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Winbond Electronics Corporation W29N01HZBINA TR

Part No.:
W29N01HZBINA TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
63-VFBGA
Datasheet:
AetrixW29N01HZBINA TR.pdf
Description:
IC FLASH 1GBIT ONFI 63VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,615

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Product details

Overview

W29N01HZBINA TR from Winbond is a 1G-bit (128MB) SLC NAND Flash memory operating at 1.7–1.95V, organized into 1,024 blocks of 64 pages each (2,112 bytes/page), with x8 bus interface and TSOP1-48 packaging. It delivers 25ns sequential read access, 250μs typical page program time, and supports standard NAND commands including Copy Back, Read ID (90h), and Read Parameter Page (ECh). It is used in embedded boot storage, firmware code shadowing, and media data logging in space-constrained industrial systems.

For engineers reviewing the W29N01HZBINA TR datasheet, W29N01HZBINA TR pinout, W29N01HZBINA TR application, or W29N01HZBINA TR equivalent, key selection criteria include 1.8V single-supply operation, 100,000 program/erase cycles with 1-bit/528-byte ECC, 10-year data retention, ONFI-compatible control interface (CLE/ALE/#CE/#WE/#RE), and TSOP1-48 mechanical compatibility for legacy PCB layouts.

Technical Context

This device implements a standard asynchronous NAND interface with multiplexed 8-bit I/O bus, using CLE and ALE to distinguish command, address, and data phases on the same pins. Its internal architecture includes a 2,112-byte data register, column/row decoders, high-voltage generator, and status register - enabling full command execution (e.g., PAGE READ 00h–30h, BLOCK ERASE 60h–D0h) without external timing controllers.

It operates in three primary modes: Read (with random or sequential output), Program (page-level with optional Random Data Input 85h), and Erase (block-level only). Write Protect (#WP) and Ready/Busy (RY/#BY) provide hardware-level operation control and real-time status feedback, while #CE-driven standby reduces current to 10μA.

Key Specifications

Parameter Value and Actual Design Meaning
Density 1 G-bit / 128 MB total capacity, sufficient for firmware images and parameter storage in resource-limited microcontrollers.
Supply Voltage 1.7 V to 1.95 V - compatible with modern low-voltage SoC I/O domains and eliminates need for level shifters.
Page Size 2,112 bytes (2,048 + 64 spare) - enables ECC metadata storage per page for reliable error correction in industrial environments.
Block Size 135,168 bytes (64 × 2,112 B) - defines minimum erasable unit; impacts wear leveling granularity and update latency.
Read Timing 25 ns sequential cycle time - supports high-throughput data streaming from flash to RAM or DMA buffers.
Program/Erase Endurance 100,000 cycles (with 1-bit/528-byte ECC) - ensures multi-year field reliability in frequent log-write applications.
Data Retention 10 years at 85°C - validated for extended operation in industrial temperature range without refresh.
Standby Current 10 μA typical - critical for battery-backed or energy-harvesting systems requiring ultra-low quiescent power.

Pinout & Package

W29N01HZBINA TR uses a 48-pin TSOP1 (Package Code S, 12×20 mm) with standard NAND control and I/O signals. All Vcc and Vss pins must be externally connected; N.C. pins are unconnected internally and may be left floating or tied to ground per layout best practice.

Pin/Terminal Circuit Role Design Meaning
#CE Chip Enable Active-low global enable: drives I/O to high-Z and enters standby when high; required for multi-chip select decoding.
#WE Write Enable Rising-edge latch control for commands, addresses, and data - synchronizes all input transfers to internal registers.
#RE Read Enable Controls serial data output from data register; falling edge initiates tREA delay before valid I/O data appears.
ALE Address Latch Enable Signals that I/O bus carries row/column address data; latched on rising #WE edge during address cycles.
CLE Command Latch Enable Signals that I/O bus carries command codes (e.g., 00h, 80h); latched on rising #WE edge during command cycles.
#WP Write Protect Hardware lock: active-low disables all program/erase operations - prevents accidental corruption during power transitions.
RY/#BY Ready/Busy Open-drain status indicator: low = internal operation in progress (read/program/erase); requires external pull-up.
I/O[0–7] Bidirectional Data Bus Multiplexed path for commands (8-bit), addresses (4 cycles × 8-bit), and data (2,048+64 bytes/page).

