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Winbond Electronics Corporation W29N01HZBINF TR
- Part No.:
- W29N01HZBINF TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 63-VFBGA
- Datasheet:
-
W29N01HZBINF TR.pdf
- Description:
- IC FLASH 1GBIT ONFI 63VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,808
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Product details
Overview
W29N01HZBINF TR from Winbond is a 1G-bit (128MB) Single-Level Cell (SLC) NAND Flash memory operating at 1.7–1.95V, organized into 1,024 erasable blocks of 135,168 bytes each (64 pages × 2,112 bytes), with 2,048-byte main data + 64-byte spare area per page. It supports x8/x16 bus width and delivers 25ns sequential read cycle time, 250μs typical page program time, and 2ms typical block erase time - enabling use in embedded boot storage, firmware code shadowing, and industrial data logging.
For engineers reviewing the W29N01HZBINF TR datasheet, W29N01HZBINF TR pinout, W29N01HZBINF TR application, or W29N01HZBINF TR equivalent, key selection criteria include its 1.8V single-supply operation, ONFI-compatible command set (including Copy Back), 100,000 P/E cycles with 4-bit/528-byte ECC, and support for TSOP1 and VFBGA packages with validated 48-pin and 63-ball configurations.
Technical Context
This SLC NAND device implements a multiplexed I/O interface with five dedicated control signals (#CE, #RE, #WE, CLE, ALE) to manage command, address, and data latching on shared pins - eliminating need for separate address/data buses. Its internal logic includes a status register, data register, high-voltage generator, and column/row decode units, enabling full compatibility with standard NAND host controllers.
It supports ONFI-identifiable parameter page reads (ECh), Read ID (90h), Read Status (70h), and Copy Back operations (00h-35h / 85h-10h), with RY/#BY open-drain output for real-time operation monitoring and #WP input for hardware write protection - all compliant with JEDEC-standard NAND timing and command protocols.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 G-bit (128 MB total capacity), sufficient for full firmware images or media buffers in space-constrained systems. |
| Supply Voltage | 1.7 V to 1.95 V - enables direct integration with 1.8V logic domains without level-shifting. |
| Page Size | 2,112 bytes (2,048 + 64-byte spare) - spare area reserved for ECC metadata and bad-block management. |
| Block Size | 135,168 bytes (64 × 2,112-byte pages) - defines minimum erasable unit for wear leveling and FTL mapping. |
| Read Performance | 25 ns sequential read cycle - supports high-throughput streaming from contiguous pages. |
| Endurance | 100,000 program/erase cycles - specified with 4-bit/528-byte ECC, enabling long-term reliability in industrial logging. |
| Data Retention | 10 years at 85°C - validated for extended operation in industrial temperature environments. |
| Interface Bus | Multiplexed x8 or x16 I/O - reduces pin count vs parallel NOR; requires external controller with NAND protocol stack. |
Pinout & Package
W29N01HZBINF TR is packaged in a 48-pin TSOP1 (package code S, 12 mm × 20 mm), with all power (Vcc, Vss), control (#CE, #RE, #WE, CLE, ALE, #WP, RY/#BY), and bidirectional I/O[0–7] pins physically defined and electrically validated per datasheet Figures 3-1 and Table 3.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low chip select; places device in standby (10 µA) when high, enabling multi-chip addressing. |
| #RE | Read Enable | Controls serial data output timing; valid data appears after tREA delay from falling edge. |
| #WE | Write Enable | Latches commands, addresses, and data on rising edge - central to all write and address setup cycles. |
| CLE | Command Latch Enable | Enables command input to command register when high; distinguishes command from address/data. |
| ALE | Address Latch Enable | Enables address input to address register when high; separates address transfers from other bus activity. |
| #WP | Write Protect | Hardware lock: disables all program/erase when low - prevents accidental corruption during power transitions. |
| RY/#BY | Ready/Busy Output | Open-drain status signal; low during active operations (read/program/erase), high when ready for next command. |
