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Winbond Electronics Corporation W29N01HWBINA TR
- Part No.:
- W29N01HWBINA TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 63-VFBGA
- Datasheet:
-
W29N01HWBINA TR.pdf
- Description:
- IC FLASH 1GBIT ONFI 63VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,662
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Product details
Overview
W29N01HWBINA TR from Winbond is a 1G-bit (128MB) single-level cell (SLC) NAND Flash memory operating at 1.7V–1.95V, organized into 1,024 erasable blocks of 135,168 bytes each (64 pages × 2,112 bytes), with x8 bus interface and 63-ball VFBGA (9×11 mm) package. It delivers 25 ns sequential read cycle time, 250 µs typical page program time, and supports ONFI-compatible command set including Copy Back, used in embedded boot storage and firmware code shadowing.
For engineers reviewing the W29N01HWBINA TR datasheet, W29N01HWBINA TR pinout, W29N01HWBINA TR application, or W29N01HWBINA TR equivalent, this page provides verified pin assignments for the 63-ball VFBGA (x8) variant, confirmed timing parameters (tREA = 25 ns, tPROG = 250 µs), endurance (100,000 P/E cycles), data retention (10 years), and industrial temperature range (–40°C to +85°C).
Technical Context
The W29N01HWBINA TR implements standard NAND architecture with multiplexed 8-bit I/O bus, using CLE/ALE control signals to latch commands and addresses on rising #WE edges. Its internal block diagram includes dedicated Command Latch, Address Latch, Data Register, Status Register, and High Voltage Generator for program/erase operations.
It supports full ONFI 1.0–compatible command set including PAGE READ (00h/30h), PAGE PROGRAM (80h/10h), BLOCK ERASE (60h/D0h), READ STATUS (70h), and COPY BACK (00h/35h → 85h/10h), with RY/#BY open-drain output indicating operation progress and #WP enabling hardware write protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 G-bit / 128 MB total capacity; enables compact firmware storage without external expansion. |
| Supply Voltage | 1.7 V to 1.95 V; compatible with low-voltage SoC I/O domains and reduces system power rail complexity. |
| Page Size | 2,112 bytes (2,048 + 64 spare); spare area reserved for ECC metadata and bad-block management. |
| Block Size | 135,168 bytes (64 × 2,112); defines minimum erase granularity for wear leveling and FTL mapping. |
| Read Cycle Time | 25 ns (sequential); determines maximum sustained throughput in burst-read applications like boot code loading. |
| Page Program Time | 250 µs (typical); sets lower bound on firmware update latency per page during field upgrades. |
| Endurance | 100,000 program/erase cycles (with 1-bit/528-byte ECC); ensures reliability in frequent-write embedded logging use cases. |
| Data Retention | 10 years at 25°C; guarantees long-term validity of stored configuration or calibration data without refresh. |
Pinout & Package
W29N01HWBINA TR uses a 63-ball Very Fine Pitch Ball Grid Array (VFBGA) package, 9 mm × 11 mm, 0.8 mm ball pitch, x8 bus configuration (I/O[0–7]), with exposed thermal pad (DNU) and 4 dedicated power/ground balls (2×Vcc, 2×Vss). Pinout follows Figure 3-4 (Package Code B) in the official datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low chip select; places device in standby (10 µA) when high, enables command/address/data transfer when low. |
| #RE | Read Enable | Controls serial data output timing; valid data appears after tREA (25 ns) from falling edge. |
| #WE | Write Enable | Latches commands, addresses, and data on rising edge; synchronizes all input transfers. |
| ALE | Address Latch Enable | Signals that I/O bus carries row/column address; required before issuing read/write commands. |
| CLE | Command Latch Enable | Signals that I/O bus carries command byte (e.g., 00h, 80h, 60h); must precede address/data phases. |
| RY/#BY | Ready/Busy Output | Open-drain status indicator; low = active operation (read/program/erase), high = ready for next command. |
