My Inquiry
My Account
Winbond Electronics Corporation W29GL256PH9T TR
- Part No.:
- W29GL256PH9T TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
W29GL256PH9T TR.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,817
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W29GL256PH9T TR from Winbond is a 256-Mbit (32 MB), 3.0-V parallel NOR Flash memory with uniform 128-KB sectors, 90 ns random access time, 25 ns page access time, and support for page-mode read, write-buffer programming, and CFI interface - deployed in embedded boot code storage and firmware update applications requiring deterministic timing and industrial-temperature reliability.
For engineers reviewing the W29GL256PH9T TR datasheet, W29GL256PH9T TR pinout, W29GL256PH9T TR application, or W29GL256PH9T TR equivalent, this page delivers verified package mapping (TSOP-56), confirmed sector architecture (256 × 128 KB), real-world erase/program endurance (>100,000 cycles), deep power-down mode operation, and hardware write protection via #WP/ACC - all critical for automotive ECU, industrial HMI, and network equipment design validation.
Technical Context
The W29GL256PH9T TR implements a parallel asynchronous interface with dual-mode data bus: word mode (DQ0–DQ15, A0–A23) and byte mode (DQ0–DQ7 + DQ15/A−1, A−1–A23). It uses EVIO (Enhanced Variable I/O) to scale input/output voltage thresholds dynamically between 1.65 V and VCC, enabling interoperability across mixed-voltage systems without level shifters.
Its embedded algorithms include accelerated program (with #WP/ACC = VHH), erase suspend/resume, and write buffer (32-word/64-byte) for burst programming. Sector protection combines volatile DPB, non-volatile IPB, and lock register control - with factory-programmable security sector (128-word/256-byte) supporting electronic serial number and secure identification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB) organized as 256 uniform 128-KB sectors - enables predictable partitioning for bootloader, OS, and application firmware. |
| Access Time | 90 ns random access; 25 ns page access - meets hard real-time boot latency requirements in microcontroller-based systems. |
| Write Buffer Size | 32-word (64-byte) buffer - reduces total programming time for multi-word updates by up to 5× versus single-word writes. |
| Erase Endurance | >100,000 program/erase cycles per sector - supports field firmware updates over 10+ years in industrial deployments. |
| Data Retention | >20 years at TA = 85°C - ensures long-term integrity of calibration data and configuration parameters. |
| Operating Voltage | 2.7 V to 3.6 V single supply - compatible with 3.3 V logic rails and tolerant of brown-out conditions during power sequencing. |
| Temperature Range | −40°C to +85°C industrial grade - qualified for use in automotive body control modules and outdoor telecom infrastructure. |
| Deep Power-Down Current | 10 µA max - enables ultra-low standby power in battery-backed or energy-harvesting edge devices. |
Pinout & Package
W29GL256PH9T TR is packaged in a 56-pin TSOP-I (14 mm × 20 mm, 0.5 mm pitch), compliant with JEDEC MO-141AC. Pin functions are electrically defined per Winbond's official pin description table and validated for industrial-level noise immunity and signal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus supporting full 32-MB addressing; A−1 reused as DQ15 in byte mode. |
| DQ0–DQ14 | Data I/O (bidirectional) | 15-bit data path; DQ15 functions as A−1 in byte mode (#BYTE = VIL) or DQ15 in word mode (#BYTE = VIH). |
| #CE | Chip Enable | Active-low chip select; controls device enable state and latches address on falling edge (with #WE). |
| #OE | Output Enable | Active-low output gate; places DQ pins in high-Z when deasserted, enabling bus sharing. |
| #WE | Write Enable | Active-low write strobe; latches data on rising edge and initiates command sequences. |
| #WP/ACC | Hardware Write Protect / Acceleration | Protects top/bottom sector when low; applies VHH to accelerate programming during production. |
| RY/#BY | Ready/Busy Status | Open-drain output indicating active erase/program cycle (low) or completion (high). |
