Winbond Electronics Corporation W29N01HWBINA

Overview

W29N01HWBINA from Winbond is a 1G-bit (128MB) SLC NAND Flash memory operating at 1.7–1.95V, organized into 1,024 blocks of 64 pages each (2,112 bytes/page), supporting x8 bus width in a 63-ball VFBGA package. It delivers 25ns sequential read access, 250μs typical page program time, and 2ms block erase time, targeting embedded storage in space-constrained industrial systems requiring reliable code shadowing and media data retention.

For engineers reviewing the W29N01HWBINA datasheet, W29N01HWBINA pinout, W29N01HWBINA application, or W29N01HWBINA equivalent, this device serves as a low-power, high-endurance (100,000 P/E cycles), ONFI-compatible NAND solution for boot code storage, firmware updates, and buffered logging in industrial controllers, medical edge devices, and automotive infotainment head units.

Technical Context

The W29N01HWBINA implements a standard NAND interface with multiplexed command/address/data on I/O[0–7], controlled by five dedicated signals: CLE, ALE, #CE, #WE, and #RE. Its internal architecture includes a 2,112-byte data register, column/row decoders, high-voltage generator, and status register - enabling full command set compliance including COPY BACK, READ PARAMETER PAGE (ECh), and READ STATUS (70h).

It supports both standard and extended operations: random data input/output within a page (85h/E0h), #CE-don't-care read and program modes, and hardware write protection via active-low #WP. The RY/#BY open-drain output provides asynchronous operation status feedback without requiring polling overhead.

Key Specifications

Pinout & Package

W29N01HWBINA is packaged in a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA), 9 mm × 11 mm footprint, with 1.0 mm ball pitch and x8 bus configuration (Package Code B). All Vcc and Vss balls must be connected per layout guidelines to ensure stable core and I/O voltage regulation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND Flash memory applications.

Compared with MT29F1G08ABAEAH4 and TC58CVG1S3HRAIJ, W29N01HWBINA offers superior 1.8V efficiency, faster typical program speed, and native ONFI parameter page support - making it optimal for new 1.8V SoC designs prioritizing power, timing predictability, and driver portability.

Availability

W29N01HWBINA is available at Aetrix Electronics and suitable for industrial control systems, medical edge instrumentation, and automotive infotainment platforms requiring stable component supply, long-term lifecycle assurance, and qualified SLC NAND performance.

Supply support for W29N01HWBINA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM for industrial, automotive, and consumer markets.

The W29N01HWBINA belongs to Winbond's W29N01HZ/WxxNA family of SLC NAND Flash devices, engineered specifically for embedded systems demanding high reliability, low voltage operation, and ONFI-standard interoperability in space- and power-constrained designs.

FAQ

What is the operating temperature range for W29N01HWBINA?

W29N01HWBINA is rated for Industrial Plus temperature operation from –40°C to +105°C. This specification is validated per JEDEC JESD22-A108 and applies to all functional operations including read, program, and erase - ensuring reliable performance in thermally demanding environments like engine compartments or sealed industrial enclosures.

Does W29N01HWBINA support ONFI compliance?

Yes, W29N01HWBINA supports ONFI 2.3-compliant commands and timing, including the READ PARAMETER PAGE (ECh) command that returns standardized vendor, timing, and feature descriptors. This enables automatic driver detection and simplifies integration with Linux MTD subsystems and U-Boot NAND drivers.

What is the spare area size per page in W29N01HWBINA?

Each page in W29N01HWBINA contains a 64-byte spare area, bringing the total page size to 2,112 bytes (2,048 main + 64 spare). This spare region is intended for ECC syndromes, logical-to-physical mapping metadata, and bad-block flags - and is accessible only via the READ STATUS and COPY BACK commands, not standard page reads.

How does the #WP pin function on W29N01HWBINA?

The #WP (Write Protect) pin on W29N01HWBINA is an active-low hardware lock that disables all program and erase operations when asserted. When #WP is pulled low, the device ignores incoming 80h/60h commands and returns status bit 2 = 1 (write-protected) on READ STATUS (70h). This provides fail-safe protection during power-up/down sequences.

Is W29N01HWBINA pin-compatible with other Winbond NAND devices?

W29N01HWBINA uses Package Code B (63-ball VFBGA, x8), which matches the pinout of other Winbond W29N01HZ/WxxNA variants in the same package - including W29N01GWxINA and W29N01HWxINA. However, it is not pin-compatible with TSOP1 or WLCSP variants due to differing ball layouts and signal assignments.