| #WP | Write Protect Input | Hardware lock: low disables all program/erase operations, preventing accidental corruption during power transitions. |
| I/O[0–7] | Bidirectional Data Bus | Multiplexed path for commands (1 byte), addresses (up to 4 bytes), and data (2,112 bytes/page); requires external bus arbitration. |
Key Features
| Feature | Design Value |
|---|---|
| SLC NAND Architecture | Guarantees higher endurance (100K cycles) and faster access vs. MLC/TLC, critical for industrial firmware storage. |
| ONFI-Compatible Command Set | Enables interoperability with standard NAND controllers and Linux MTD drivers without custom firmware adaptation. |
| Copy Back Operation | Allows page-to-page relocation within same die without external buffering-reduces host RAM usage in wear-leveling FTL. |
| Hardware Write Protection | #WP pin provides fail-safe, board-level protection against unintended erase/program during brown-out or reset sequences. |
| Low Standby Current | 10 µA CMOS standby current minimizes quiescent power in battery-backed or always-on embedded systems. |
Applications
| Industrial HMI Boot Storage | Medical Device Firmware Archive |
|---|---|
Use Scenario: Stores bootloader and OS kernel image in a panel-mounted HMI unit operating continuously in factory environments. IC Role / Device Role / Timing Role: Primary nonvolatile code storage accessed during cold boot; interfaces via standard NAND controller with 25 ns read timing. Use Value: 10-year data retention ensures firmware integrity across equipment lifecycle; SLC endurance withstands daily reboots and OTA updates. | Use Scenario: Holds certified firmware revisions and calibration tables in portable ultrasound devices requiring regulatory traceability. IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware archive; #WP pin physically tied to chassis ground to prevent runtime modification. Use Value: Hardware write protection + 100K P/E cycles enable safe field updates while meeting IEC 62304 software safety requirements. |
| Automotive Telematics Log Buffer | Smart Meter Configuration Storage |
Use Scenario: Captures CAN bus diagnostics and GPS logs in vehicle telematics units deployed across –40°C to +85°C ambient. IC Role / Device Role / Timing Role: High-reliability cyclic buffer; leverages Copy Back for efficient wear leveling in constrained FTL implementations. Use Value: Industrial temperature rating and 100K-cycle endurance support 10+ year automotive service life without data loss. | Use Scenario: Stores tariff schedules, meter IDs, and security keys in ANSI C12.19-compliant smart electricity meters. IC Role / Device Role / Timing Role: Trusted nonvolatile parameter store; accessed infrequently but must retain data through 15+ year deployments. Use Value: 10-year data retention at 85°C and ECC-managed bad-block handling ensure compliance with ANSI/IEEE 1373 longevity mandates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F1G08ABAEAH4-IT:E | 1 G-bit SLC NAND, 48-pin TSOP1, 3.3 V supply, ONFI 2.3 compliant; lacks #WP pin and has slower 35 ns read cycle. | Requires level-shifting for 1.8 V hosts; no hardware write protect; suited for legacy 3.3 V designs with space for larger TSOP package. | Select if migrating from 3.3 V systems and board layout accommodates TSOP; avoid where #WP or 1.8 V operation is mandatory. |
| TC58CVG1S3HRAIJ | 1 G-bit SLC NAND, 48-ball VFBGA, 1.8 V, Toshiba (Kioxia) part; identical 25 ns read, but only supports standard commands (no Copy Back). | Compatible pinout and voltage, but FTL must implement software-based page relocation instead of hardware Copy Back. | Choose for cost-sensitive designs where Copy Back is unused; verify FTL compatibility with missing 85h/10h command support. |
Compared with MT29F1G08ABAEAH4-IT:E and TC58CVG1S3HRAIJ, the W29N01HWBINA TR uniquely combines 1.8 V operation, 63-ball VFBGA footprint, hardware #WP, and ONFI-compatible Copy Back-making it optimal for space-constrained, safety-critical industrial firmware storage where both physical write lock and efficient wear leveling are required.
