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Winbond Electronics Corporation W29N01HVBINA
- Part No.:
- W29N01HVBINA
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 63-VFBGA
- Datasheet:
-
W29N01HVBINA.pdf
- Description:
- IC FLASH 1GBIT 63-VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,985
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Product details
Overview
W29N01HVBINA from Winbond is a 1G-bit (128MB) SLC NAND Flash memory operating at 2.7V–3.6V, organized into 1,024 erasable blocks of 135,168 bytes each (64 × 2,112-byte pages), with x8 multiplexed I/O interface and standard NAND command set including COPY BACK. It delivers 25ns sequential read cycle time and supports industrial temperature range (−40°C to +85°C) for embedded storage in space-constrained systems.
For engineers reviewing the W29N01HVBINA datasheet, W29N01HVBINA pinout, W29N01HVBINA application, or W29N01HVBINA equivalent, this page provides verified pin functions, real-world timing values (e.g., 250μs typical page program), endurance (100,000 P/E cycles), data retention (10 years), and package-specific layout guidance for TSOP1 and VFBGA variants.
Technical Context
The W29N01HVBINA implements a standard NAND architecture with separate Command Latch Enable (CLE) and Address Latch Enable (ALE) signals, enabling time-multiplexed command/address/data transfer over an 8-bit I/O bus. Its control logic interprets ONFI-compatible commands (e.g., 00h-30h PAGE READ, 80h-10h PAGE PROGRAM, 60h-D0h BLOCK ERASE) and supports status polling via RY/#BY or READ STATUS (70h) command.
It features dedicated hardware-level write protection (#WP), ready/busy open-drain output (RY/#BY), and built-in bad block management per JEDEC JESD218A guidelines. The device uses Single-Level Cell (SLC) technology with 1-bit/528-byte ECC requirement for full endurance specification compliance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 G-bit / 128 MB total capacity - enables compact code shadowing and media storage without external expansion. |
| Page size | 2,112 bytes (2,048B main + 64B spare) - spare area reserved for ECC metadata and wear-leveling tracking. |
| Block size | 135,168 bytes (64 pages × 2,112B) - defines minimum erase granularity and impacts firmware partitioning strategy. |
| Read performance | 25 ns sequential read cycle - determines maximum sustained throughput in streaming applications. |
| Program time | 250 μs typical page program - sets lower bound on firmware write latency and buffer sizing requirements. |
| Erase endurance | 100,000 program/erase cycles - requires host-level wear leveling for long-term reliability in logging use cases. |
| Data retention | 10 years at 85°C - validated for industrial deployments where thermal stress accelerates charge loss. |
Pinout & Package
W29N01HVBINA is packaged in a 63-ball Fine-Pitch Ball Grid Array (VFBGA, Package Code B), 9 mm × 11 mm footprint, with 0.8 mm ball pitch. All Vcc and Vss balls must be connected; DNU (Do Not Use) and N.C. (No Connect) balls are unassigned and must remain unconnected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable input | Active-low enable: high = standby mode (10 μA), low = active operation; supports #CE don't-care reads during busy states. |
| #WE | Write Enable input | Rising-edge latch for commands, addresses, and data; controls timing of CLE/ALE sampling and I/O direction. |
| #RE | Read Enable input | Falling-edge initiates serial data output from Data Register; column address auto-increments per pulse. |
| CLE | Command Latch Enable input | High during #WE rising edge latches command byte (e.g., 00h, 80h, 60h) into internal command register. |
| ALE | Address Latch Enable input | High during #WE rising edge latches address bytes (column then row) into internal address register. |
| RY/#BY | Ready/Busy output | Open-drain signal: low = internal operation in progress (read/program/erase), high = ready for next command. |
| #WP | Write Protect input | Active-low hardware lock: low disables all program and erase operations, preventing accidental corruption. |
| I/O[0–7] | Bidirectional data bus | Multiplexed path for commands (1st cycle), addresses (2nd–4th cycles), and data (subsequent transfers). |
Key Features
| Feature | Design Value |
|---|---|
| COPY BACK command support (00h-35h / 85h-10h) | Enables intra-device page relocation without host RAM buffering - reduces system memory overhead in wear-leveling firmware. |
| READ PARAMETER PAGE (ECh) | Provides standardized ONFI-compliant parameter structure (manufacturer ID, page/block geometry, timing) - simplifies driver auto-configuration. |
| Random Data Output (05h-E0h) | Allows partial-page access within loaded page - improves responsiveness in GUI or metadata lookup scenarios. |
| Standard NAND command set | Ensures interoperability with Linux MTD/NAND subsystem, U-Boot NAND drivers, and vendor-agnostic flash translation layers. |
| Industrial temperature range | Validated operation from −40°C to +85°C - suitable for automotive infotainment, industrial HMIs, and outdoor IoT gateways. |
Applications
| Embedded Code Storage | Industrial Data Logging |
|---|---|
|
Use Scenario: Storing boot firmware and OS kernel images in resource-constrained microcontroller-based systems. IC Role / Device Role / Timing Role: Non-volatile code storage with fast sequential read (25ns) for rapid shadowing into RAM at power-up. Use Value: Eliminates need for external NOR flash or SPI EEPROM; leverages NAND density while maintaining acceptable boot latency. |
Use Scenario: Recording sensor readings, event timestamps, and diagnostic logs in factory automation controllers. IC Role / Device Role / Timing Role: High-endurance write-optimized storage with 100,000 P/E cycles and hardware write protect (#WP). Use Value: Supports deterministic log rotation and wear leveling without requiring host-side ECC management beyond standard 1-bit/528-byte. |
