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Winbond Electronics Corporation W29GL256SH9T

Part No.:
W29GL256SH9T
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
56-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixW29GL256SH9T.pdf
Description:
IC FLASH 256MBIT PARALLEL 56TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,581

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Product details

Overview

W29GL256SH9T from Winbond is a 256-Mbit (32-MByte), x16 parallel NOR Flash memory with 3.0 V single-supply operation (2.7–3.6 V), 90 ns random access time, 15 ns page access time, and 128-kbyte uniform sector architecture. It supports Write Buffer Programming (up to 512 bytes), Enhanced Variable I/O (EVIO: 1.65 V to VCC), and CFI-compliant interface for embedded boot code and data storage in industrial controllers and network equipment.

For engineers reviewing the W29GL256SH9T datasheet, W29GL256SH9T pinout, W29GL256SH9T application, or W29GL256SH9T equivalent, key selection criteria include sector erase granularity, EVIO voltage flexibility, hardware write protection via #WP, Ready/Busy status signaling, and compatibility with legacy parallel bus microcontroller interfaces requiring deterministic timing and non-volatility.

Technical Context

The W29GL256SH9T implements a dual-state machine architecture: Command State Machine (CSM) handles address/data latching and I/O control during read/write transfers, while the Write State Controller executes internal algorithms (program/erase) and monitors status via Status Register, Data Polling (DQ7), or RY/#BY output. All operations are asynchronous and require no clock input.

It features uniform 128-kbyte sectors (2048 total), supports both volatile (Dynamic Protection Bits) and non-volatile (Individual Protection Bits) sector locking, includes a 1024-byte OTP security region split into two 512-byte lockable blocks, and guarantees ≥100,000 program/erase cycles with 20-year data retention at +85°C.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 256 Mbit (32 MByte), organized as 2,097,152 × 16-bit words - enables full firmware image storage without external memory expansion.
Access Time 90 ns random access, 15 ns page access - meets real-time boot latency requirements for ARM9/Cortex-M3-based systems.
Write Buffer Size 256 words (512 bytes) per buffer programming operation - reduces effective programming time by ~4× vs. single-word writes.
Supply Voltage VCC = 2.7–3.6 V; EVIO = 1.65 V to VCC - allows direct interfacing with 1.8 V or 3.3 V I/O domains without level shifters.
Operating Temp −40°C to +85°C - qualified for industrial-grade deployment in programmable logic controllers and telecom line cards.
Erase Cycles ≥100,000 program/erase cycles per sector - supports field firmware updates over 10+ years of service life.
Data Retention 20 years typical at +85°C - ensures long-term reliability in unattended remote monitoring devices.

Pinout & Package

W29GL256SH9T is packaged in a 56-pin TSOP (14 × 20 mm, standard thickness) with lead-free finish and RoHS compliance. Pin functions are electrically defined and mechanically fixed per JEDEC MO-142AA.

Pin/Terminal Circuit Role Design Meaning
A0–A23 Address Inputs 24-bit address bus supporting full 32-MByte addressing; A0–A1 select byte within 16-bit word.
DQ0–DQ15 Data I/O x16 bidirectional data bus; supports true read-modify-write and page-aligned burst reads.
#CE Chip Enable Active-low chip select; device enters standby when high - enables multi-chip memory expansion.
#OE Output Enable Active-low output gate; controls data bus drive during read - allows shared bus arbitration.
#WE Write Enable Active-low write strobe; initiates command latching or data transfer - synchronizes write timing with host bus.
#WP Hardware Write Protect Active-low sector lock enable; protects top/bottom 128-kbyte sectors from accidental erase/write.
RY/#BY Ready/Busy Output Open-drain status indicator; LOW = active algorithm (erase/program), HIGH-Z = ready - supports wired-OR multi-device polling.
#RESET Hardware Reset Active-low asynchronous reset; forces device into read mode and aborts ongoing algorithms.
EVIO I/O Supply Independent voltage rail for DQ pins; decouples I/O logic from core VCC - enables mixed-voltage system integration.
VCC / VSS Power / Ground Core supply (2.7–3.6 V) and ground; separate from EVIO - improves noise immunity and signal integrity.

