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Winbond Electronics Corporation W29N01HZBINF
- Part No.:
- W29N01HZBINF
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 63-VFBGA
- Datasheet:
-
W29N01HZBINF.pdf
- Description:
- IC FLASH 1GBIT PAR 63VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,957
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Product details
Overview
W29N01HZBINF from Winbond is a 1G-bit (128MB) Single-Level Cell (SLC) NAND Flash memory operating at 1.7–1.95V, organized into 1,024 erasable blocks of 135,168 bytes each, with 64 pages per block (2,112 bytes/page), supporting x8/x16 bus widths and used for code shadowing, firmware storage, and media buffering in space-constrained embedded systems.
For engineers reviewing the W29N01HZBINF datasheet, W29N01HZBINF pinout, W29N01HZBINF application, or W29N01HZBINF equivalent, this page delivers verified electrical specs, validated TSOP1/VFBGA/WLCSP package mappings, confirmed ONFI-compatible command set support, and real-world endurance and timing data for industrial-grade boot code and log storage designs.
Technical Context
The W29N01HZBINF implements a standard NAND interface with multiplexed I/O bus handling commands, addresses, and data via dedicated CLE and ALE control lines. Its internal architecture includes a 2,112-byte data register, column/row decoders, high-voltage generator, and status register - enabling full compatibility with legacy NAND controllers.
It supports ONFI-compliant operations including PAGE READ (00h–30h), PAGE PROGRAM (80h–10h), BLOCK ERASE (60h–D0h), COPY BACK, and READ PARAMETER PAGE (ECh), with deterministic timing: 25ns sequential read cycle, 250μs typical page program, and 2ms typical block erase - all specified at 1.8V and industrial temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 G-bit / 128 MB total capacity - sufficient for full firmware images or multi-channel sensor log buffers. |
| Supply Voltage | 1.7 V to 1.95 V - enables direct integration with 1.8V logic domains without level-shifting. |
| Page Size | 2,112 bytes (2,048 + 64 spare) - spare area reserved for ECC metadata and bad-block management. |
| Block Size | 135,168 bytes (64 × 2,112) - matches common file system erase-unit alignment requirements. |
| Endurance | 100,000 program/erase cycles - validated with 1-bit/528-byte ECC correction capability. |
| Data Retention | 10 years at 85°C - meets long-life industrial deployment requirements without refresh. |
| Read Timing | 25 ns sequential cycle time - supports high-throughput streaming in multimedia or telemetry applications. |
| Operating Temp | −40°C to +85°C - qualified for automotive infotainment, industrial HMIs, and outdoor edge devices. |
Pinout & Package
W29N01HZBINF is packaged in a 48-pin TSOP1 (Package Code S), with dimensions 12 mm × 20 mm. Pin assignments follow JEDEC-standard NAND interface layout, supporting both x8 and x16 configurations depending on board routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low chip select; places device in standby (10 μA) when high, enabling multi-chip addressing. |
| #WE | Write Enable | Latches commands, addresses, and data on rising edge - critical for timing-critical NAND protocol compliance. |
| #RE | Read Enable | Controls serial data output from register; tREA = 25 ns max ensures predictable read latency. |
| ALE | Address Latch Enable | Signals that I/O bus carries row/column address - required for correct address decoding during access. |
| CLE | Command Latch Enable | Signals that I/O bus carries command byte (e.g., 00h, 80h, 60h) - essential for state-machine initialization. |
| #WP | Write Protect | Hardware lock: low disables all program/erase - prevents accidental corruption during power transitions. |
| RY/#BY | Ready/Busy | Open-drain status indicator; low during operation - eliminates need for polling in interrupt-driven drivers. |
| I/O[0–7] | Bidirectional Data Bus | Multiplexed path for commands, addresses, and data - reduces pin count vs parallel NOR, saving PCB area. |
| Vcc / Vss | Power / Ground | Multiple Vcc/Vss pins ensure stable 1.8V supply delivery and low-noise operation in dense layouts. |
Key Features
| Feature | Design Value |
|---|---|
| SLC NAND Architecture | Guarantees 100K P/E cycles and 10-year retention - superior reliability vs MLC/TLC in mission-critical firmware storage. |
| ONFI-Compatible Command Set | Supports standardized commands (ECh, 00h–30h, 80h–10h) - simplifies migration from other ONFI-compliant NANDs. |
| Copy Back Function | Enables page-to-page relocation within same die - reduces wear leveling overhead and improves write efficiency. |
| Low-Power Operation | 13 mA active read current and 10 μA standby - extends battery life in portable and always-on edge devices. |
| Multi-Package Support | Available in TSOP1, 48/63-ball VFBGA, and 68-ball WLCSP - enables layout optimization across cost, size, and thermal constraints. |
Applications
| Industrial HMI Firmware Storage | Automotive Infotainment Boot Memory |
|---|---|
|
Use Scenario: Storing boot loader and OS kernel in factory-programmed HMIs requiring field-upgradable firmware. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with fast random read (25 μs) for rapid boot sequence execution. Use Value: 100K-cycle endurance ensures >10 years of safe OTA updates without degradation risk. |
Use Scenario: Holding certified infotainment firmware images in vehicles where qualification and long-term stability are mandatory. IC Role / Device Role / Timing Role: Secure, temperature-hardened NAND for ASIL-B-aligned boot partition with hardware write protection (#WP). Use Value: −40°C to +85°C rating and 10-year data retention meet automotive lifecycle requirements without refresh. |
| Medical Device Log Buffer | Smart Meter Firmware & Event History |
|
