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Winbond Electronics Corporation W29GL256SL9T
- Part No.:
- W29GL256SL9T
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 56-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
W29GL256SL9T.pdf
- Description:
- IC FLASH 256MBIT PARALLEL 56TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,328
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Product details
Overview
W29GL256SL9T from Winbond is a 256-Mbit (32-MByte), x16 parallel NOR Flash memory with 3.0-V operation, 15 ns page access time, 90 ns random access time, and 256-word (512-byte) write buffer programming capability. It supports uniform 128-kByte sector erase, CFI interface compliance, and operates across –40°C to +85°C for industrial embedded storage in boot code, firmware, and configuration data applications.
For engineers reviewing the W29GL256SL9T datasheet, W29GL256SL9T pinout, W29GL256SL9T application, or W29GL256SL9T equivalent, key selection considerations include its TSOP-56 package, EVIO voltage range (1.65 V to VCC), hardware write protection via #WP, Ready/#Busy status signaling, and support for program/erase suspend-resume operations in real-time systems.
Technical Context
The W29GL256SL9T implements a Command State Machine (CSM) and Write State Controller architecture to manage asynchronous read/write, page-mode access, and embedded algorithms (sector/chip erase, word/write buffer programming). Its internal logic handles command sequencing, status reporting via Status Register/Data Polling/RY/#BY, and power-aware transitions including automatic sleep and standby modes.
It features Enhanced Variable I/O (EVIO) supporting 1.65 V–VCC I/O voltage range independent of core VCC (2.7–3.6 V), enabling interoperability with mixed-voltage host systems. Sector protection includes volatile (DPB) and non-volatile (IPB, Lock Register) methods, plus a dedicated 1024-byte OTP security region with dual 512-byte lockable segments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 256 Mbit (32 MByte), organized as 2,097,152 × 16-bit words |
| Access Time | 90 ns random read; 15 ns page-mode read within same 32-byte aligned page |
| Write Buffer Size | 256 words (512 bytes) per single program operation - reduces effective programming time vs. byte/word-by-word |
| Erase Granularity | Uniform 128-kByte sectors (2048 sectors total); chip-erase also supported |
| Supply Voltage | VCC: 2.7 V–3.6 V; EVIO: 1.65 V–VCC - decouples I/O voltage from core supply |
| Endurance & Retention | ≥100,000 program/erase cycles; ≥20 years data retention at 85°C |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded systems |
Pinout & Package
W29GL256SL9T is packaged in a 56-pin TSOP (14 mm × 20 mm, standard thickness), pin-compatible with industry-standard parallel NOR Flash footprints. Pin functions are defined per JEDEC MO-142AC and validated against Winbond's official pinout diagrams (Fig. 3-2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A23 | Address Inputs | 24-bit address bus selecting 16-bit words; A0–A3 define intra-page offset in page-mode reads |
| DQ0–DQ15 | Data I/O | x16 bidirectional data bus; supports true read-modify-write and byte masking via upper/lower byte enables (implied by #WE timing) |
| #CE, #OE, #WE | Control Enables | Asynchronous 3-enable interface: #CE selects device, #OE enables output buffer, #WE controls direction and latches write data |
| #WP | Hardware Write Protect | Active-low input that locks highest and lowest 128-kByte sectors - prevents accidental erase/program during power transients |
| RY/#BY | Status Output | Open-drain active-low busy signal; HIGH-Z = ready/idle, VIL = internal algorithm (erase/program) in progress - supports wired-OR multi-device polling |
| #RESET | Hardware Reset | Resets command state machine and terminates ongoing algorithms; returns device to read mode with minimal latency |
| EVIO | I/O Power Supply | Dedicated supply pin for I/O buffers - allows 1.65 V–VCC operation independent of core VCC, easing interface with 1.8 V/2.5 V controllers |
Key Features
| Feature | Design Value |
|---|---|
| Page-Mode Read | 32-byte aligned page access with 15 ns cycle time - accelerates sequential instruction fetch in XIP applications |
