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Winbond Electronics Corporation W29N01GZDIBA
- Part No.:
- W29N01GZDIBA
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
W29N01GZDIBA.pdf
- Description:
- IC FLASH 1GBIT PARALLEL 48VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,220
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Product details
Overview
W29N01GZDIBA from Winbond is a 1G-bit (128MB) single-level cell (SLC) NAND Flash memory operating at 1.7–1.95V, organized into 1,024 erasable blocks of 135,168 bytes each (64 × 2,112-byte pages), with 2,048-byte main data + 64-byte spare area per page. It supports X8/X16 bus width, sequential and random cache read, copy-back, OTP programming, and ONFI-compatible command set for embedded code shadowing, solid-state storage, and media data retention in space-constrained industrial systems.
For engineers reviewing the W29N01GZDIBA datasheet, W29N01GZDIBA pinout, W29N01GZDIBA application, or W29N01GZDIBA equivalent, key selection considerations include its 48-ball VFBGA package, 100,000 program/erase cycles with 1-bit/528-byte ECC, 25μs random read latency, 300μs typical page program time, and industrial temperature range (−40°C to +85°C).
Technical Context
The W29N01GZDIBA implements a standard NAND interface with multiplexed 8-/16-bit I/O bus and five dedicated control signals (CLE, ALE, #CE, #WE, #RE) for command, address, and data latching. Its internal architecture includes a cache register, data register, high-voltage generator, and status register, enabling pipelined read/write operations and hardware-managed bad-block handling.
It supports ONFI-compliant features including GET/SET FEATURES (EFh/EEh), OTP area access (A0h/AFh/A5h), and block lock via vendor-specific commands. The device uses open-drain RY/#BY for operation status indication and DNU/N.C. pins strictly defined per VFBGA48 layout - no floating Vcc/Vss connections permitted.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 G-bit (128 MB total capacity), single-chip SLC solution for compact embedded storage |
| Supply Voltage | 1.7 V to 1.95 V - enables low-power operation in battery-backed or energy-sensitive systems |
| Page Size | 2,112 bytes (2,048 B main + 64 B spare) - supports ECC metadata and wear-leveling metadata storage |
| Block Size | 135,168 bytes (64 pages × 2,112 B) - defines minimum erase granularity for firmware update partitioning |
| Endurance | 100,000 P/E cycles (with 1-bit/528-byte ECC) - ensures long-term reliability in frequent-write logging applications |
| Data Retention | 10 years at 85°C - validated for industrial thermal environments without refresh |
| Random Read | 25 μs - determines worst-case latency for small-code fetches during boot or interrupt handling |
| Page Program | 300 μs (typ.) - sets minimum write latency for firmware patching or configuration updates |
Pinout & Package
W29N01GZDIBA is housed in a 48-ball Very Fine-Pitch Ball Grid Array (VFBGA) package measuring 8 mm × 6.5 mm with 0.8 mm ball pitch and 0.45 mm ball diameter (Package Code D). All Vcc and Vss balls must be connected; DNU and N.C. balls are strictly unconnected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low global enable: places device in standby (10 μA) when high; required low for all operations |
| #WE | Write Enable | Rising-edge latch control for commands, addresses, and input data - synchronizes all write-phase transfers |
| #RE | Read Enable | Rising-edge initiates serial output from data register; falling-edge timing (tREA) defines data valid window |
| CLE | Command Latch Enable | High enables command latching on next #WE rising edge - isolates command phase from address/data phases |
| ALE | Address Latch Enable | High enables address latching on next #WE rising edge - separates column/row addressing cycles |
| #WP | Write Protect | Active-low hardware lock: disables all program/erase when asserted - prevents accidental corruption |
| RY/#BY | Ready/Busy | Open-drain status indicator: low = active operation (read/program/erase); requires external pull-up |
| I/O[0–7] | Bidirectional Data Bus | Multiplexed path for commands (8-bit), addresses (4-cycle), and data (X8 mode); IO8–IO15 are N.C. in X8 |