Use Scenario: Capturing timestamped diagnostic logs in portable ultrasound or patient monitors with limited PCB space. IC Role / Device Role / Timing Role: High-density, low-power NAND for cyclic overwrite of time-series sensor data. Use Value: 128 MB capacity accommodates months of compressed logs; 10 μA standby minimizes battery drain. |
Use Scenario: Storing firmware, tariff tables, and decade-long consumption history in utility smart meters deployed outdoors. IC Role / Device Role / Timing Role: Industrial-temperature NAND with robust ECC handling for unattended, maintenance-free operation. Use Value: Built-in spare area (64 bytes/page) enables field-proven BCH error correction for extended field life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F1G08ABAEAH4-IT:E | 1Gb SLC NAND, 3.3V supply, x8 only, 48-pin TSOP1 - higher voltage, no x16 mode. | Requires level-shifting in 1.8V systems; lacks RY/#BY open-drain drive strength matching. | Select only if existing 3.3V infrastructure prohibits 1.8V redesign. |
| TC58CVG1S3HRAIJ | 1Gb SLC NAND, 1.8V, x8/x16, 48-ball VFBGA - identical voltage and bus flexibility, but different pinout and timing (tRC = 25ns same). | Same functional scope but requires PCB redesign due to incompatible ball map and package footprint. | Prefer for new VFBGA-based designs where smaller form factor outweighs layout rework cost. |
Compared with MT29F1G08ABAEAH4-IT:E and TC58CVG1S3HRAIJ, the W29N01HZBINF uniquely combines 1.8V operation, TSOP1 compatibility, x8/x16 flexibility, and ONFI parameter page support - making it optimal for cost-sensitive, pin-constrained industrial controllers needing drop-in firmware storage upgrades.
Availability
W29N01HZBINF is available at Aetrix Electronics and suitable for industrial HMIs, automotive infotainment systems, and medical data loggers requiring stable component supply, long-lifecycle assurance, and guaranteed SLC NAND performance.
Supply support for W29N01HZBINF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and audio codecs, serving industrial, automotive, and consumer markets since 1987.
The W29N01HZ series belongs to Winbond's industrial-grade SLC NAND product line, designed specifically for reliable, long-life code and data storage in resource-constrained embedded systems where endurance and temperature stability are critical.
FAQ
What is the exact memory organization of the W29N01HZBINF?
The W29N01HZBINF contains 1,024 erasable blocks, each consisting of 64 programmable pages of 2,112 bytes (2,048 main + 64 spare). Total capacity is 138,412,032 bytes (128 MB), with block-level erase granularity and page-level program capability - fully documented in Section 6.1 of the official datasheet.
Does the W29N01HZBINF support ONFI standards?
Yes, the W29N01HZBINF supports ONFI 1.0+ command extensions including READ PARAMETER PAGE (ECh) and standardized ID codes (Table 9.2). Its pinout, timing, and command set align with ONFI-compliant controllers, enabling interoperability without custom driver development.
What package type does W29N01HZBINF use, and is it pin-compatible with other Winbond NANDs?
W29N01HZBINF uses the 48-pin TSOP1 package (Code S), 12 mm × 20 mm. It shares the same pinout as other Winbond W29N01HZ variants in TSOP1, but is not pin-compatible with VFBGA or WLCSP versions due to differing ball/grid layouts and signal assignments.
How is endurance guaranteed for the W29N01HZBINF?
W29N01HZBINF guarantees 100,000 program/erase cycles when used with 1-bit-per-528-byte ECC correction, as specified in Note 1 of the Features section. This endurance rating is measured under industrial temperature conditions and reflects real-world SLC NAND reliability with proper controller-level ECC implementation.
Can the W29N01HZBINF operate in x16 mode, and what changes are required?
Yes, the W29N01HZBINF supports x16 bus width, but only in VFBGA and WLCSP packages - the TSOP1 version (W29N01HZBINF) is x8-only. To use x16 mode, a compatible package variant (e.g., W29N01HZBIBF) and controller with x16 NAND interface support are required.
W29N01HZBINF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 63-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 40 MHz
- Write Cycle Time - Word, Page:
- 25ns
- Access Time:
- 25 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 63-VFBGA (9x11)
W29N01HZBINF FAQ
1.How can I place an order for W29N01HZBINF through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N01HZBINF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N01HZBINF reliable?
The price and inventory of W29N01HZBINF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N01HZBINF is usually 5 days.
3.What payment methods are accepted for W29N01HZBINF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N01HZBINF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N01HZBINF?
W29N01HZBINF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N01HZBINF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N01HZBINF?
For technical support, including W29N01HZBINF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N01HZBINF requirements.
6.How does Aetrix verify that W29N01HZBINF is sourced from the original manufacturer or authorized distributors?
All W29N01HZBINF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N01HZBINF meets industry standards.
7.What is the process for return or replacement of W29N01HZBINF?
All W29N01HZBINF units undergo pre-shipment inspection (PSI). If there is an issue with W29N01HZBINF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N01HZBINF part is unused and in its original packaging.
Return procedure for W29N01HZBINF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29N01HZBINF Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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AT24C08C-STUM-T
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