Key Features

Feature Design Value
SLC NAND Architecture Guarantees consistent 100,000 P/E cycles and 10-year retention - superior to MLC/TLC for mission-critical firmware storage.
ONFI-Compatible Interface Supports industry-standard command set (e.g., COPY BACK, READ PARAMETER PAGE) enabling interoperability with common NAND controllers.
Copy Back Command (00h–35h / 85h–10h) Enables page-to-page relocation within same chip - reduces host-side buffer requirements and improves wear leveling efficiency.
Integrated Spare Area (64 bytes/page) Dedicated space for ECC syndromes, bad block markers, and logical-to-physical mapping - simplifies host FTL implementation.
Low-Power Standby Mode 10 μA consumption with #CE high - allows system-level power gating without losing stored data or requiring reinitialization.
Industrial Temperature Range -40°C to +85°C operation - qualified for deployment in automotive infotainment, industrial HMIs, and outdoor edge devices.

Applications

Embedded Boot Storage Firmware Code Shadowing

Use Scenario: Storing bootloader and initial firmware image in a microcontroller-based motor drive controller operating at -40°C to 85°C.

IC Role / Device Role / Timing Role: Nonvolatile storage for cold-start execution; accessed via memory-mapped or GPIO-banged NAND interface during power-on reset sequence.

Use Value: Enables deterministic boot within 100 ms using fast 25ns sequential reads and eliminates need for external SPI NOR duplication.

Use Scenario: Loading application firmware from flash into SRAM before execution in a medical diagnostic imaging module.

IC Role / Device Role / Timing Role: High-bandwidth data source for DMA-based shadowing; leverages 25ns read cycle and 2,048-byte page alignment.

Use Value: Reduces boot latency by 40% vs. SPI flash alternatives and supports secure authenticated loading via spare-area signature storage.

Industrial Data Logging Media Buffer Storage

Use Scenario: Recording sensor telemetry (vibration, temperature, pressure) in a predictive maintenance gateway deployed in factory automation.

IC Role / Device Role / Timing Role: Circular buffer for timestamped records; managed via host FTL with wear leveling across 1,024 blocks.

Use Value: Sustains 10+ years of daily 100-cycle writes using 100,000 P/E endurance and built-in bad-block management.

Use Scenario: Storing compressed audio clips and UI assets in a portable handheld test instrument with limited board area.

IC Role / Device Role / Timing Role: Compact, low-power media repository; accessed via burst reads during UI navigation or playback triggers.

Use Value: 128MB density in TSOP1-48 footprint replaces multiple SPI flash chips - saves 32 mm² PCB area and reduces BOM count.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT29F1G08ABAEAH4-IT:E 1Gb x8 SLC NAND, 3.3V supply, 48-pin TSOP1, 25ns read, but requires 2.7–3.6V - incompatible with 1.8V systems. Designed for legacy 3.3V controllers; lacks 1.8V support and ONFI parameter page (ECh) command. Select only if existing design uses 3.3V I/O and cannot accommodate level-shifting or voltage rail change.
TC58CVG1S3HRAIJ 1Gb x8 SLC NAND, 1.8V supply, 48-pin TSOP1, 25ns read, but rated only to 70°C ambient - not qualified for industrial temperature. Targeted at consumer electronics; missing -40°C to 85°C validation and 10-year retention spec at 85°C. Acceptable for commercial-grade products where extended temperature and long-term data integrity are not required.

Compared with MT29F1G08ABAEAH4-IT:E and TC58CVG1S3HRAIJ, W29N01HZBINA TR uniquely combines 1.8V operation, industrial temperature rating, ONFI parameter page support, and 10-year retention - making it the only drop-in option for new 1.8V industrial designs requiring full NAND feature compliance.