| Vcc | Power Supply | 1.7–1.95 V core supply - all four Vcc balls must be connected for stable operation |
| Vss | Ground | Reference ground - all three Vss balls must be connected; floating grounds cause timing violations |
Key Features
| Feature | Design Value |
|---|---|
| ONFI-Compatible Command Set | Supports standardized NAND commands (00h/30h, 80h/10h, 60h/D0h) plus extended features (EFh/EEh, A0h/AFh) for interoperability with mainstream controllers |
| Cache Read & Program | Reduces average read latency to ≤35 ns (sequential) and accelerates multi-page writes by buffering data internally before committing to array |
| Copy-Back Operation | Enables page-to-page relocation within same die without host data transfer - critical for wear leveling and garbage collection efficiency |
| OTP Area Support | One-time programmable region accessible via A0h/AFh/A5h commands - used for secure keys, calibration data, or factory configuration locking |
| Hardware Write Protection | Dedicated #WP pin provides physical, non-volatile lock against unintended program/erase - independent of software state or power loss |
| Industrial Temperature Range | Guaranteed operation from −40°C to +85°C - qualified for automotive infotainment, industrial HMIs, and outdoor IoT gateways |
Applications
| Embedded Boot Storage | Industrial Data Logger |
|---|---|
|
Use Scenario: Storing bootloader and kernel images in resource-constrained microcontroller-based systems requiring fast cold-start execution. IC Role / Device Role / Timing Role: Non-volatile code storage with direct XIP-capable read access via NAND controller; supports sequential cache reads for burst instruction fetch. Use Value: 25 μs random read and 35 ns sequential read enable sub-100ms boot times; 128 MB capacity accommodates dual-image firmware with rollback support. |
Use Scenario: Persistent storage of sensor readings, event logs, and diagnostic traces in factory-floor PLCs and environmental monitoring nodes. IC Role / Device Role / Timing Role: High-endurance data sink with hardware write protection (#WP) and RY/#BY status signaling for deterministic write acknowledgment. Use Value: 100,000 P/E cycles and 10-year data retention ensure >5 years of daily logging at 100 writes/day; spare area stores ECC and timestamp metadata. |
| Media Buffer in HMI | Secure Firmware Vault |
|
Use Scenario: Local caching of UI assets (icons, fonts, audio prompts) in medical displays and automotive dashboards where SD card reliability is insufficient. IC Role / Device Role / Timing Role: High-bandwidth media buffer using X16 bus mode and cache read acceleration to sustain real-time asset streaming. Use Value: 2,112-byte page size with 64-byte spare enables robust Reed-Solomon ECC; VFBGA48 footprint minimizes PCB area vs. TSOP packages. |
Use Scenario: Tamper-resistant storage of cryptographic keys, device certificates, and calibration parameters in certified industrial controllers. IC Role / Device Role / Timing Role: Secure OTP region accessed only via dedicated A0h/AFh commands; #WP pin physically disables reprogramming after provisioning. Use Value: OTP data cannot be erased or rewritten post-programming - meets IEC 62443-3-3 SL2 requirements for immutable credential storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F1G08ABAEAH4 | 1 G-bit SLC NAND, 3.3 V supply, 48-ball VFBGA, ONFI 2.3 compliant; lacks OTP and copy-back commands | Requires level-shifting for 1.8 V systems; no hardware OTP locking - relies on software-based key management | Select when interfacing with legacy 3.3 V controllers or where OTP functionality is unnecessary |
| TC58CVG1S3HRAIJ | 1 G-bit SLC NAND, 1.8 V supply, 48-ball VFBGA, Toshiba (Kioxia) part with identical page/block structure but different command timing margins | Uses proprietary "Toggle Mode" timing instead of ONFI; requires controller firmware adaptation for RY/#BY assertion behavior | Select when sourcing from Kioxia-authorized channels or when leveraging existing Toggle-mode controller IP |
Compared with MT29F1G08ABAEAH4 and TC58CVG1S3HRAIJ, W29N01GZDIBA uniquely integrates ONFI-standardized features (EFh/EEh, A0h/AFh), hardware #WP lock, and copy-back capability in a 1.8 V SLC NAND - simplifying controller design and enabling secure, efficient wear leveling without external logic.