| Write Buffer Programming | Single-command 512-byte burst programming - cuts typical firmware update time by >70% vs. word-by-word writes |
| Enhanced Sector Protection (ESP) | Combines non-volatile IPB/Lock Register and volatile DPB for flexible, field-updatable sector lockdown without reprogramming flash |
| Security Sector Region | 1024-byte OTP array split into two 512-byte lockable regions - stores immutable keys, certificates, or calibration data |
| Suspend/Resume Support | Program and erase operations can be paused/resumed - enables high-priority interrupt handling in real-time OS environments |
Applications
| Boot Code Storage | Firmware Update Storage |
|---|---|
|
Use Scenario: Storing primary bootloader and secure ROM code executed directly from flash (XIP) on power-up in industrial PLCs and network switches. IC Role / Device Role / Timing Role: Non-volatile code execution memory with deterministic 90 ns random access and 15 ns page-mode latency for tight timing-critical fetches. Use Value: Eliminates external RAM copy step; supports secure boot via OTP-locked signature verification keys stored in Security Sector Region. |
Use Scenario: Holding field-upgradable firmware images in medical imaging devices where safe over-the-air (OTA) updates require atomic sector-level write/erase. IC Role / Device Role / Timing Role: High-reliability storage with 100,000-cycle endurance and suspend/resume - enables interruption-safe background updates without system freeze. Use Value: Sector protection (IPB + DPB) isolates active and staging firmware partitions; write buffer speeds image commit after validation. |
| Configuration Data Storage | Industrial HMI Display Memory |
|
Use Scenario: Retaining calibrated sensor offsets, user preferences, and network settings across power cycles in factory automation HMIs. IC Role / Device Role / Timing Role: Byte-alterable non-volatile storage with hardware #WP pin to prevent corruption during brown-out events. Use Value: EVIO support (1.65 V–VCC) ensures compatibility with 1.8 V microcontroller GPIOs; 20-year retention guarantees data integrity over equipment lifetime. |
Use Scenario: Storing display assets (fonts, icons, bitmaps) and UI logic in ruggedized human-machine interface panels deployed in harsh environments. IC Role / Device Role / Timing Role: Parallel x16 interface delivers high bandwidth for rapid asset loading; TSOP-56 package offers proven thermal/mechanical reliability. Use Value: Uniform 128-kByte sectors simplify asset partitioning; RY/#BY pin enables precise timing of GUI rendering pipeline synchronization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel NOR Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S29GL256S11TFI010 | Spansion (now Cypress) 256-Mbit parallel NOR; identical 15 ns/90 ns timing, but uses different CFI vendor ID and lacks EVIO pin - requires fixed 3.3 V I/O. | No EVIO flexibility; incompatible with 1.8 V host interfaces without level shifters. | Select only when legacy Spansion toolchain compatibility or existing PCB layout with 3.3 V I/O is required. |
| MX29GL256FHI-90G | Macronix 256-Mbit parallel NOR; same TSOP-56 package and 90 ns access, but no write buffer - max 1-word programming per command. | Slower firmware update throughput; no suspend/resume for erase/program operations. | Choose when cost sensitivity outweighs performance needs and security features (OTP, ESP) are not required. |
Compared with S29GL256S11TFI010 and MX29GL256FHI-90G, the W29GL256SL9T uniquely combines EVIO voltage flexibility, 512-byte write buffering, and dual-mode sector protection - making it optimal for new designs requiring mixed-voltage interoperability, fast field updates, and robust data security.
Availability
W29GL256SL9T is available at Aetrix Electronics and suitable for industrial control systems, medical device firmware storage, and automotive infotainment head units requiring stable component supply and long-term lifecycle support.
Supply support for W29GL256SL9T includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and audio codecs, with global manufacturing and quality certifications.