| I/O[0–7] | Bidirectional Data Bus | Shared path for commands (e.g., 00h, 30h), addresses (4-cycle row/column), and 2,112-byte page data. |
Key Features
| Feature | Design Value |
|---|---|
| ONFI-Compatible Command Set | Supports ECh (Parameter Page), 90h (Read ID), 70h (Read Status), and Copy Back - ensures interoperability with standard NAND controllers. |
| Copy Back Operation | Enables page-to-page data relocation within same device (00h-35h + 85h-10h), reducing host-side buffering and improving wear-leveling efficiency. |
| Industrial Temperature Range | -40°C to +85°C operation - validated across full voltage and timing specs, suitable for automotive infotainment and industrial HMIs. |
| Low-Power Standby | 10 µA CMOS standby current - critical for battery-backed or energy-harvesting embedded systems requiring persistent storage. |
| Hardware Write Protection | #WP pin provides deterministic, glitch-immune lock against unintended writes - essential for firmware integrity in unattended deployments. |
Applications
| Embedded Boot Storage | Firmware Code Shadowing |
|---|---|
|
Use Scenario: Storing bootloader and kernel images in industrial gateways where fast, reliable startup is required after cold power-on. IC Role / Device Role / Timing Role: Nonvolatile storage medium holding executable code; accessed via NAND controller during early boot sequence before DRAM initialization. Use Value: 25ns read cycle and 25µs random read enable rapid instruction fetch; 100K P/E cycles ensure field-upgrade longevity over 5+ years. |
Use Scenario: Loading firmware binaries from flash into RAM for execution in medical imaging devices with strict safety certification requirements. IC Role / Device Role / Timing Role: Persistent code repository supporting copy-back and ECC-managed read-after-write verification. Use Value: 4-bit/528-byte ECC and 10-year data retention meet IEC 62304 Class C software lifecycle demands without external error correction overhead. |
| Industrial Data Logging | Edge AI Model Storage |
|
Use Scenario: Recording sensor telemetry in oil-field PLCs operating continuously at 85°C ambient with no maintenance windows. IC Role / Device Role / Timing Role: Wear-leveled, block-erasable storage for timestamped binary logs; managed by lightweight FTL in microcontroller. Use Value: 2ms block erase and 100K endurance allow >100 daily log rotations over 10 years; -40°C to +85°C rating ensures operation in harsh enclosures. |
Use Scenario: Storing quantized neural network weights and inference parameters in smart cameras deployed in factory automation. IC Role / Device Role / Timing Role: High-density, low-pin-count storage for static AI assets; accessed sequentially during model load prior to inference. Use Value: 128MB capacity accommodates multiple model versions; x16 bus option doubles throughput for faster cold-start inference initialization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SLC NAND flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F1G08ABAEAH4-IT:E | 1Gb SLC NAND, 3.3V supply, 48-pin TSOP1, ONFI 2.3 compliant; higher Vcc (2.7–3.6V) incompatible with 1.8V systems. | Requires level-shifting or separate power rail; not drop-in for 1.8V designs using W29N01HZBINF TR. | Select only if system already uses 3.3V NAND interface and needs ONFI 2.3 features like synchronous timing. |
| TC58CVG1S3HRAIJ | 1Gb SLC NAND, 1.8V supply, 48-ball VFBGA, Toshiba (Kioxia) part; identical voltage and density but different pinout and timing (tRC = 25ns same, tPROG = 300μs). | Same voltage domain and package footprint possible, but requires PCB redesign due to ball map mismatch and revised timing margins. | Consider for new designs prioritizing Kioxia supply chain; verify RY/#BY timing and Copy Back command support against host controller firmware. |
Compared with MT29F1G08ABAEAH4-IT:E and TC58CVG1S3HRAIJ, W29N01HZBINF TR offers native 1.8V operation without level shifters, validated TSOP1 pinout for legacy board reuse, and guaranteed Copy Back support - making it optimal for cost-sensitive, space-constrained industrial controllers needing firmware resilience and field-upgrade capability.