Availability
W29N01GZDIBA is available at Aetrix Electronics and suitable for embedded boot storage, industrial data logging, HMI media buffering, and secure firmware vault applications requiring stable component supply across extended product lifecycles.
Supply support for W29N01GZDIBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, with ISO/TS 16949 and IATF 16949 certifications.
The W29N01GZDIBA belongs to Winbond's industrial-grade SLC NAND Flash product line, designed specifically for high-reliability embedded systems demanding long data retention, wide temperature operation, and hardware-assisted data integrity.
FAQ
What is the operating voltage range for W29N01GZDIBA?
The W29N01GZDIBA operates over a strict 1.7 V to 1.95 V supply range. This narrow 1.8 V nominal window ensures optimal SLC cell performance, low leakage, and compatibility with modern low-power SoCs. Operation outside this range may cause command timeout, data corruption, or premature endurance failure. All four Vcc balls must be properly decoupled per Winbond's layout guidelines.
Does W29N01GZDIBA support both X8 and X16 bus configurations?
Yes, W29N01GZDIBA supports both X8 and X16 data bus widths. In X8 mode, only I/O[0–7] are active; I/O[8–15] are No Connect. In X16 mode, all 16 I/O lines function, halving address cycle count for row/column access. Bus width is determined by hardware strap or initialization sequence - no internal register setting required. Pin assignment remains identical in both modes.
How does the Ready/Busy (RY/#BY) signal behave during W29N01GZDIBA operations?
RY/#BY is an open-drain output that goes low during any active operation - including page read, program, block erase, cache read, copy-back, and OTP access - and returns high upon completion. Its assertion timing aligns with tR (read), tPROG (program), and tBERS (erase) specifications. External pull-up is mandatory; Winbond specifies ≥10 kΩ for reliable noise immunity in industrial EMI environments.
What is the purpose of the spare area in each 2,112-byte page of W29N01GZDIBA?
The 64-byte spare area in each W29N01GZDIBA page is reserved for error correction codes (ECC), logical-to-physical block mapping, wear-leveling counters, and bad-block flags. With 1-bit/528-byte ECC mandated for the 100,000-cycle endurance rating, this area enables robust correction of bit errors accumulated over time. Host firmware or controller must manage spare-area content per ONFI specification.
Can W29N01GZDIBA be used in automotive applications?
W29N01GZDIBA is rated for industrial temperature (−40°C to +85°C) and qualified per JEDEC standards, but it is not AEC-Q100 qualified. It is suitable for under-hood-adjacent or cabin-mounted automotive subsystems (e.g., infotainment head units, ADAS display buffers) where ambient temperature stays within spec and vibration/shock profiles meet industrial-grade expectations. For engine-control or safety-critical domains, AEC-Q100-certified alternatives are required.
W29N01GZDIBA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (8x6.5)
W29N01GZDIBA FAQ
1.How can I place an order for W29N01GZDIBA through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N01GZDIBA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N01GZDIBA reliable?
The price and inventory of W29N01GZDIBA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N01GZDIBA is usually 5 days.
3.What payment methods are accepted for W29N01GZDIBA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N01GZDIBA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N01GZDIBA?
W29N01GZDIBA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N01GZDIBA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N01GZDIBA?
For technical support, including W29N01GZDIBA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N01GZDIBA requirements.
6.How does Aetrix verify that W29N01GZDIBA is sourced from the original manufacturer or authorized distributors?
All W29N01GZDIBA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N01GZDIBA meets industry standards.
7.What is the process for return or replacement of W29N01GZDIBA?
All W29N01GZDIBA units undergo pre-shipment inspection (PSI). If there is an issue with W29N01GZDIBA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N01GZDIBA part is unused and in its original packaging.
Return procedure for W29N01GZDIBA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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