multiplexed onto DQ15; when #BYTE = VIH, it operates in x16 mode with DQ0–DQ14 active and full 24-bit addressing (A0–A23). This dual-mode capability enables reuse across 8-bit and 16-bit microcontroller platforms without redesign.
How does the Secured Silicon Sector work in W29GL256PH9B?
The Secured Silicon Sector in W29GL256PH9B is a dedicated 256-byte region that can be permanently locked by the customer or pre-programmed and locked at the factory. Once locked, it cannot be erased or rewritten. It stores immutable identifiers such as electronic serial numbers or cryptographic keys - accessed only through specific Auto-Select commands. This feature ensures device authenticity and prevents cloning in regulated medical or industrial systems.
What is the purpose of the EVIO pin on W29GL256PH9B?
The EVIO (Enhanced Variable I/O) pin on W29GL256PH9B sets the voltage threshold for all address, control, and data I/O pins, ranging from 1.65 V to VCC. This allows the device to interface directly with mixed-voltage SoCs - for example, accepting 1.8 V address inputs while powered from 3.3 V - eliminating external level shifters and reducing BOM cost and board space in compact embedded designs.
Can W29GL256PH9B be used in deep power-down mode during system sleep?
Yes, W29GL256PH9B supports deep power-down mode with typical current draw ≤1 µA, activated via specific command sequence. In this mode, all internal circuitry is disabled except for the wake-up detection logic tied to #RESET or #CE. The memory contents remain fully retained, and exit to active mode occurs within tDPDH (≤100 µs) - making it ideal for battery-powered edge sensors and IoT nodes requiring multi-year operation on coin cells.
W29GL256PH9B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 64-LBGA
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8, 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 90ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-LFBGA (11x13)
W29GL256PH9B FAQ
1.How can I place an order for W29GL256PH9B through Aetrix?
Please submit a Request for Quotation (RFQ) for W29GL256PH9B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29GL256PH9B reliable?
The price and inventory of W29GL256PH9B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29GL256PH9B is usually 5 days.
3.What payment methods are accepted for W29GL256PH9B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29GL256PH9B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29GL256PH9B?
W29GL256PH9B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29GL256PH9B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29GL256PH9B?
For technical support, including W29GL256PH9B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29GL256PH9B requirements.
6.How does Aetrix verify that W29GL256PH9B is sourced from the original manufacturer or authorized distributors?
All W29GL256PH9B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29GL256PH9B meets industry standards.
7.What is the process for return or replacement of W29GL256PH9B?
All W29GL256PH9B units undergo pre-shipment inspection (PSI). If there is an issue with W29GL256PH9B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29GL256PH9B part is unused and in its original packaging.
Return procedure for W29GL256PH9B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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