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Winbond Electronics Corporation W29GL256SL9C
- Part No.:
- W29GL256SL9C
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 56-TFBGA
- Datasheet:
-
W29GL256SL9C.pdf
- Description:
- IC FLASH 256MBIT PAR 56TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,402
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Product details
Overview
W29GL256SL9C from Winbond is a 256-Mbit (32-MByte), x16 parallel NOR Flash memory with 3.0 V single-supply operation, 90 ns random access time, 15 ns page access time, and 256-word (512-byte) write buffer programming. It implements uniform 128-kByte sectors, CFI compliance, and Enhanced Sector Protection for embedded boot code and firmware storage in industrial controllers and network edge devices.
For engineers reviewing the W29GL256SL9C datasheet, W29GL256SL9C pinout, W29GL256SL9C application, or W29GL256SL9C equivalent, key selection criteria include sector erase granularity, EVIO voltage range (1.65 V to VCC), Ready/#Busy status signaling, hardware write protection via #WP, and compatibility with legacy 16-bit parallel bus interfaces in space-constrained industrial designs.
Technical Context
The W29GL256SL9C integrates a Command State Machine (CSM) and Write State Controller to manage asynchronous read/write/erase algorithms independently. Its architecture supports Page Mode reads (32-byte aligned pages) with sub-30 ns intra-page access and full-sector (128 kByte) or chip-wide erasure - all without external high-voltage supplies.
It uses 58 nm process technology and features dual power domains: VCC (2.7–3.6 V) for core logic and EVIO (1.65–VCC) for I/O buffering, enabling interoperability with mixed-voltage host systems. Status reporting is implemented via three concurrent methods: Status Register, Data# Polling (DQ7), and RY/#BY output pin.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MByte), organized as 2,097,152 × 16-bit words |
| Access Time | 90 ns random access; 15 ns page access - enables fast XIP execution and low-latency firmware fetch |
| Write Buffer Size | 256 words (512 bytes) - reduces effective programming time by batching writes without host intervention |
| Sector Size | Uniform 128 kByte sectors (256 sectors total) - simplifies firmware partitioning and field update management |
| Supply Voltage | VCC = 2.7–3.6 V; EVIO = 1.65 V to VCC - supports interface voltage scaling and mixed-signal board design |
| Data Retention | 20 years typical - ensures long-term reliability in unattended industrial deployments |
| Erase/Program Cycles | 100,000 cycles minimum per sector - validated for frequent firmware updates in gateway applications |
Pinout & Package
W29GL256SL9C is packaged in a 56-pin TSOP (14 × 20 mm) with standard parallel interface layout. Pin functions are electrically defined and mechanically fixed per JEDEC MO-142AC; no alternate pinouts apply to this specific ordering variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus supporting full 32-MByte addressing; A0–A1 select lower/upper byte in x16 mode |
| DQ0–DQ15 | Data I/O | 16-bit bidirectional data bus; supports true x16 parallel transfers without multiplexing |
| #CE | Chip Enable | Active-low device select; enables low-power standby when deasserted |
| #OE | Output Enable | Controls output driver state during read; allows shared bus arbitration |
| #WE | Write Enable | Controls direction of DQ bus and initiates internal write/erase algorithms |
| #WP | Hardware Write Protect | Locks top/bottom 128-kByte sectors permanently when pulled low at power-up |
| RY/#BY | Ready/Busy Output | Open-drain status indicator; LOW = active algorithm (erase/program), HIGH-Z = ready - requires external pull-up |
| #RESET | Hardware Reset | Aborts ongoing algorithms and returns device to read-ready state within 100 ns |
| EVIO | I/O Supply | Independent voltage rail for DQ pins; decouples I/O timing from core VCC, enabling 1.65–3.6 V interface flexibility |
Key Features
| Feature | Design Value |
|---|---|
| Enhanced Variable I/O (EVIO) | Supports 1.65 V to VCC I/O voltage range - eliminates level shifters when interfacing with 1.8 V or 2.5 V microcontrollers |