| Media Buffering in HMI | Secure Firmware Update Storage |
|
Use Scenario: Caching UI assets (icons, fonts, audio clips) in medical display panels or retail kiosks. IC Role / Device Role / Timing Role: High-bandwidth sequential read source with random access (05h-E0h) for dynamic asset loading. Use Value: Enables smooth UI transitions by decoupling asset fetch latency from main processor load; 2,112-byte page size aligns with typical compression block sizes. |
Use Scenario: Holding authenticated firmware update packages prior to secure installation in networked edge devices. IC Role / Device Role / Timing Role: Tamper-resistant storage with hardware write lock (#WP) and status monitoring (RY/#BY) during critical update phases. Use Value: Prevents mid-update corruption from power loss or reset; READY/READY signaling allows precise synchronization of signature verification and flash commit. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F1G08ABAEAH4-IT:E | 1Gb SLC NAND, 3.3V, x8, 48-pin TSOP1 only; no 63-ball VFBGA option; slightly slower 35ns read cycle. | Lacks 63-ball VFBGA packaging - unsuitable for ultra-dense PCB layouts requiring fine-pitch BGA. | Select when TSOP1 mechanical compatibility or Micron's extended lifecycle support is prioritized over footprint miniaturization. |
| TC58NVG1S3ETA00 | 1Gb SLC NAND, 3.3V, x8, 48-ball VFBGA only; supports ONFI 2.3 but no COPY BACK command; 20μs random read. | Missing COPY BACK functionality - increases host RAM usage in wear-leveling implementations. | Choose when ONFI 2.3 timing compliance or Toshiba's qualification for automotive AEC-Q100 Grade 2 is required, and COPY BACK is not used. |
Compared with MT29F1G08ABAEAH4-IT:E and TC58NVG1S3ETA00, W29N01HVBINA uniquely offers 63-ball VFBGA packaging, 25ns read performance, and hardware-supported COPY BACK - making it optimal for space-constrained industrial designs requiring minimal host memory overhead and fast firmware execution.
Availability
W29N01HVBINA is available at Aetrix Electronics and suitable for embedded code storage, industrial data logging, HMI media buffering, and secure firmware update storage requiring stable component supply across extended product lifecycles.
Supply support for W29N01HVBINA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.
The W29N series targets cost-sensitive, space-constrained embedded systems needing reliable, high-density non-volatile storage with industrial-grade temperature tolerance and standard NAND protocol compatibility.
FAQ
What is the exact memory organization of the W29N01HVBINA?
The W29N01HVBINA contains 1,024 erasable blocks, each consisting of 64 programmable pages of 2,112 bytes (2,048 bytes main + 64 bytes spare). Total capacity is 138,412,032 bytes (128 MB), with block size fixed at 135,168 bytes. This organization is confirmed in Section 6.1 and Table 6.1 of the official datasheet.
Does the W29N01HVBINA support ONFI standards?
Yes, the W29N01HVBINA supports ONFI 1.0 identification via READ ID command (90h followed by 20h address), returning "ONFI" ASCII signature (4Fh, 4Eh, 46h, 49h). It also implements READ PARAMETER PAGE (ECh) with ONFI-defined structure, enabling standardized driver initialization per Section 9.1.4 and Table 9.3.
What package type does W29N01HVBINA use, and how is it identified?
W29N01HVBINA uses the 63-ball Fine-Pitch Ball Grid Array (VFBGA) package, designated Package Code B per Section 3.3 and Figure 3-3. Its mechanical dimensions are 9 mm × 11 mm with 0.8 mm ball pitch, and pin assignments differ from the 48-ball (Code D) and 48-pin TSOP1 (Code S) variants.
How does the W29N01HVBINA handle bad block management?
The W29N01HVBINA implements factory-marked initial invalid blocks per Section 12.2, and supports runtime detection of program/erase failures per Section 12.3. Bad block replacement is handled via host firmware using the Invalid Block Management flowchart (Figure 12-2), with no on-die remapping - consistent with standard SLC NAND behavior.
What is the role of the DNU balls in the W29N01HVBINA 63-ball VFBGA package?
In the W29N01HVBINA 63-ball VFBGA (Package Code B), DNU (Do Not Use) balls - such as those labeled "DNU" in Figure 3-3 - are physically present but electrically unconnected and functionally inactive. They must remain unconnected on the PCB per Section 3.4 Note 1; connecting them may cause undefined behavior or damage.
W29N01HVBINA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 63-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns
- Access Time:
- 25 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 63-VFBGA (9x11)
W29N01HVBINA FAQ
1.How can I place an order for W29N01HVBINA through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N01HVBINA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N01HVBINA reliable?
The price and inventory of W29N01HVBINA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N01HVBINA is usually 5 days.
3.What payment methods are accepted for W29N01HVBINA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N01HVBINA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N01HVBINA?
W29N01HVBINA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N01HVBINA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N01HVBINA?
For technical support, including W29N01HVBINA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N01HVBINA requirements.
6.How does Aetrix verify that W29N01HVBINA is sourced from the original manufacturer or authorized distributors?
All W29N01HVBINA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N01HVBINA meets industry standards.
7.What is the process for return or replacement of W29N01HVBINA?
All W29N01HVBINA units undergo pre-shipment inspection (PSI). If there is an issue with W29N01HVBINA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N01HVBINA part is unused and in its original packaging.
Return procedure for W29N01HVBINA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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