| #RESET | Hardware Reset | Asynchronous reset input; forces return to Read mode within tREADY1 (max 30 µs) during operations. |
| EVIO | Enhanced Variable I/O Supply | Reference voltage for all I/O thresholds (1.65 V to VCC); eliminates need for external level translation. |
Key Features
| Feature | Design Value |
|---|---|
| Uniform 128-KB Sector Architecture | 256 identical sectors simplify firmware partitioning, OTA update management, and wear leveling in host software. |
| Page-Mode Read (16-byte pages) | Reduces instruction fetch latency in XIP (execute-in-place) applications by minimizing address setup overhead per access. |
| CFI (Common Flash Interface) Support | Enables automatic detection of geometry, vendor ID, and command sets - eliminating hardcoded flash drivers in BSPs. |
| Security Sector with Electronic Serial Number | Factory- or customer-lockable 256-byte region stores immutable device identity for secure boot and anti-cloning. |
| Hardware Write Protection + Lock Register | Prevents accidental overwrite of boot code or calibration data without software intervention or voltage cycling. |
| Erase/Program Suspend & Resume | Allows background firmware reads or interrupts during long erase cycles - essential for real-time system responsiveness. |
Applications
| Automotive ECU Boot Memory | Industrial HMI Firmware Storage |
|---|---|
|
Use Scenario: Stores boot loader and safety-critical firmware in engine control units where deterministic startup timing and radiation-tolerant nonvolatility are mandatory. IC Role / Device Role / Timing Role: Primary parallel NOR Flash for XIP execution and secure firmware authentication during cold boot. Use Value: 90 ns access time ensures sub-100 ms boot sequence; >100K erase cycles support 15-year vehicle lifecycle updates. |
Use Scenario: Holds GUI assets, configuration profiles, and application binaries in programmable logic controllers and human-machine interfaces operating in harsh factory environments. IC Role / Device Role / Timing Role: Nonvolatile firmware repository with hardware write protection to prevent corruption during power loss or ESD events. Use Value: Deep power-down mode (10 µA) extends battery backup runtime; industrial temperature rating guarantees uptime at 85°C ambient. |
| Network Equipment Configuration | Medical Device Calibration Storage |
|
Use Scenario: Stores MAC addresses, encryption keys, and board-specific configuration in enterprise switches and routers requiring field-upgradable settings. IC Role / Device Role / Timing Role: Secure parameter storage with protected security sector and lock-register enforced access control. Use Value: Factory-programmed 256-byte security sector provides tamper-resistant serial number and key binding. |
Use Scenario: Retains sensor calibration coefficients, regulatory compliance logs, and user preferences in portable diagnostic instruments with strict data integrity requirements. IC Role / Device Role / Timing Role: Long-term nonvolatile memory with >20-year data retention at elevated temperatures. Use Value: Verified 20+ year retention at 85°C ensures calibration validity across product service life without recalibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S11TFI010 | 48-pin TSOP, 110 ns access, no EVIO, CFI-compliant but lacks write buffer acceleration | Lower performance in burst programming; suitable for cost-sensitive legacy designs without deep power-down needs | Select when pin count reduction and legacy driver compatibility outweigh speed and power advantages |
| MX29GL256ELXGI-90G | 56-pin TSOP, 90 ns access, same sector size, but no security sector or lock register; requires external write protect | Lacks factory-lockable security region and hardware sector locking - increases host software complexity for secure boot | Choose only if security features are handled externally and EVIO voltage flexibility is unnecessary |
Compared with S29GL256S11TFI010 and MX29GL256ELXGI-90G, the W29GL256PH9T TR uniquely integrates EVIO voltage scaling, 32-word write buffer acceleration, and a factory-programmable security sector - delivering higher system-level reliability, lower BOM count, and simplified secure boot implementation in new designs.
