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Winbond Electronics Corporation W29GL256SL9C TR
- Part No.:
- W29GL256SL9C TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 56-TFBGA
- Datasheet:
-
W29GL256SL9C TR.pdf
- Description:
- IC FLASH 256MBIT PAR 56TFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,324
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Product details
Overview
W29GL256SL9C TR from Winbond is a 256-Mbit (32-MByte), x16 parallel NOR Flash memory with 3.0-V operation, 15 ns page access time, 90 ns random access time, and 128-kbyte uniform sector architecture. It supports Write Buffer programming (up to 512 bytes), Enhanced Variable I/O (EVIO: 1.65V–VCC), and CFI-compliant interface for embedded boot code and data storage in industrial control and networking systems.
For engineers reviewing the W29GL256SL9C TR datasheet, W29GL256SL9C TR pinout, W29GL256SL9C TR application, or W29GL256SL9C TR equivalent, key selection criteria include sector protection granularity, EVIO voltage flexibility, Ready/#Busy status signaling, and TSOP-56 package compatibility with legacy parallel bus designs.
Technical Context
The W29GL256SL9C TR implements a dual-state machine architecture: Command State Machine (CSM) handles address/data routing and command dispatch, while the Write State Controller executes internal algorithms (program/erase/suspend/resume) autonomously. Sector erase requires no external timing control-only valid command sequences trigger deterministic 128-kbyte block erasure.
It supports three hardware protection methods: #WP pin assertion (highest/lowest sector lock), non-volatile Individual Protection Bits (IPB), and volatile Dynamic Protection Bits (DPB). Status monitoring is available via Status Register, Data# Polling (DQ7/DQ6 toggle), and RY/#BY output-each providing independent confirmation of algorithm completion without host polling overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MByte), organized as 2,097,152 × 16-bit words |
| Access Time | 90 ns random read; 15 ns page read - enables fast instruction fetch in XIP applications |
| Write Buffer Size | 256 words (512 bytes) - reduces effective programming time by batching writes |
| Sector Architecture | 256 uniform 128-kbyte sectors - simplifies firmware partitioning and OTA update management |
| Operating Voltage | VCC: 2.7 V to 3.6 V; EVIO: 1.65 V to VCC - supports mixed-voltage system interfacing |
| Data Retention | 20 years typical - validated for long-life industrial deployments without refresh |
| Erase/Program Cycles | 100,000 cycles per sector - ensures field-replaceable firmware longevity |
Pinout & Package
W29GL256SL9C TR is supplied in a 56-pin TSOP-I (14 × 20 mm) package with standard parallel bus footprint compatible with legacy 3.3-V NOR Flash layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low device select; enables internal logic only when asserted - critical for multi-device bus arbitration |
| #OE | Output Enable | Controls DQ[15:0] tri-state buffer; allows shared data bus operation without external bus transceivers |
| #WE | Write Enable | Defines write vs. read cycle timing; must meet tWH/tWL setup/hold relative to #CE and address stability |
| RY/#BY | Ready/Busy Output | Open-drain status signal; LOW = active algorithm (erase/program); HIGH-Z = ready - requires external pull-up |
| #WP | Hardware Write Protect | Locks top/bottom 128-kbyte sectors permanently when held LOW at power-up - prevents accidental firmware corruption |
| EVIO | Enhanced Variable I/O Supply | Independent 1.65–3.6 V supply for DQ[15:0] and control pins - decouples I/O voltage from core VCC |
Key Features
| Feature | Design Value |
|---|---|
| Write Buffer Programming | Enables 512-byte burst writes with single command - cuts firmware update time vs. byte-by-byte programming |
| Enhanced Sector Protection (ESP) | Combines IPB (non-volatile), DPB (volatile), and #WP pin lock - provides layered security for bootloader and config regions |
| Security Sector Region | 1024-byte OTP array split into two 512-byte lockable zones - stores immutable keys or calibration data |
| Suspend/Resume Commands | Pauses active erase or program to service high-priority reads - maintains real-time system responsiveness |
| CFI Interface Support | Standardized autoselect mode (0x55/0xAA commands) - enables generic flash drivers across multiple vendors |
Applications
| Industrial PLC Firmware Storage | Network Router Boot Code |
|---|---|
|
Use Scenario: Storing firmware images and configuration tables in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Non-volatile boot memory mapped to CPU address space; provides XIP execution capability with sub-100 ns access. Use Value: 20-year data retention and 100K program/erase cycles ensure firmware integrity over extended maintenance intervals without backup power. |
Use Scenario: Hosting boot loader and fail-safe recovery image in enterprise-grade routers requiring rapid cold-start and secure firmware updates. IC Role / Device Role / Timing Role: Primary parallel NOR Flash for BIOS-level initialization; leverages CFI autoselect for vendor-agnostic driver support. Use Value: Write Buffer + suspend/resume enables atomic firmware patching without interrupting packet forwarding latency-critical tasks. |
| Medical Imaging System Configuration | Automotive ADAS Camera Module |
|
Use Scenario: Holding calibration parameters, sensor profiles, and safety-critical startup routines in diagnostic imaging equipment certified to IEC 62304. IC Role / Device Role / Timing Role: Secure configuration store with OTP security sector for cryptographic keys and device-specific identifiers. Use Value: Hardware #WP pin + IPB locking prevents unauthorized modification of FDA-approved operational parameters during service. |
Use Scenario: Storing camera firmware and lens correction maps in automotive surround-view systems operating across -40°C to +85°C. IC Role / Device Role / Timing Role: Temperature-hardened parallel Flash with EVIO support for direct interfacing to 1.8-V FPGA I/O banks. Use Value: Wide temperature range and 2.7–3.6 V VCC tolerance ensure reliable boot under battery voltage sag and thermal cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR Flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S11TFI010 | Spansion (now Cypress) 256-Mbit parallel NOR; 110 ns random access; no EVIO support; 3.0-V only | Lacks EVIO voltage flexibility and Write Buffer size (128-word vs. 256-word); identical sector layout | Select when legacy Spansion ecosystem compatibility is required and I/O voltage matching is fixed at 3.0 V |
| MX29GL256FHT2I-90G | Macronix 256-Mbit parallel NOR; 90 ns access; supports EVIO but no Security Sector OTP region | Missing 1024-byte OTP security sector; otherwise matches Write Buffer and ESP features | Choose when enhanced security sector is not needed but same timing and EVIO behavior is critical |
Compared with S29GL256S11TFI010 and MX29GL256FHT2I-90G, the W29GL256SL9C TR uniquely combines EVIO support, 512-byte Write Buffer, and dedicated OTP security sector-making it optimal for systems requiring mixed-voltage interoperability, fast firmware updates, and tamper-resistant key storage.