The W29GL series targets high-reliability embedded systems needing fast parallel NOR Flash with advanced data protection - designed specifically for boot code, firmware, and secure configuration storage in industrial and networking equipment.
FAQ
What is the pin count and package type of the W29GL256SL9T?
The W29GL256SL9T uses a 56-pin TSOP (Thin Small Outline Package) with 14 mm × 20 mm dimensions and standard JEDEC MO-142AC footprint. This package is verified in Winbond's datasheet Figure 3-2 and supports surface-mount assembly with conventional reflow profiles. The W29GL256SL9T pinout includes dedicated EVIO, #WP, and RY/#BY signals critical for industrial system integration.
Does the W29GL256SL9T support execute-in-place (XIP) operation?
Yes, the W29GL256SL9T supports XIP operation due to its fast 90 ns random access time and 15 ns page-mode read capability, enabling direct CPU instruction fetch from flash without RAM loading. Its architecture includes optimized command-state handling and low-latency output enable timing, confirmed in Section 6 and Table 10-4 of the official datasheet. The W29GL256SL9T is widely deployed in boot ROM applications for ARM Cortex-M and PowerPC-based controllers.
How does the Enhanced Variable I/O (EVIO) feature work on the W29GL256SL9T?
The EVIO pin on the W29GL256SL9T supplies a separate voltage (1.65 V to VCC) to the I/O buffers, decoupling interface voltage from core VCC (2.7–3.6 V). This allows direct connection to 1.8 V or 2.5 V microcontrollers without level shifters. The feature is electrically validated in Table 9-3 (DC Characteristics) and timing-tested per Table 10-4, ensuring signal integrity across voltage combinations. EVIO is a distinguishing capability of the W29GL256SL9T versus many competing parallel NOR devices.
What sector protection mechanisms does the W29GL256SL9T provide?
The W29GL256SL9T implements Enhanced Sector Protection (ESP) with three complementary methods: non-volatile Individual Protection Bits (IPB), volatile Dynamic Protection Bits (DPB), and a Lock Register that freezes IPB states. These are detailed in Sections 7.5 and 8.11 of the datasheet. The W29GL256SL9T also includes a dedicated 1024-byte Security Sector Region with OTP locking - enabling hierarchical protection of boot code, firmware, and sensitive configuration data without requiring full-chip erase.
Can the W29GL256SL9T be used in automotive applications?
The W29GL256SL9T is rated for –40°C to +85°C operation and meets industrial reliability standards (100,000 cycles, 20-year retention), but it is not AEC-Q100 qualified. It is commonly used in automotive infotainment head units and body control modules where extended temperature range and robust sector protection are needed, though mission-critical powertrain or ADAS systems typically require AEC-Q100 Grade 2 or 3 components. For such use cases, the W29GL256SL9T must undergo additional system-level qualification.
W29GL256SL9T Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 56-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 16M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 90ns
- Access Time:
- 90 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 56-TSOP
W29GL256SL9T FAQ
1.How can I place an order for W29GL256SL9T through Aetrix?
Please submit a Request for Quotation (RFQ) for W29GL256SL9T on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29GL256SL9T reliable?
The price and inventory of W29GL256SL9T are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29GL256SL9T is usually 5 days.
3.What payment methods are accepted for W29GL256SL9T?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29GL256SL9T transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29GL256SL9T?
W29GL256SL9T orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29GL256SL9T order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29GL256SL9T?
For technical support, including W29GL256SL9T datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29GL256SL9T requirements.
6.How does Aetrix verify that W29GL256SL9T is sourced from the original manufacturer or authorized distributors?
All W29GL256SL9T products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29GL256SL9T meets industry standards.
7.What is the process for return or replacement of W29GL256SL9T?
All W29GL256SL9T units undergo pre-shipment inspection (PSI). If there is an issue with W29GL256SL9T, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29GL256SL9T part is unused and in its original packaging.
Return procedure for W29GL256SL9T:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29GL256SL9T Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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