Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Winbond Electronics Corporation W29GL256PH9T

Part No.:
W29GL256PH9T
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixW29GL256PH9T.pdf
Description:
IC FLASH 256MBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,461

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

W29GL256PH9T from Winbond is a 256-Mbit (32 MB) parallel NOR Flash memory IC with uniform 128-KB sectors, 90 ns random access time, 25 ns page access time, and single 3.0 V supply (2.7–3.6 V) operation. It supports page mode read, write buffer programming, sector/chip erase suspend/resume, and CFI interface - deployed in embedded boot code storage for industrial controllers and network edge devices.

For engineers reviewing the W29GL256PH9T datasheet, W29GL256PH9T pinout, W29GL256PH9T application, or W29GL256PH9T equivalent, key selection criteria include its TSOP-56 package, #BYTE-configurable x8/x16 bus interface, EVIO voltage-flexible I/O, hardware write protection via #WP/ACC, and deep power-down mode for low-idle-power systems.

Technical Context

This device implements a parallel asynchronous interface with dual-mode addressing: word mode (A23–A0, DQ15 active) and byte mode (A23–A−1, DQ15 repurposed as A−1). Its architecture features 256 uniform sectors (128 KB each), a 32-word (64-byte) write buffer, and an 8-word (16-byte) page read buffer.

Functional execution relies on command register programming with address/data sequences, supported by status polling (DQ7/DQ5) and RY/#BY signaling. Erase and program operations are fully embedded and interruptible via suspend/resume commands, while CFI mode enables host system auto-configuration of geometry and timing parameters.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 Mbit (32 MB), organized as 2,097,152 × 16-bit or 4,194,304 × 8-bit
Access Time 90 ns random read; enables fast CPU instruction fetch from boot ROM without wait states
Page Access Time 25 ns; allows burst reads of up to 16 bytes per page with minimal address setup overhead
Write Buffer Size 32 words (64 bytes); reduces total programming time for multi-word updates by >50% vs. byte-by-byte
Erase/Program Endurance 100,000 cycles; supports field firmware updates over 10+ years in industrial deployments
Data Retention 20 years at 85°C; ensures long-term reliability in unattended embedded systems
Operating Voltage 2.7–3.6 V single supply; compatible with 3.3 V logic rails and tolerant of brown-out conditions
Temperature Range −40°C to +85°C industrial grade; validated for use in factory automation and outdoor telecom equipment

Pinout & Package

W29GL256PH9T is packaged in a 56-pin TSOP-I (14 × 20 mm), RoHS-compliant, surface-mount package with standard lead pitch (0.5 mm). Pin assignment follows JEDEC MO-142AA mechanical outline.

Pin/Terminal Circuit Role Design Meaning
A0–A23 Address Inputs 24-bit address bus; A−1 reused as DQ15 in byte mode (#BYTE = VIL)
DQ0–DQ14 Bi-directional Data I/O Primary data path; high-impedance when #CE or #OE inactive
DQ15/A−1 Mode-dependent Terminal In word mode: data bit 15; in byte mode: LSB address bit A−1
#CE Chip Enable Active-low chip select; latches address on falling edge (with #WE)
#OE Output Enable Active-low output control; enables data drivers only when #CE also active
#WE Write Enable Active-low write strobe; latches data on rising edge (with #CE)
#WP/ACC Hardware Protect / Acceleration Low = protects first/last sector; high + VHH = accelerates programming
#BYTE Bus Width Select Low = x8 mode (DQ0–DQ7 active); high = x16 mode (DQ0–DQ15 active)
#RESET Hardware Reset Active-low synchronous reset; forces return to Read mode within tREADY1 (≤30 µs)
RY/#BY Ready/Busy Status Open-drain output; low = busy during erase/program; high = ready for next command
EVIO I/O Voltage Reference Defines input threshold and output swing (1.65 V to VCC); enables mixed-voltage system interfacing
VCC, VSS Power/Ground Single 3.0 V supply; decoupling required per AC specs (C = 0.1 µF + 4.7 µF)

Key Features

Feature Design Value
Uniform Sector Architecture 256 × 128 KB sectors enable deterministic erase scheduling and wear leveling in bootloader partitions
Enhanced Sector Protection Combines volatile DPB and non-volatile IPB modes - supports field-upgradeable lock/unlock without full chip erase
Secured Silicon Sector 256-byte factory-programmable region with electronic serial number; prevents cloning and enables secure device identity
Deep Power-Down Mode ICC4 ≤ 1 µA; reduces standby power by >99% vs. standby mode - critical for battery-backed systems
CFI Interface Support Standardized query table (JEDEC JESD68) allows automatic detection of geometry, timings, and vendor ID by host BIOS/firmware
Erase/Program Suspend Interrupts active sector erase or program to service high-priority reads/writes - avoids real-time latency violations

Applications

Industrial PLC Firmware Storage Network Router Boot Memory

Use Scenario: Stores boot loader, FPGA configuration bitstream, and real-time OS kernel in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Primary non-volatile boot memory with deterministic 90 ns read access and sector-level update capability.

Use Value: Enables in-field firmware upgrades without hardware replacement; 20-year data retention ensures lifecycle alignment with industrial equipment.

Use Scenario: Holds U-Boot, Linux kernel image, and configuration files in carrier-grade Ethernet routers requiring zero-downtime software patches.

IC Role / Device Role / Timing Role: Parallel NOR Flash providing direct XIP (eXecute-In-Place) execution support for boot code and critical firmware modules.

Use Value: Page mode read (25 ns) accelerates kernel load; write buffer programming cuts OTA update time by 60% vs. legacy flash.