Availability
W29GL256PH9T TR is available at Aetrix Electronics and suitable for automotive ECU boot memory, industrial HMI firmware storage, and network equipment configuration requiring stable component supply, long-lifecycle assurance, and traceable sourcing.
Supply support for W29GL256PH9T TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, RAM, and TrustME secure memory products.
The W29GL256PH9T TR belongs to Winbond's W29GL series of high-reliability parallel NOR Flash memories, designed specifically for embedded systems demanding fast boot, robust data retention, and hardware-enforced security in automotive, industrial, and networking applications.
FAQ
What is the pin count and package type of the W29GL256PH9T TR?
The W29GL256PH9T TR uses a 56-pin TSOP-I (Thin Small Outline Package) with 0.5 mm pitch and 14 mm × 20 mm footprint, as specified in Winbond's official package drawing (MO-141AC). This package is industry-standard for parallel NOR Flash and supports reflow soldering per J-STD-020. The W29GL256PH9T TR does not use LFBGA or other variants - the 'H9' suffix explicitly denotes the TSOP-56 configuration.
Does the W29GL256PH9T TR support both word and byte addressing modes?
Yes, the W29GL256PH9T TR supports dual addressing modes controlled by the #BYTE pin: when #BYTE = VIH, it operates in 16-bit word mode (A0–A23, DQ0–DQ15); when #BYTE = VIL, it operates in 8-bit byte mode (A−1–A23, DQ0–DQ7 + DQ15/A−1). This flexibility allows seamless integration with 8-bit and 16-bit microcontrollers without external glue logic.
How does the #WP/ACC pin function in the W29GL256PH9T TR?
The #WP/ACC pin on the W29GL256PH9T TR serves two distinct roles: as a hardware write protect (when pulled low) that locks the top or bottom 128-KB sector, and as an acceleration input (when driven to VHH ≈ 12 V) to reduce programming time by ~50%. Its dual functionality eliminates the need for separate protection and production programming circuitry in system design.
What is the purpose of the EVIO pin on the W29GL256PH9T TR?
The EVIO (Enhanced Variable I/O) pin on the W29GL256PH9T TR sets the voltage reference for all input thresholds (address, control, data) and output drive levels. With EVIO ranging from 1.65 V to VCC, the W29GL256PH9T TR automatically adapts to host logic voltages - enabling direct interfacing with 1.8 V, 2.5 V, or 3.3 V controllers without external level shifters or voltage translators.
Is the W29GL256PH9T TR compatible with Common Flash Interface (CFI)?
Yes, the W29GL256PH9T TR fully supports CFI mode per JEDEC JESD68-A. Entering CFI mode via the Auto Select command sequence allows host software to query device geometry, manufacturer ID, device ID, and command set programmatically - enabling generic flash drivers and eliminating hardcoded memory maps in bootloaders and firmware.
W29GL256PH9T TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8, 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 90ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
W29GL256PH9T TR FAQ
1.How can I place an order for W29GL256PH9T TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W29GL256PH9T TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29GL256PH9T TR reliable?
The price and inventory of W29GL256PH9T TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29GL256PH9T TR is usually 5 days.
3.What payment methods are accepted for W29GL256PH9T TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29GL256PH9T TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29GL256PH9T TR?
W29GL256PH9T TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29GL256PH9T TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29GL256PH9T TR?
For technical support, including W29GL256PH9T TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29GL256PH9T TR requirements.
6.How does Aetrix verify that W29GL256PH9T TR is sourced from the original manufacturer or authorized distributors?
All W29GL256PH9T TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29GL256PH9T TR meets industry standards.
7.What is the process for return or replacement of W29GL256PH9T TR?
All W29GL256PH9T TR units undergo pre-shipment inspection (PSI). If there is an issue with W29GL256PH9T TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29GL256PH9T TR part is unused and in its original packaging.
Return procedure for W29GL256PH9T TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29GL256PH9T TR Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
