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Winbond Electronics Corporation W29GL256SH9T TR
- Part No.:
- W29GL256SH9T TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
W29GL256SH9T TR.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:2,635
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Product details
Overview
W29GL256SH9T TR from Winbond is a 256-Mbit (32-MByte), x16 parallel NOR Flash memory with 3.0-V operation, 128-kbyte uniform sector architecture, 90 ns random access time, and 15 ns page access time. It supports asynchronous read, write buffer programming (up to 512 bytes), sector/chip erase, and hardware write protection via #WP pin. Used in industrial control firmware storage where deterministic timing and long-term data retention are required.
For engineers reviewing the W29GL256SH9T TR datasheet, W29GL256SH9T TR pinout, W29GL256SH9T TR application, or W29GL256SH9T TR equivalent, key selection criteria include TSOP-56 package compatibility, EVIO voltage range (1.65 V to VCC), Ready/#Busy status signaling, CFI compliance for firmware abstraction, and OTP security sector support.
Technical Context
The W29GL256SH9T TR implements a Command State Machine (CSM) and Write State Controller architecture to manage embedded algorithms for program/erase operations. Its internal logic separates command interpretation from execution, enabling suspend/resume functionality during both programming and erasing.
It uses 58 nm process technology and supports Enhanced Variable I/O (EVIO), allowing I/O voltage (EVIO) to operate independently from VCC across 1.65 V to VCC. The device features CFI-compliant autoselect mode, status register polling, Data# polling, and RY/#BY output for real-time algorithm monitoring.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MByte), organized as 2,097,152 × 16-bit words |
| Access Time | 90 ns random access; 15 ns page access - enables fast firmware boot and XIP execution |
| Write Buffer Size | 256 words (512 bytes) - reduces effective programming time vs. single-word writes |
| Sector Size | Uniform 128 kbyte sectors (256 sectors total) - simplifies firmware partitioning and OTA update design |
| Endurance & Retention | ≥100,000 program/erase cycles; 20-year data retention - suitable for industrial field-deployed systems |
| Supply Voltage | VCC = 2.7 V to 3.6 V; EVIO = 1.65 V to VCC - supports mixed-voltage host interfaces |
| Operating Temp | –40 °C to +85 °C - qualified for extended industrial temperature environments |
Pinout & Package
W29GL256SH9T TR is packaged in a 56-pin TSOP (14 × 20 mm), compliant with standard JEDEC MO-141B. Pin assignments match Figure 3-2 and Table 5-1 of the official datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus supporting full 32-MByte addressing space |
| DQ0–DQ15 | Data I/O | x16 bidirectional data bus; all reads/writes transfer 16 bits per cycle |
| #CE | Chip Enable | Active-low chip select; enables device for read/write when asserted |
| #OE | Output Enable | Controls output buffer; disables outputs (HIGH-Z) when deasserted |
| #WE | Write Enable | Controls direction of DQ bus; initiates write when low during #CE/#OE active |
| #WP | Hardware Write Protect | Locks top/bottom 128-kbyte sectors when pulled low; non-volatile IPB/DPB override possible |
| RY/#BY | Ready/Busy Output | Open-drain output indicating algorithm progress (VIL = busy); requires external pull-up |
| #RESET | Hardware Reset | Resets internal state machine to standby; exits deep power-down or aborts ongoing operation |
| EVIO | I/O Supply | Independent I/O voltage rail; decouples interface signaling from core VCC supply |
| VCC / VSS | Power / Ground | Core logic supply (2.7–3.6 V) and ground reference for all internal circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Write Buffer Programming | Enables 512-byte burst writes in one command - cuts firmware update time by >70% vs. word-by-word |
| Enhanced Sector Protection (ESP) | Combines volatile (DPB) and non-volatile (IPB/Lock Register) methods per sector - supports secure bootloader partitioning |
| Security Sector Region | 1024-byte OTP array split into two 512-byte lockable regions - stores immutable keys or calibration data |
| Suspend/Resume Support | Allows interrupting program/erase to service high-priority reads - critical for real-time OS coexistence |
| CFI Compliance | Full Common Flash Interface implementation - enables vendor-agnostic flash abstraction layer (FAL) in BSPs |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Code |
|---|---|
|
Use Scenario: Storing firmware and configuration data in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic 90 ns read latency for fast startup and runtime XIP execution. Use Value: 20-year data retention and 100K-cycle endurance ensure reliable operation over 10+ years without field replacement. |
Use Scenario: Holding certified boot loader and safety-critical application code in FDA-regulated diagnostic imaging equipment. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage using OTP security sector and hardware #WP for boot integrity enforcement. Use Value: IPB-based sector locking prevents unauthorized modification of boot code during service or upgrade procedures. |
| Automotive Infotainment Head Unit | Telecom Base Station Configuration |
|
Use Scenario: Hosting UI firmware, voice recognition models, and regional language packs in automotive infotainment systems. IC Role / Device Role / Timing Role: High-speed page-mode read (15 ns) accelerates GUI asset loading and menu navigation responsiveness. Use Value: EVIO support (1.65 V to VCC) allows direct interfacing with 1.8 V SoC I/O while maintaining 3.3 V core operation. |