Medical Imaging Device BIOS Smart Energy Meter Firmware

Use Scenario: Stores diagnostic firmware, calibration tables, and safety-critical boot code in FDA-regulated ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Certified industrial-grade Flash memory with traceable 100K-cycle endurance and locked security sector for regulatory audit logs.

Use Value: Secured Silicon Sector provides tamper-proof device serial number and calibration signature - satisfies IEC 62304 traceability requirements.

Use Scenario: Hosts AMI firmware, tariff tables, and cryptographic keys in ANSI C12.19-compliant smart meters deployed in utility substations.

IC Role / Device Role / Timing Role: High-reliability parallel Flash with deep power-down mode (1 µA) to extend battery life during grid outages.

Use Value: Hardware write protection (#WP/ACC) prevents accidental overwrite of billing parameters; EVIO support simplifies 1.8 V/3.3 V mixed-signal design.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL256S11TFI010 48-pin TSOP, 110 ns access, no EVIO, no deep power-down, CFI v1.3 Lacks page mode acceleration and low-power sleep; requires external voltage translation for mixed-voltage designs Choose for cost-sensitive legacy designs where 90 ns speed and 1 µA deep sleep are not required
MX29GL256ELXGI-90G 56-pin TSOP, 90 ns access, same sector size, but no write buffer or suspend/resume Cannot interrupt erase/program; lacks buffered programming - increases firmware update latency Choose only if CFI compatibility and security sector are unnecessary and system firmware handles all timing manually

Compared with S29GL256S11TFI010 and MX29GL256ELXGI-90G, W29GL256PH9T delivers faster page reads (25 ns), embedded suspend/resume for real-time responsiveness, and deep power-down for energy-constrained deployments - making it optimal for next-generation industrial and networking platforms.

Availability

W29GL256PH9T is available at Aetrix Electronics and suitable for industrial PLC firmware storage, network router boot memory, medical imaging BIOS, and smart energy meter firmware requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for W29GL256PH9T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and communications markets since 1987.

The W29GL series targets high-reliability embedded systems requiring fast parallel boot memory with advanced data protection, sector flexibility, and CFI-standard interoperability - designed specifically for mission-critical firmware storage.

FAQ

What is the pin-compatible replacement for W29GL256PH9T?

W29GL256PH9T has no documented pin-compatible replacement. Alternative parts like S29GL256S11TFI010 share the 56-pin TSOP footprint but differ in EVIO, deep power-down, and write buffer support. PCB layout reuse requires verification of #BYTE, #WP/ACC, and RY/#BY signal routing - no drop-in substitution is guaranteed without functional validation.

Does W29GL256PH9T support execute-in-place (XIP) operation?

Yes, W29GL256PH9T supports XIP directly from its parallel interface. With 90 ns random access and stable output enable timing (tOE ≤ 45 ns), it enables microcontrollers and MPUs to fetch instructions without copying to RAM - widely used in ARM Cortex-M and MIPS-based boot loaders.

How does the Enhanced Variable IO (EVIO) feature work on W29GL256PH9T?

EVIO on W29GL256PH9T sets input thresholds and output voltage levels based on the applied EVIO voltage (1.65 V to VCC). When EVIO = 1.8 V, inputs recognize 1.8 V logic; when EVIO = 3.3 V, it matches 3.3 V CMOS levels - eliminating level shifters in mixed-voltage SoC designs.

Can W29GL256PH9T be used in byte mode and word mode simultaneously?

No, W29GL256PH9T operates exclusively in one bus width mode at a time, selected by the #BYTE pin state: #BYTE = VIL enables x8 mode (DQ0–DQ7 active, A−1 = DQ15); #BYTE = VIH enables x16 mode (DQ0–DQ15 active, A23–A0 addressed). Mode switching requires full device reset.

What is the purpose of the Secured Silicon Sector in W29GL256PH9T?

The Secured Silicon Sector in W29GL256PH9T is a 256-byte factory-programmable region containing a unique 16-byte electronic serial number. It is permanently locked after programming and immune to erase commands - used for device authentication, anti-cloning, and regulatory traceability in medical and industrial systems.

W29GL256PH9T Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
32M x 8, 16M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
90ns
Access Time:
90 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

W29GL256PH9T FAQ

1.How can I place an order for W29GL256PH9T through Aetrix?

Please submit a Request for Quotation (RFQ) for W29GL256PH9T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W29GL256PH9T reliable?

The price and inventory of W29GL256PH9T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29GL256PH9T is usually 5 days.

3.What payment methods are accepted for W29GL256PH9T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29GL256PH9T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W29GL256PH9T?

W29GL256PH9T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W29GL256PH9T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W29GL256PH9T?

For technical support, including W29GL256PH9T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29GL256PH9T requirements.

6.How does Aetrix verify that W29GL256PH9T is sourced from the original manufacturer or authorized distributors?

All W29GL256PH9T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29GL256PH9T meets industry standards.

7.What is the process for return or replacement of W29GL256PH9T?

All W29GL256PH9T units undergo pre-shipment inspection (PSI). If there is an issue with W29GL256PH9T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W29GL256PH9T part is unused and in its original packaging.

Return procedure for W29GL256PH9T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

W29GL256PH9T Tags

  • W29GL256PH9T
  • W29GL256PH9T PDF
  • W29GL256PH9T Datasheet
  • W29GL256PH9T Specifications
  • W29GL256PH9T Images
  • Winbond Electronics Corporation
  • Winbond Electronics Corporation W29GL256PH9T
  • Buy W29GL256PH9T
  • W29GL256PH9T Price
  • W29GL256PH9T Distributor
  • W29GL256PH9T Supplier
  • W29GL256PH9T Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER