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Winbond Electronics Corporation W29GL256PL9B
- Part No.:
- W29GL256PL9B
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 64-LBGA
- Datasheet:
-
W29GL256PL9B.pdf
- Description:
- IC FLASH 256MBIT PAR 64LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,188
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Product details
Overview
W29GL256PL9B from Winbond is a 256-Mbit (32 MB) parallel NOR Flash memory with uniform 128-KByte sectors, 90 ns random access time, and 25 ns page access time. It operates from a single 3.0 V supply (2.7–3.6 V), supports byte/word configuration via #BYTE pin, and integrates hardware write protection, deep power-down mode, and CFI-compliant interface for embedded boot code storage.
For engineers reviewing the W29GL256PL9B datasheet, W29GL256PL9B pinout, W29GL256PL9B application, or W29GL256PL9B equivalent, key selection criteria include sector architecture compatibility, EVIO voltage flexibility (1.65–VCC), RY/#BY status signaling, #WP/ACC acceleration support, and TSOP-56 packaging for legacy board designs.
Technical Context
This device implements a parallel asynchronous interface with dedicated control pins (#CE, #OE, #WE, #RESET, #WP/ACC, #BYTE) and dual-mode data bus (DQ0–DQ15 supporting both x16 word and x8 byte operation). Its architecture features 256 uniform sectors, each 128 KBytes, with individual sector lock registers and factory-programmable secured silicon sector (256 bytes).
Functional operation relies on instruction-based command sequences latched on falling #WE/#CE edges, with status monitored via DQ5 polling or RY/#BY pin. Embedded algorithms include accelerated programming (with VHH on #WP/ACC), erase suspend/resume, write buffer (32-word capacity), and CFI query mode for system-level identification and geometry detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MB) organized as 2,097,152 × 16-bit or 4,194,304 × 8-bit |
| Access Time | 90 ns random read; enables fast CPU instruction fetch in boot ROM applications |
| Page Access Time | 25 ns; supports high-throughput sequential reads within 16-byte pages |
| Write Buffer Size | 32 words (64 bytes); reduces total programming time for burst updates |
| Operating Voltage | 2.7–3.6 V single supply; compatible with 3.0 V system rails without level shifters |
| Data Retention | 20+ years at 85°C; ensures long-term firmware integrity in industrial deployments |
| Erase/Program Cycles | 100,000 minimum per sector; supports field firmware updates over product lifetime |
Pinout & Package
W29GL256PL9B is packaged in a 56-pin TSOP-I (14 × 20 mm), RoHS-compliant, surface-mount package with standard lead pitch and JEDEC-compliant footprint. Pin 1 is marked by a beveled corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus; A-1 multiplexed with DQ15 in byte mode |
| DQ0–DQ14 | Data I/O (x16/x8) | Bidirectional data bus; DQ15 functions as A-1 in byte mode (#BYTE = L) |
| #CE | Chip Enable | Active-low chip select; controls device enable for multi-chip memory maps |
| #OE | Output Enable | Active-low output gate; enables tri-state data bus during read operations |
| #WE | Write Enable | Active-low write strobe; latches address/data on falling edge for command execution |
| #WP/ACC | Write Protect / Acceleration | Hardware sector lock when low; applies VHH to accelerate programming during production |
| #BYTE | Bus Width Select | High = x16 word mode (A23–A0); Low = x8 byte mode (A23–A-1, DQ15 = A-1) |
| #RESET | Hardware Reset | Active-low synchronous reset; forces return to Read mode regardless of ongoing operation |
| RY/#BY | Ready/Busy Status | Open-drain active-low signal indicating completion of program/erase cycles |
| EVIO | Enhanced Variable I/O Supply | Reference voltage (1.65–VCC) setting input/output logic levels for all pins |
| VCC, VSS | Power & Ground | Single 3.0 V supply; decoupling required per datasheet layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Uniform Sector Architecture | 256 × 128 KByte sectors enable deterministic erase scheduling and simplified BOM management |
| Secured Silicon Sector | 256-byte factory- or customer-lockable region for immutable serial numbers or security keys |
| Enhanced Sector Protection | Dynamic (volatile) and individual (non-volatile) lock bits per sector prevent accidental firmware overwrite |
| Deep Power-Down Mode | ICC < 1 µA; extends battery life in always-on embedded systems between firmware updates |
| CFI Interface Support | Standardized query mode allows automatic detection of geometry, timing, and vendor ID by host BIOS/bootloader |
| Write Buffer Programming | 32-word buffer reduces average programming time by >50% vs. single-word writes in firmware patching |
Applications
| Industrial PLC Firmware Storage | Automotive Instrument Cluster Boot ROM |
|---|---|
|
Use Scenario: Storing real-time control firmware in programmable logic controllers operating continuously at 85°C ambient. IC Role / Device Role / Timing Role: Primary non-volatile boot memory providing deterministic 90 ns instruction fetch latency to ARM Cortex-M7 MCU. Use Value: 20-year data retention and 100K erase cycles ensure firmware integrity across 15+ year product lifecycles without field replacement. |
Use Scenario: Hosting calibrated display graphics and safety-critical boot code in automotive digital dashboards. IC Role / Device Role / Timing Role: Parallel NOR Flash serving as XIP (eXecute-In-Place) memory for Renesas RH850 microcontroller. Use Value: Page-mode 25 ns access accelerates GUI rendering; secured silicon sector stores unique VIN-linked calibration data. |
| Medical Imaging System Configuration | Telecom Base Station Boot Loader |
|
