Winbond Electronics Corporation W29N01HVSINF TR

Overview

W29N01HVSINF TR from Winbond is a 1G-bit (128MB) Single-Level Cell (SLC) NAND Flash memory operating at 2.7–3.6V, organized into 1,024 blocks of 64 pages each (2,112 bytes/page), with x8 multiplexed I/O bus and standard NAND command set including COPY BACK. It delivers 25ns sequential read cycle time, 250μs typical page program time, and supports industrial temperature range (−40°C to +85°C) for embedded code shadowing and media storage in space-constrained systems.

For engineers reviewing the W29N01HVSINF TR datasheet, W29N01HVSINF TR pinout, W29N01HVSINF TR application, or W29N01HVSINF TR equivalent, key selection criteria include TSOP1-48 package compatibility, 25μs random read latency, 100,000 program/erase cycles with 4-bit/528-byte ECC, RY/#BY open-drain status signaling, and support for ONFI-compliant parameter page reads.

Technical Context

This SLC NAND device implements a command-latched interface using CLE/ALE control signals to separate command, address, and data on the shared 8-bit I/O bus. Its internal architecture includes a 2,112-byte data register, column/row decoders, high-voltage generator, and status register with bit-defined error and operation flags.

It executes standard NAND operations-PAGE READ (00h–30h), PAGE PROGRAM (80h–10h), BLOCK ERASE (60h–D0h), and extended functions like RANDOM DATA INPUT (85h) and COPY BACK-with timing governed by tREA (25ns), tR (25μs), and tPROG (250μs typ.). Write protection is hardware-enforced via #WP pin, and readiness is signaled asynchronously via open-drain RY/#BY.

Key Specifications

Pinout & Package

W29N01HVSINF TR is packaged in 48-pin TSOP1 (Package Code S), 12 mm × 20 mm footprint, with all Vcc and Vss pins requiring direct connection to power/ground. No floating supplies permitted.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND flash memory applications.

Compared with W29N01HVSINF TR, MT29F1G08ABAEAH4-IT:E offers faster read timing but removes COPY BACK-increasing host CPU load for wear leveling-while TC58NVG1S3ETA00 mandates TOGGLE DDR interface support, limiting compatibility with conventional NAND controllers.

Availability

W29N01HVSINF TR is available at Aetrix Electronics and suitable for industrial HMIs, embedded boot media, medical data loggers, and automotive infotainment systems requiring stable component supply, long-term lifecycle assurance, and TSOP1-compatible footprint.

Supply support for W29N01HVSINF TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.

W29N01HVSINF TR belongs to Winbond's W29N01HV family of SLC NAND Flash devices designed specifically for high-reliability embedded applications demanding long data retention, robust ECC support, and industrial temperature operation.

FAQ

What is the exact memory organization of the W29N01HVSINF TR?

The W29N01HVSINF TR contains a 1 G-bit (128 MB) SLC NAND array organized into 1,024 erasable blocks. Each block holds 64 programmable pages of 2,112 bytes (2,048 bytes main + 64 bytes spare). Total usable capacity is 128 MB, with spare area reserved for ECC and bad-block management metadata. This structure is fixed and confirmed in the device's datasheet Revision E, Section 6.1.

Does the W29N01HVSINF TR support ONFI standards?

Yes, the W29N01HVSINF TR supports ONFI 1.0 identification via the READ ID command (90h followed by address 20h), returning four-byte ONFI signature "ONFI". It also supports the READ PARAMETER PAGE (ECh) command, delivering a standardized 256-byte parameter page compliant with ONFI 2.0 definitions-enabling automatic driver configuration in Linux MTD and other ONFI-aware hosts.

What package type does W29N01HVSINF TR use, and is it pin-compatible with other variants?

W29N01HVSINF TR uses the 48-pin TSOP1 package (Package Code S), 12 mm × 20 mm, with standard pinout per Figure 3-1 and Table 3.1. It shares identical pin assignment and signal mapping with the 48-ball VFBGA (Code D) variant-making them functionally interchangeable at the board level when mechanical constraints allow. The 63-ball VFBGA (Code B) differs in pin count and layout and is not pin-compatible.

How does the W29N01HVSINF TR handle bad blocks and invalid block management?

The W29N01HVSINF TR implements factory-marked initial invalid blocks (listed in parameter page) and supports dynamic invalid block detection during program/erase operations. Invalid blocks are managed via a Bad Block Table (BBT) stored in reserved blocks; the device provides dedicated commands (e.g., READ STATUS bit 0) to detect operation errors. Host firmware must implement BBT scanning and remapping-no built-in wear-leveling controller is present.

What is the role of the RY/#BY pin on the W29N01HVSINF TR, and how should it be interfaced?

The RY/#BY pin on the W29N01HVSINF TR is an open-drain output indicating device readiness: low during active read, program, or erase operations; high when idle or completed. It must be externally pulled up to Vcc (typically 4.7 kΩ). Software may poll RY/#BY directly or read STATUS register bit 6 (READY) for synchronous status checking-both methods are supported and documented in Section 9.1.5 and Table 9.4.