| Write Buffer Programming | 512-byte buffer enables single-command multi-word writes - cuts typical firmware update time by >60% vs. word-by-word programming |
| Enhanced Sector Protection (ESP) | Combines non-volatile IPB, volatile DPB, and lock register - allows runtime reconfiguration of protected regions without permanent commitment |
| Security Sector Region | 1024-byte OTP area split into two 512-byte lockable blocks - stores cryptographic keys or calibration data with irreversible write-once security |
| Suspend/Resume Capability | Interrupts active erase or program operations to service higher-priority reads - essential for real-time interrupt latency control |
Applications
| Industrial PLC Firmware Storage | Network Router Boot Code |
|---|---|
|
Use Scenario: Storing and executing boot firmware and real-time control logic in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile code storage with XIP capability and deterministic 90 ns read latency for deterministic task scheduling. Use Value: Uniform 128-kByte sectors simplify firmware versioning and field updates; EVIO compatibility avoids voltage translation on 2.5 V FPGA or ARM-based control SoCs. |
Use Scenario: Hosting primary bootloader and fail-safe recovery image in enterprise-grade routers requiring secure, field-upgradable firmware. IC Role / Device Role / Timing Role: Dual-role storage: boot ROM (read-only) and update partition (write-protected during operation). Use Value: Hardware #WP pin and ESP lock register prevent accidental overwrite during remote firmware upgrades; 100,000-cycle endurance supports frequent patch deployment. |
| Medical Imaging System BIOS | Smart Energy Meter Calibration Data |
|
Use Scenario: Storing system BIOS and diagnostic routines in portable ultrasound and MRI subsystems where data integrity and long-term retention are critical. IC Role / Device Role / Timing Role: Trusted boot source with CFI-compliant identification and status monitoring for safety-critical startup sequences. Use Value: 20-year data retention and RY/#BY status pin enable reliable power-loss recovery; CFI support simplifies BIOS auto-detection across multiple Winbond Flash variants. |
Use Scenario: Securing metrology calibration constants and tamper-evident usage logs in ANSI C12.22-compliant smart electricity meters deployed for 15+ years. IC Role / Device Role / Timing Role: Secure, one-time-programmable (OTP) storage for calibration coefficients with hardware-enforced write locking. Use Value: Dedicated 1024-byte Security Sector Region with independent 512-byte locks ensures calibration data cannot be altered post-certification - meeting IEC 62056 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR Flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S11TFI010 | Same density and x16 interface; 110 ns random access (vs. 90 ns); no EVIO support; operates only at VCC = 3.0 V ±0.3 V | Lacks voltage-flexible I/O; requires dedicated 3.0 V rail; suitable only where timing margin permits slower access | Select when cost sensitivity outweighs performance and voltage flexibility needs; verify timing slack in existing 3.0 V designs. |
| MX29GL256ELXGI-90G | 90 ns access; supports 1.8 V EVIO; but uses 64-ball LFBGA64 package (vs. TSOP56); no #RESET pin; different CFI vendor ID | Requires PCB redesign for BGA footprint and lacks hardware reset abort - limits use in safety-critical restart scenarios | Choose only for new designs targeting smaller form factor and 1.8 V I/O; avoid in legacy TSOP-replacement or reset-sensitive applications. |
Compared with S29GL256S11TFI010 and MX29GL256ELXGI-90G, the W29GL256SL9C uniquely delivers 90 ns access + EVIO + TSOP56 + #RESET in a single package - making it the only drop-in upgrade path for aging industrial boards needing faster, more flexible, and safer Flash replacement.
Availability
W29GL256SL9C is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, medical diagnostics, and smart metering applications requiring stable component supply, long lifecycle support, and guaranteed obsolescence management.
