Winbond Electronics Corporation W29N01HWBINF

Overview

W29N01HWBINF from Winbond is a 1G-bit (128MB) single-level cell (SLC) NAND Flash memory operating at 1.7–1.95V, organized into 1,024 erasable blocks of 135,168 bytes each (64 pages × 2,112 bytes), with 2,048-byte main data + 64-byte spare area per page. It supports x8/x16 bus widths and is used in embedded boot code storage, industrial logging, and firmware update buffers where high endurance and 10-year data retention are required.

For engineers reviewing the W29N01HWBINF datasheet, W29N01HWBINF pinout, W29N01HWBINF application, or W29N01HWBINF equivalent, this device delivers deterministic timing (25ns sequential read, 250μs page program), ONFI-compatible command set including Copy Back, and industrial-plus temperature support (–40°C to +105°C) in a 63-ball VFBGA package.

Technical Context

The W29N01HWBINF implements a standard NAND interface with multiplexed I/O for commands, addresses, and data, controlled by five dedicated signals: CLE, ALE, #CE, #RE, and #WE. Its internal architecture includes a 2,112-byte data register, column/row decoders, high-voltage generator, and status register - enabling full compatibility with legacy NAND controllers without protocol translation.

It executes standardized operations including PAGE READ (00h–30h), PAGE PROGRAM (80h–10h), BLOCK ERASE (60h–D0h), and extended functions like COPY BACK and READ PARAMETER PAGE (ECh). All operations are governed by precise AC timing windows (e.g., tREA ≤ 25ns, tCLH ≥ 15ns) and validated under 1.8V ±5% supply conditions.

Key Specifications

Pinout & Package

W29N01HWBINF is packaged in a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) with 0.5 mm pitch, footprint code B, and dimensions of 9.0 mm × 11.0 mm × 1.0 mm max. The package supports both x8 and x16 configurations; this variant uses x8 bus width.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND Flash memory applications.

Compared with MT29F1G08ABAEAH4 and TC58CVG1S3HRAIJ, W29N01HWBINF uniquely combines Industrial Plus temperature qualification, ONFI parameter page support, and 100,000-cycle endurance in a 63-ball VFBGA - making it the only option for thermally demanding, controller-agnostic, and long-lifecycle embedded NAND applications.

Availability

W29N01HWBINF is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive telematics log buffering, and medical imaging device boot media requiring stable component supply, long-term lifecycle assurance, and guaranteed traceable sourcing.

Supply support for W29N01HWBINF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and voice ICs, with global manufacturing and quality certifications.

The W29N series targets high-reliability embedded systems needing SLC NAND performance, extended temperature operation, and ONFI interoperability - designed specifically for industrial, automotive, and medical applications where data integrity and longevity are non-negotiable.

FAQ

What is the exact memory organization of W29N01HWBINF?

W29N01HWBINF contains 1,024 erasable blocks, each consisting of 64 pages of 2,112 bytes (2,048 main + 64 spare). Total capacity is 138,412,032 bytes (128 MiB). This structure is fixed and confirmed in Section 6.1 of the datasheet for x8 configuration, which applies to W29N01HWBINF's 63-ball VFBGA package.

Does W29N01HWBINF support the ONFI standard?

Yes, W29N01HWBINF supports ONFI 1.0+ command definitions and includes READ PARAMETER PAGE (ECh) functionality, returning standardized geometry, timing, and feature flags. This enables automatic controller initialization without hard-coded timing parameters - a capability explicitly documented in Table 9.3 and Section 9.1.4 of the datasheet.

What is the function of the #WP pin on W29N01HWBINF?

The #WP (Write Protect) pin on W29N01HWBINF is an active-low hardware lock that disables all program and erase operations when asserted. When #WP is pulled low, the device ignores PAGE PROGRAM, BLOCK ERASE, and COPY BACK commands - preventing accidental firmware corruption during power transitions or software faults.

Which package type does W29N01HWBINF use?

W29N01HWBINF uses a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) package with footprint code B, 0.5 mm ball pitch, and mechanical dimensions of 9.0 mm × 11.0 mm × 1.0 mm max. Pin assignments for this variant are shown in Figure 3-4 and detailed in Section 3.4 of the datasheet.

What are the key timing specifications for W29N01HWBINF read operations?

W29N01HWBINF specifies 25 ns maximum sequential read cycle time (tRC) and 25 µs maximum random read access time (tR). These values are measured at 1.8V and define the minimum clock period for sustained data streaming and worst-case latency for byte-aligned reads - critical for real-time boot and logging applications.