Use Scenario: Holding FPGA configuration bitstreams and regulatory-compliant calibration tables in portable ultrasound devices. IC Role / Device Role / Timing Role: Configuration storage with hardware write protection preventing unauthorized parameter modification. Use Value: #WP/ACC pin enables production-line acceleration (VHH) while locking critical sectors post-calibration. |
Use Scenario: Storing dual-image bootloader and field-upgradable protocol stacks in LTE macro base stations. IC Role / Device Role / Timing Role: High-reliability boot memory supporting fail-safe A/B firmware partitioning and rollback. Use Value: Erase suspend/resume allows background firmware update without interrupting RF transmission. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256P11TFIR10 | Same density, 110 ns access, 64-ball LFBGA only; no TSOP option; lacks EVIO pin | Requires PCB redesign for BGA; incompatible with legacy TSOP footprints | Select only if migrating to BGA and accepting slower access time |
| MX29GL256ELXGI-90G | 90 ns access, TSOP-56, but only 100K cycles and no secured silicon sector | Lower endurance and missing secure storage limits use in regulated medical/automotive systems | Acceptable for cost-sensitive consumer applications without security or long-life requirements |
Compared with S29GL256P11TFIR10 and MX29GL256ELXGI-90G, W29GL256PL9B uniquely combines TSOP-56 compatibility, EVIO voltage flexibility, secured silicon sector, and 100K-cycle endurance - making it optimal for industrial and automotive designs requiring drop-in legacy footprint support and firmware security.
Availability
W29GL256PL9B is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive instrument cluster boot ROM, medical imaging system configuration, and telecom base station boot loader applications requiring stable component supply across extended product lifecycles.
Supply support for W29GL256PL9B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash and SRAM, with global manufacturing and quality certifications.
The W29GL series targets embedded systems requiring robust, pin-compatible parallel Flash for boot code and firmware storage, emphasizing reliability, security, and industrial temperature operation.
FAQ
What is the package type and pin count of the W29GL256PL9B?
The W29GL256PL9B uses a 56-pin TSOP-I (Thin Small Outline Package) with 14 mm × 20 mm body dimensions and standard JEDEC-compliant lead pitch. This package is fully compatible with legacy board layouts designed for parallel Flash memory and supports surface-mount reflow assembly without special tooling.
Does the W29GL256PL9B support both x8 and x16 data bus configurations?
Yes, the W29GL256PL9B supports configurable bus width via the #BYTE pin: when #BYTE = VIH, it operates in 16-bit word mode using A23–A0 addresses and DQ0–DQ15; when #BYTE = VIL, it operates in 8-bit byte mode using A23–A-1 (with DQ15 repurposed as A-1) and DQ0–DQ7. This flexibility simplifies integration across multiple host processor interfaces.
How does the #WP/ACC pin function in the W29GL256PL9B?
The #WP/ACC pin serves two roles in the W29GL256PL9B: as a hardware write protect signal (active-low) that locks the first or last sector regardless of software protection settings, and as an acceleration input - applying VHH (12 V) during programming reduces write time significantly. This dual functionality enables both field safety and high-throughput production programming.
What is the purpose of the EVIO pin on the W29GL256PL9B?
The EVIO (Enhanced Variable I/O) pin on the W29GL256PL9B sets the reference voltage for all input thresholds and output drive levels, ranging from 1.65 V to VCC. This allows seamless interfacing with mixed-voltage systems (e.g., 1.8 V I/O controllers) without external level shifters, reducing BOM cost and layout complexity while maintaining signal integrity.
Can the W29GL256PL9B be used in systems requiring firmware security features?
Yes, the W29GL256PL9B includes a dedicated secured silicon sector (256 bytes) that can be permanently locked by the customer or pre-programmed and protected at factory. Combined with enhanced sector protection (individual non-volatile lock bits) and hardware write protection via #WP/ACC, it provides layered security for storing cryptographic keys, serial numbers, or calibration data in regulated applications.
W29GL256PL9B Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 64-LBGA
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8, 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 90ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 64-LFBGA (11x13)
W29GL256PL9B FAQ
1.How can I place an order for W29GL256PL9B through Aetrix?
Please submit a Request for Quotation (RFQ) for W29GL256PL9B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29GL256PL9B reliable?
The price and inventory of W29GL256PL9B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29GL256PL9B is usually 5 days.
3.What payment methods are accepted for W29GL256PL9B?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29GL256PL9B transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29GL256PL9B?
W29GL256PL9B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29GL256PL9B order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29GL256PL9B?
For technical support, including W29GL256PL9B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29GL256PL9B requirements.
6.How does Aetrix verify that W29GL256PL9B is sourced from the original manufacturer or authorized distributors?
All W29GL256PL9B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29GL256PL9B meets industry standards.
7.What is the process for return or replacement of W29GL256PL9B?
All W29GL256PL9B units undergo pre-shipment inspection (PSI). If there is an issue with W29GL256PL9B, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29GL256PL9B part is unused and in its original packaging.
Return procedure for W29GL256PL9B:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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