Supply support for W29GL256SL9C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR Flash, PSRAM, and audio codecs, with ISO 9001 and IATF 16949 certified manufacturing.
The W29GL series targets embedded systems requiring robust, pin-compatible NOR Flash with enhanced reliability features - designed specifically for boot code storage, firmware updates, and secure configuration in harsh-temperature industrial and networking equipment.
FAQ
What is the maximum operating temperature range for the W29GL256SL9C?
The W29GL256SL9C is rated for industrial temperature operation from –40 °C to +85 °C. This range is validated across all electrical and timing specifications in the datasheet, including 90 ns random access and 100,000 erase/program cycles. The W29GL256SL9C maintains full functionality without derating under continuous thermal stress within this envelope, making it suitable for enclosed control cabinets and outdoor telecom enclosures.
Does the W29GL256SL9C support Common Flash Interface (CFI) and how is it accessed?
Yes, the W29GL256SL9C fully supports CFI per JEDEC JESD68. CFI is accessed by writing the Autoselect command sequence (0x90 to address 0x0000), then reading the CFI Query Identification String from addresses 0x0010–0x001F. The W29GL256SL9C returns valid CFI System Interface, Device Geometry, and Vendor-Specific Extended Query data - enabling automatic detection and configuration in BIOS and bootloader environments.
How does the Write Buffer Programming feature improve firmware update efficiency in the W29GL256SL9C?
The W29GL256SL9C's 256-word (512-byte) Write Buffer allows up to 512 bytes to be loaded into an internal latch before initiating programming - reducing the number of command cycles needed per update block. In practice, this cuts effective programming time by over 60% compared to single-word programming, especially during sequential firmware patches. The W29GL256SL9C also supports suspend/resume during buffer programming, preserving real-time responsiveness.
Can the W29GL256SL9C be used as a direct replacement for older W29GL256J devices?
No - the W29GL256SL9C is not a direct replacement for W29GL256J. While both are 256-Mbit x16 NOR Flash, the W29GL256J uses 65 nm process, lacks EVIO support, has slower 100 ns access, and implements different sector protection logic. The W29GL256SL9C requires updated initialization sequences and voltage handling. Migration to W29GL256SL9C must include validation of timing margins, EVIO rail implementation, and CFI descriptor parsing in host firmware.
What is the function of the RY/#BY pin on the W29GL256SL9C and how should it be interfaced?
The RY/#BY pin on the W29GL256SL9C is an open-drain output indicating device readiness: LOW means an internal algorithm (erase/program) is active; HIGH-Z means the device is ready for read or new commands. It requires an external pull-up resistor (typically 4.7 kΩ to VCC) to detect the HIGH-Z state. Multiple W29GL256SL9C devices can share a common RY/#BY bus for synchronized status polling - a key feature for multi-chip Flash arrays in high-density storage modules.
W29GL256SL9C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 56-TFBGA
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 90ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TFBGA (7x9)
W29GL256SL9C FAQ
1.How can I place an order for W29GL256SL9C through Aetrix?
Please submit a Request for Quotation (RFQ) for W29GL256SL9C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29GL256SL9C reliable?
The price and inventory of W29GL256SL9C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29GL256SL9C is usually 5 days.
3.What payment methods are accepted for W29GL256SL9C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29GL256SL9C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29GL256SL9C?
W29GL256SL9C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29GL256SL9C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29GL256SL9C?
For technical support, including W29GL256SL9C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29GL256SL9C requirements.
6.How does Aetrix verify that W29GL256SL9C is sourced from the original manufacturer or authorized distributors?
All W29GL256SL9C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29GL256SL9C meets industry standards.
7.What is the process for return or replacement of W29GL256SL9C?
All W29GL256SL9C units undergo pre-shipment inspection (PSI). If there is an issue with W29GL256SL9C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29GL256SL9C part is unused and in its original packaging.
Return procedure for W29GL256SL9C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29GL256SL9C Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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