Key Features

Feature Design Value
Enhanced Variable I/O (EVIO) Supports 1.65 V to VCC I/O voltage range - eliminates need for external level shifters when interfacing with 1.8 V FPGAs or microcontrollers.
Write Buffer Programming 256-word (512-byte) buffer enables single-command programming of full page - cuts firmware update time by >75% vs. byte-by-byte writes.
Uniform Sector Architecture 2048 × 128-kbyte sectors - simplifies BOM management and enables fine-grained firmware partitioning (e.g., bootloader + app + config).
Security Sector Region 1024-byte OTP area with dual 512-byte lockable regions - stores cryptographic keys or calibration data that cannot be overwritten after programming.
Suspend/Resume Commands Allows interrupting erase or program operations to service higher-priority reads - essential for real-time OS environments with strict latency budgets.

Applications

Industrial PLC Firmware Storage Network Router Boot Code

Use Scenario: Storing boot firmware and configuration tables in DIN-rail mounted programmable logic controllers operating in factory-floor environments with wide temperature swings and EMI exposure.

IC Role / Device Role / Timing Role: Non-volatile boot memory mapped directly to microcontroller address space; provides deterministic 90 ns read latency for fast startup and real-time instruction fetch.

Use Value: Uniform 128-kbyte sectors allow independent update of application logic without disturbing bootloader; EVIO rail enables direct connection to 1.8 V FPGA co-processors.

Use Scenario: Holding primary boot loader and fail-safe recovery image in enterprise-grade Layer 3 routers requiring zero-downtime firmware upgrades and secure key storage.

IC Role / Device Role / Timing Role: Parallel NOR Flash used in XIP (eXecute-In-Place) mode; supports simultaneous read and suspend/resume for background firmware validation.

Use Value: 1024-byte OTP region stores RSA private keys; hardware #WP pin prevents corruption of top-sector bootloader during power-loss events.

Medical Diagnostic Imaging UI Automotive ADAS Camera Module

Use Scenario: Hosting GUI assets, calibration profiles, and regulatory-compliant audit logs in portable ultrasound machines certified to IEC 62304 Class C.

IC Role / Device Role / Timing Role: Persistent storage for critical human-interface data; accessed via 16-bit parallel bus on ARM Cortex-A53 SoC with tight boot-time constraints.

Use Value: ≥100,000 erase cycles support daily recalibration logging over 10+ years; CFI interface enables automatic driver detection across product generations.

Use Scenario: Storing camera sensor initialization parameters, lens distortion maps, and ASIL-B compliant firmware patches in automotive surround-view camera modules.

IC Role / Device Role / Timing Role: Boot-critical flash memory operating at −40°C to +85°C; integrated #RESET and RY/#BY signals simplify safety-monitoring circuitry.

Use Value: Suspend/resume capability allows interruption of firmware patching to process urgent CAN FD alerts; sector protection isolates safety-critical code from user-updatable regions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar parallel NOR Flash applications.

Alternative Part Technical Difference Application Difference Selection Advice
S29GL256S11TFI010 Same density and pinout; requires 3.0 V ±10% VCC only (no EVIO); lacks OTP security region. No dedicated 1024-byte OTP block - unsuitable for key storage; identical sector protection and timing. Select when EVIO flexibility and cryptographic key storage are not required; lower cost in high-volume industrial designs.
MX29GL256FHT2I-90G 90 ns access, but uses 48-pin TSOP; no EVIO; supports CFI but omits suspend/resume commands. Lacks program/erase suspend capability - limits use in real-time multitasking systems; smaller package saves board area. Choose for space-constrained designs where deterministic interrupt latency is less critical than footprint reduction.

Compared with S29GL256S11TFI010 and MX29GL256FHT2I-90G, the W29GL256SH9T uniquely combines EVIO voltage adaptability, integrated OTP security, and full suspend/resume functionality - making it optimal for safety-aware, mixed-voltage, and field-upgradable embedded systems.