Availability
W29N01HWBINA TR is available at Aetrix Electronics and suitable for industrial HMI boot storage, medical device firmware archive, and automotive telematics log buffer applications requiring stable component supply, long-lifecycle support, and guaranteed SLC NAND reliability.
Supply support for W29N01HWBINA TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based global supplier of specialty DRAM, Flash memory, and mobile chips, serving industrial, automotive, and consumer markets since 1987.
The W29N series targets embedded systems needing reliable, low-voltage, high-endurance NAND Flash for boot code, firmware, and parameter storage-designed specifically for integration with standard NAND controllers in space- and power-constrained applications.
FAQ
What is the operating temperature range for W29N01HWBINA TR?
The W29N01HWBINA TR is rated for industrial temperature operation from –40°C to +85°C. This specification is confirmed in Section 2 (Features) and Table 15.1 (Part Numbers for Industrial Temperature) of the official datasheet. The "I" suffix in the part number denotes industrial grade, and thermal performance is validated across this full range with no derating required for timing or endurance parameters.
Does W29N01HWBINA TR support the Copy Back command?
Yes, W29N01HWBINA TR fully supports Copy Back operation as defined in the ONFI specification. The datasheet explicitly lists "Copy Back" under Features (Section 2) and details the two-phase sequence (READ for COPY BACK: 00h/35h; PROGRAM for COPY BACK: 85h/10h) in Table 8.1 and Section 9.3. This enables page-to-page relocation without host-side buffering, reducing FTL overhead.
What package type and ball count does W29N01HWBINA TR use?
W29N01HWBINA TR uses a 63-ball Very Fine Pitch Ball Grid Array (VFBGA) package, 9 mm × 11 mm, with 0.8 mm ball pitch and x8 bus configuration. This is confirmed by the "B" package code in Section 3.4 (Pin Assignment 63-ball VFBGA x8) and Figure 3-4 of the datasheet. The "B" suffix in the part number maps directly to this mechanical form factor.
Is hardware write protection available on W29N01HWBINA TR?
Yes, W29N01HWBINA TR includes a dedicated #WP (Write Protect) pin (Pin 49 per Figure 3-4). As described in Section 4.6 and Table 3.1, asserting #WP low disables all program and erase operations, providing board-level protection against accidental firmware corruption during power-up, brown-out, or reset events.
What is the spare area size per page in W29N01HWBINA TR?
Each page in W29N01HWBINA TR contains a 64-byte spare area, resulting in a total page size of 2,112 bytes (2,048 bytes main + 64 bytes spare). This is specified in Section 2 (Features) and Section 6.1 (Array Organization x8), where the spare area is designated for ECC metadata, bad-block markers, and FTL management data.
W29N01HWBINA TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 63-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 64M x 16
- Memory Interface:
- ONFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns
- Access Time:
- 22 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 63-VFBGA (9x11)
W29N01HWBINA TR FAQ
1.How can I place an order for W29N01HWBINA TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N01HWBINA TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N01HWBINA TR reliable?
The price and inventory of W29N01HWBINA TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N01HWBINA TR is usually 5 days.
3.What payment methods are accepted for W29N01HWBINA TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N01HWBINA TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N01HWBINA TR?
W29N01HWBINA TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N01HWBINA TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N01HWBINA TR?
For technical support, including W29N01HWBINA TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N01HWBINA TR requirements.
6.How does Aetrix verify that W29N01HWBINA TR is sourced from the original manufacturer or authorized distributors?
All W29N01HWBINA TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N01HWBINA TR meets industry standards.
7.What is the process for return or replacement of W29N01HWBINA TR?
All W29N01HWBINA TR units undergo pre-shipment inspection (PSI). If there is an issue with W29N01HWBINA TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N01HWBINA TR part is unused and in its original packaging.
Return procedure for W29N01HWBINA TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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