Availability
W29GL256SL9C TR is available at Aetrix Electronics and suitable for industrial PLC firmware storage, network router boot code, medical imaging configuration, and automotive ADAS camera modules requiring stable component supply and long-term lifecycle assurance.
Supply support for W29GL256SL9C TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty DRAM, serial and parallel Flash memory, and mobile communications ICs since 1987.
The W29GL256SL9C TR belongs to Winbond's GL-series parallel NOR Flash product line, engineered for high-reliability embedded boot and code storage in industrial, networking, and automotive applications demanding robust sector protection and extended data retention.
FAQ
What is the package type and pin count of the W29GL256SL9C TR?
The W29GL256SL9C TR uses a 56-pin TSOP-I (Thin Small Outline Package) with 14 mm × 20 mm body dimensions. This package is industry-standard for parallel NOR Flash and maintains pin compatibility with prior-generation 3.3-V devices, enabling drop-in replacement in existing PCB layouts without redesign.
Does the W29GL256SL9C TR support Common Flash Interface (CFI)?
Yes, the W29GL256SL9C TR fully supports CFI through its autoselect mode (triggered by 0x55/0xAA command sequence at address 0x555/0x2AA). This enables standardized identification of geometry, command sets, and vendor information-allowing generic flash drivers to configure and manage the W29GL256SL9C TR without device-specific code.
How does the Write Buffer feature improve programming efficiency in the W29GL256SL9C TR?
The W29GL256SL9C TR's 256-word (512-byte) Write Buffer allows up to 512 bytes of data to be loaded before initiating a single internal programming operation. This reduces total programming time by eliminating repeated command/address overhead per word, delivering up to 3× faster effective write throughput compared to standard word-by-word programming in the W29GL256SL9C TR.
What protection mechanisms prevent unintended erasure or programming of the W29GL256SL9C TR?
The W29GL256SL9C TR implements three independent protection layers: hardware #WP pin (locks top/bottom sectors at power-up), non-volatile Individual Protection Bits (IPB) for permanent sector locking, and volatile Dynamic Protection Bits (DPB) for runtime sector lockdown. These can be used individually or in combination to safeguard bootloader, configuration, and security sectors in the W29GL256SL9C TR.
Is the W29GL256SL9C TR suitable for automotive applications?
The W29GL256SL9C TR operates across -40°C to +85°C and meets industrial reliability standards including 100,000 program/erase cycles and 20-year data retention. While not AEC-Q100 qualified, its electrical and thermal specs align with many ADAS camera module and infotainment subsystem requirements where extended temperature operation and firmware integrity are critical-subject to end-system validation for the W29GL256SL9C TR.
W29GL256SL9C TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 56-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 90ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TFBGA (7x9)
W29GL256SL9C TR FAQ
1.How can I place an order for W29GL256SL9C TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W29GL256SL9C TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29GL256SL9C TR reliable?
The price and inventory of W29GL256SL9C TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29GL256SL9C TR is usually 5 days.
3.What payment methods are accepted for W29GL256SL9C TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29GL256SL9C TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29GL256SL9C TR?
W29GL256SL9C TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29GL256SL9C TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29GL256SL9C TR?
For technical support, including W29GL256SL9C TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29GL256SL9C TR requirements.
6.How does Aetrix verify that W29GL256SL9C TR is sourced from the original manufacturer or authorized distributors?
All W29GL256SL9C TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29GL256SL9C TR meets industry standards.
7.What is the process for return or replacement of W29GL256SL9C TR?
All W29GL256SL9C TR units undergo pre-shipment inspection (PSI). If there is an issue with W29GL256SL9C TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29GL256SL9C TR part is unused and in its original packaging.
Return procedure for W29GL256SL9C TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29GL256SL9C TR Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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