Use Scenario: Storing FPGA bitstreams, radio calibration tables, and protocol stack parameters in 5G remote radio units. IC Role / Device Role / Timing Role: Sector-erase granularity (128 kbyte) enables atomic updates of individual functional modules without full reflash. Use Value: RY/#BY status output enables precise synchronization of firmware updates with RF transmission windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR Flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S11TFI010 | Same density, x16 interface, but uses 48-pin TSOP and lacks EVIO support; max VCC = 3.6 V only | No independent I/O rail - requires matched host I/O voltage; no 1.65 V low-voltage interface capability | Select when legacy board layout uses 48-pin footprint and host operates at fixed 3.3 V I/O |
| MX29GL256ELXGI-90G | Identical 56-pin TSOP package and pinout; same 90 ns access, but only supports VCC = 2.7–3.6 V (no EVIO) | Lacks Enhanced Variable I/O - cannot interface with sub-2.7 V host I/O without level shifters | Choose for cost-sensitive designs where EVIO is unused and CFI compatibility is sufficient |
Compared with W29GL256SH9T TR, S29GL256S11TFI010 requires PCB redesign due to 48-pin footprint mismatch, while MX29GL256ELXGI-90G offers pin compatibility but forfeits the design flexibility of independent EVIO voltage scaling.
Availability
W29GL256SH9T TR is available at Aetrix Electronics and suitable for industrial control firmware storage, medical device boot code, automotive infotainment, and telecom base station configuration requiring stable component supply across extended product lifecycles.
Supply support for W29GL256SH9T TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and communications markets.
The W29GL series targets high-reliability embedded systems needing fast parallel NOR Flash with advanced protection, suspend/resume, and CFI-standardized firmware abstraction - optimized for firmware code storage and execution-in-place (XIP).
FAQ
What is the package type and pin count of the W29GL256SH9T TR?
The W29GL256SH9T TR uses a 56-pin TSOP (Thin Small Outline Package) with 14 mm × 20 mm dimensions, per JEDEC MO-141B. This matches the pinout shown in Figure 3-2 of the official datasheet and supports standard socketed or soldered mounting in industrial PCB layouts.
Does the W29GL256SH9T TR support Execute-in-Place (XIP) operation?
Yes, the W29GL256SH9T TR supports XIP through its fast 90 ns random access and 15 ns page-mode read capabilities. Its architecture allows direct CPU instruction fetch from flash without copying to RAM, reducing boot time and memory overhead in resource-constrained embedded systems.
How does hardware write protection work on the W29GL256SH9T TR?
The W29GL256SH9T TR implements hardware write protection via the #WP pin: pulling #WP low locks the top and bottom 128-kbyte sectors. This protection is reinforced by non-volatile Individual Protection Bits (IPB) and volatile Dynamic Protection Bits (DPB), enabling layered security for boot code and configuration data.
What is the function of the EVIO pin on the W29GL256SH9T TR?
The EVIO pin on the W29GL256SH9T TR supplies an independent I/O voltage rail ranging from 1.65 V to VCC. This allows the device to interface directly with low-voltage host processors (e.g., 1.8 V SoCs) while maintaining full 3.3 V core operation - eliminating external level shifters in mixed-voltage designs.
Can the W29GL256SH9T TR be used in extended temperature applications?
Yes, the W29GL256SH9T TR is rated for operation from –40 °C to +85 °C, making it suitable for extended industrial environments such as factory automation, outdoor telecom infrastructure, and transportation control systems where ambient thermal stress is significant.
W29GL256SH9T TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 90ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
W29GL256SH9T TR FAQ
1.How can I place an order for W29GL256SH9T TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W29GL256SH9T TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29GL256SH9T TR reliable?
The price and inventory of W29GL256SH9T TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29GL256SH9T TR is usually 5 days.
3.What payment methods are accepted for W29GL256SH9T TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29GL256SH9T TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29GL256SH9T TR?
W29GL256SH9T TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29GL256SH9T TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29GL256SH9T TR?
For technical support, including W29GL256SH9T TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29GL256SH9T TR requirements.
6.How does Aetrix verify that W29GL256SH9T TR is sourced from the original manufacturer or authorized distributors?
All W29GL256SH9T TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29GL256SH9T TR meets industry standards.
7.What is the process for return or replacement of W29GL256SH9T TR?
All W29GL256SH9T TR units undergo pre-shipment inspection (PSI). If there is an issue with W29GL256SH9T TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29GL256SH9T TR part is unused and in its original packaging.
Return procedure for W29GL256SH9T TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29GL256SH9T TR Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24AA02UIDT-I/OT
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