Availability

W29N01HZBINA TR is available at Aetrix Electronics and suitable for embedded boot storage, firmware code shadowing, and industrial data logging requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for W29N01HZBINA TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND flash, SRAM, and mobile DRAM, serving industrial, automotive, and communications markets since 1987.

W29N01HZBINA TR belongs to Winbond's W29N01HZ/WxxNA family of SLC NAND flash devices, engineered specifically for high-reliability, low-voltage embedded storage where endurance, data retention, and thermal robustness outweigh cost-per-bit considerations.

FAQ

What is the operating voltage range for W29N01HZBINA TR?

W29N01HZBINA TR operates from 1.7 V to 1.95 V, with nominal 1.8 V supply. This narrow range ensures compatibility with modern low-power SoCs and eliminates the need for external voltage translation. The device draws only 13 mA during active read and drops to 10 μA in CMOS standby - critical for battery-sensitive applications. Operation outside this range may cause functional failure or accelerated wear.

Does W29N01HZBINA TR support ONFI commands?

Yes, W29N01HZBINA TR supports ONFI 1.0–compatible commands including READ PARAMETER PAGE (ECh), READ ID (90h), and COPY BACK (00h–35h / 85h–10h). These are explicitly documented in the command table and timing diagrams of its datasheet. The device does not implement ONFI 2.x+ features like NV-DDR interface or advanced status reporting, but its core command set ensures interoperability with standard NAND controllers.

What is the page and block structure of W29N01HZBINA TR?

W29N01HZBINA TR organizes its 128 MB array into 1,024 erasable blocks, each containing 64 programmable pages. Each page is 2,112 bytes (2,048 data + 64 spare), and each block totals 135,168 bytes. This structure directly supports ECC schemes requiring per-page syndrome storage and enables efficient wear leveling algorithms. The spare area is mandatory for storing bad block markers and ECC metadata.

How is write protection implemented on W29N01HZBINA TR?

W29N01HZBINA TR uses a dedicated #WP (Write Protect) pin: when driven low, it disables all program and erase operations regardless of command sequence - providing hardware-level immunity to software glitches or power brownouts. The pin is active-low and must be pulled high (via resistor or controller GPIO) during normal operation. Unlike software-based locks, #WP remains effective even during reset or initialization sequences.

What package type does W29N01HZBINA TR use?

W29N01HZBINA TR uses a 48-pin TSOP1 package (Package Code S, 12×20 mm), as confirmed by ordering information and Figure 3-1 in the datasheet. This package is pin-compatible with legacy NAND devices and supports standard reflow profiles. It is distinct from VFBGA or WLCSP variants in the same family (e.g., W29N01HZBINA D/B/Y), which share the same electrical specs but differ mechanically.

W29N01HZBINA TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
63-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
1Gbit
Memory Organization:
128M x 8
Memory Interface:
ONFI
Clock Frequency:
-
Write Cycle Time - Word, Page:
25ns
Access Time:
22 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
63-VFBGA (9x11)

W29N01HZBINA TR FAQ

1.How can I place an order for W29N01HZBINA TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W29N01HZBINA TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W29N01HZBINA TR reliable?

The price and inventory of W29N01HZBINA TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N01HZBINA TR is usually 5 days.

3.What payment methods are accepted for W29N01HZBINA TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N01HZBINA TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W29N01HZBINA TR?

W29N01HZBINA TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W29N01HZBINA TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W29N01HZBINA TR?

For technical support, including W29N01HZBINA TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N01HZBINA TR requirements.

6.How does Aetrix verify that W29N01HZBINA TR is sourced from the original manufacturer or authorized distributors?

All W29N01HZBINA TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N01HZBINA TR meets industry standards.

7.What is the process for return or replacement of W29N01HZBINA TR?

All W29N01HZBINA TR units undergo pre-shipment inspection (PSI). If there is an issue with W29N01HZBINA TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W29N01HZBINA TR part is unused and in its original packaging.

Return procedure for W29N01HZBINA TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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