Availability
W29N01HZBINF TR is available at Aetrix Electronics and suitable for embedded boot storage, firmware code shadowing, and industrial data logging requiring stable component supply, long-lifecycle availability, and traceable sourcing.
Supply support for W29N01HZBINF TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including SPI NOR, NAND Flash, and SRAM products for industrial, automotive, and computing markets.
W29N01HZBINF TR belongs to Winbond's W29N01HZ/WxxNF SLC NAND family, designed specifically for high-reliability embedded applications demanding 1.8V operation, industrial temperature tolerance, and robust ECC-managed data integrity.
FAQ
What is the operating voltage range for W29N01HZBINF TR?
W29N01HZBINF TR operates from 1.7 V to 1.95 V, with nominal 1.8 V supply. This narrow range eliminates need for external voltage regulation in 1.8V logic systems and ensures stable timing across temperature - confirmed in Section 10.2 "Operating Ranges (1.8V)" of the datasheet. All DC and AC specifications, including 25ns read cycle and 250μs program time, are guaranteed within this window.
Does W29N01HZBINF TR support Copy Back operations?
Yes, W29N01HZBINF TR fully supports Copy Back via the READ for COPY BACK (00h-35h) and PROGRAM for COPY BACK (85h-10h) command sequences, as documented in Sections 9.3.1–9.3.2 and Table 8.1. This feature enables internal page-to-page data relocation without host-side buffering - critical for efficient wear leveling and garbage collection in resource-constrained controllers.
What package type does W29N01HZBINF TR use?
W29N01HZBINF TR uses a 48-pin TSOP1 package (package code S, 12 mm × 20 mm), as explicitly stated in Section 3.1 and Figure 3-1 of the datasheet. Pin assignments match the standard x8 configuration with dedicated #CE, #RE, #WE, CLE, ALE, #WP, RY/#BY, Vcc, Vss, and I/O[0–7] - verified in Tables 3.1 and 6.1.
How many program/erase cycles is W29N01HZBINF TR rated for?
W29N01HZBINF TR is rated for 100,000 program/erase cycles, as specified in Section 2 "FEATURES" and Table 10.7 "Program and Erase Characteristics". This endurance is guaranteed when used with 4-bit/528-byte ECC, as noted in the footnote to Section 2 - ensuring reliable operation in firmware update and data logging applications over multi-year deployments.
Is W29N01HZBINF TR compatible with ONFI standards?
W29N01HZBINF TR supports ONFI-identifiable parameter page reads (command ECh) and reports ONFI identifying codes at Address 20h (Table 9.2), confirming baseline ONFI compatibility for host controller detection and configuration. However, it does not implement ONFI 2.x synchronous interface modes - its timing adheres to standard asynchronous NAND protocols per Section 10.7–10.8.
W29N01HZBINF TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 63-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- ONFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns
- Access Time:
- 22 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 63-VFBGA (9x11)
W29N01HZBINF TR FAQ
1.How can I place an order for W29N01HZBINF TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N01HZBINF TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N01HZBINF TR reliable?
The price and inventory of W29N01HZBINF TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N01HZBINF TR is usually 5 days.
3.What payment methods are accepted for W29N01HZBINF TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N01HZBINF TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N01HZBINF TR?
W29N01HZBINF TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N01HZBINF TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N01HZBINF TR?
For technical support, including W29N01HZBINF TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N01HZBINF TR requirements.
6.How does Aetrix verify that W29N01HZBINF TR is sourced from the original manufacturer or authorized distributors?
All W29N01HZBINF TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N01HZBINF TR meets industry standards.
7.What is the process for return or replacement of W29N01HZBINF TR?
All W29N01HZBINF TR units undergo pre-shipment inspection (PSI). If there is an issue with W29N01HZBINF TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N01HZBINF TR part is unused and in its original packaging.
Return procedure for W29N01HZBINF TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29N01HZBINF TR Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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