Availability

W29GL256SH9T is available at Aetrix Electronics and suitable for industrial automation, networking infrastructure, and medical imaging applications requiring stable component supply, long lifecycle support, and guaranteed RoHS-compliant manufacturing.

Supply support for W29GL256SH9T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, communications, and consumer markets since 1987.

The W29GL series targets high-reliability embedded systems requiring robust parallel NOR Flash with advanced data protection, extended temperature operation, and CFI-standardized firmware portability across microcontroller platforms.

FAQ

What is the maximum supported I/O voltage for W29GL256SH9T?

The W29GL256SH9T supports Enhanced Variable I/O (EVIO) from 1.65 V up to VCC, where VCC ranges from 2.7 V to 3.6 V. This allows direct interfacing with 1.8 V logic families without external level shifters. The EVIO pin must be supplied independently from VCC, and its voltage must always be ≤ VCC. This feature is confirmed in Section 2 (Features) and Table 9-3 (DC Characteristics) of the datasheet.

Does W29GL256SH9T support suspend/resume during erase or program operations?

Yes, the W29GL256SH9T supports both Program Suspend/Resume and Erase Suspend/Resume commands as defined in Sections 8.7 and 8.9 of the datasheet. These allow interruption of active internal algorithms to service time-critical read requests, then resumption from the exact point of suspension. This capability is essential for real-time operating systems and is implemented in hardware via the Write State Controller.

What package type is used for W29GL256SH9T?

W29GL256SH9T uses a 56-pin TSOP (Thin Small Outline Package) with dimensions 14 mm × 20 mm, per JEDEC MO-142AA. This is explicitly listed in Section 11.1 and Figure 3-2 of the datasheet. The "H9T" suffix in the part number denotes this specific TSOP variant, distinguishing it from TFBGA56 and LFBGA64 alternatives.

How many sectors does W29GL256SH9T have, and what is their size?

The W29GL256SH9T contains 2048 uniform sectors, each 128 kbytes (262,144 bytes) in size, totaling 256 Mbits. This architecture is documented in Section 7.1 (Flash Main Memory Array), Table 7-1 (Sector and Memory Address Map), and Section 8.8.2 (Sector Erase). Sector boundaries are aligned to 128-kbyte offsets, enabling precise firmware partitioning.

Is there a one-time programmable (OTP) region in W29GL256SH9T?

Yes, W29GL256SH9T includes a dedicated 1024-byte Security Sector Region divided into two 512-byte lockable OTP blocks, as specified in Section 8.12 and Table 8-4. Once programmed and locked, these regions cannot be erased or rewritten - making them suitable for storing cryptographic keys, calibration constants, or device-unique identifiers in secure applications.

W29GL256SH9T Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
56-TFSOP (0.724", 18.40mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
256Mbit
Memory Organization:
16M x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
90ns
Access Time:
90 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSOP

W29GL256SH9T FAQ

1.How can I place an order for W29GL256SH9T through Aetrix?

Please submit a Request for Quotation (RFQ) for W29GL256SH9T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W29GL256SH9T reliable?

The price and inventory of W29GL256SH9T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29GL256SH9T is usually 5 days.

3.What payment methods are accepted for W29GL256SH9T?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29GL256SH9T transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W29GL256SH9T?

W29GL256SH9T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W29GL256SH9T order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W29GL256SH9T?

For technical support, including W29GL256SH9T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29GL256SH9T requirements.

6.How does Aetrix verify that W29GL256SH9T is sourced from the original manufacturer or authorized distributors?

All W29GL256SH9T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29GL256SH9T meets industry standards.

7.What is the process for return or replacement of W29GL256SH9T?

All W29GL256SH9T units undergo pre-shipment inspection (PSI). If there is an issue with W29GL256SH9T, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W29GL256SH9T part is unused and in its original packaging.

Return procedure for W29GL256SH9T:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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