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Winbond Electronics Corporation W29N01HZDINA
- Part No.:
- W29N01HZDINA
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
W29N01HZDINA.pdf
- Description:
- IC FLASH 1GBIT 48-VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,595
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Product details
Overview
W29N01HZDINA from Winbond is a 1G-bit (128MB) single-level cell (SLC) NAND Flash memory operating at 1.7V–1.95V, organized into 1,024 erasable blocks of 135,168 bytes each (64 pages × 2,112 bytes), with x8 bus interface and 48-ball VFBGA (Package Code D) packaging. It delivers 25ns sequential read access, 250μs typical page program time, and supports standard NAND commands including Copy Back, Read ID, and Read Parameter Page - deployed in embedded boot storage and firmware code shadowing applications.
For engineers reviewing the W29N01HZDINA datasheet, W29N01HZDINA pinout, W29N01HZDINA application, or W29N01HZDINA equivalent, this page provides verified pin assignments for the 48-ball VFBGA (x8) variant, confirmed timing parameters (tREA = 25μs, tPROG = 250μs), endurance (100,000 P/E cycles), data retention (10 years), and industrial temperature support (–40°C to +85°C).
Technical Context
This SLC NAND device implements a multiplexed 8-bit I/O bus with five dedicated control signals (#CE, #WE, #RE, CLE, ALE) to manage command, address, and data latching via edge-triggered protocols. Its internal architecture includes a 2,112-byte page register (2,048B main + 64B spare), row/column decode units, high-voltage generator, and open-drain RY/#BY status indicator.
It executes standard ONFI-compatible operations - including PAGE READ (00h-30h), PAGE PROGRAM (80h-10h), BLOCK ERASE (60h-D0h), and COPY BACK - with deterministic timing windows defined for command/address/data input (e.g., tCLH = 15ns, tWH = 15ns) and operation cycles (e.g., tR = 25ns, tBERS = 2ms typ.).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 1 G-bit / 128 MB total capacity; enables compact firmware storage without external expansion. |
| Supply Voltage | 1.7 V to 1.95 V; compatible with low-power 1.8V system rails and reduces voltage translation overhead. |
| Page Size | 2,112 bytes (2,048B main + 64B spare); spare area reserved for ECC metadata and bad-block management. |
| Block Size | 135,168 bytes (64 pages × 2,112 bytes); defines minimum erase granularity for wear leveling. |
| Read Timing | tR = 25 ns (sequential), tREA = 25 μs (random); determines minimum clock period for burst reads and latency for byte-access. |
| Program/Erase | tPROG = 250 μs (typ.), tBERS = 2 ms (typ.); sets worst-case write latency and impacts real-time logging throughput. |
| Endurance | 100,000 program/erase cycles (with 1-bit/528-byte ECC); defines usable lifetime under frequent firmware updates. |
| Data Retention | 10 years at 85°C; ensures long-term reliability in industrial thermal environments without refresh. |
Pinout & Package
W29N01HZDINA uses a 48-ball Very Fine-Pitch Ball Grid Array (VFBGA) package (Package Code D), 8mm × 6mm footprint, 0.5mm ball pitch, x8 bus configuration. All Vcc and Vss balls must be connected; DNU balls are unconnected and NC balls may be left floating or driven.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low global enable; places device in standby (10 μA) when high, enabling power gating. |
| #WE | Write Enable | Rising-edge latch control for commands, addresses, and data; synchronizes all input transfers. |
| #RE | Read Enable | Falling-edge triggered serial output strobe; controls data valid window (tREA = 25 μs) on I/O bus. |
| ALE | Address Latch Enable | High-active signal that directs I/O pins to load column/row address bytes during address cycles. |
| CLE | Command Latch Enable | High-active signal that directs I/O pins to load command opcodes (e.g., 00h, 80h, 60h). |
| #WP | Write Protect | Active-low hardware lock; disables all program/erase when asserted, preventing accidental corruption. |
| RY/#BY | Ready/Busy | Open-drain status output; low during active operations (read/program/erase), used for polling or interrupt. |
| I/O[0–7] | Bidirectional Data Bus | Multiplexed 8-bit path for commands, addresses, and data; requires external bus arbitration logic. |
| Vcc | Power Supply | 1.7–1.95V core supply; four dedicated balls ensure stable voltage delivery under dynamic load. |
| Vss | Ground | Signal and power ground reference; four dedicated balls minimize IR drop and noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| SLC NAND Architecture | Guarantees 100,000 P/E cycles and 10-year data retention - critical for mission-critical boot storage. |
| Copy Back Command Support | Enables page-to-page relocation within same die without host RAM buffering, reducing system memory overhead. |
| ONFI-Compatible Interface | Ensures interoperability with standard NAND controllers and simplifies migration from other ONFI-compliant devices. |
| Industrial Temperature Range | –40°C to +85°C operation validated across full voltage range - suitable for automotive infotainment and industrial HMI. |
| Low Active Power | 13 mA typical read current and 10 mA program/erase current reduce thermal load in space-constrained modules. |
| Multiple Package Options | 48-ball VFBGA (D-code) balances board density and rework feasibility - preferred for high-volume embedded designs. |
Applications
| Boot Code Storage | Firmware Update Storage |
|---|---|
|
Use Scenario: Storing bootloader and OS kernel images in resource-constrained microcontroller-based systems. IC Role / Device Role / Timing Role: Nonvolatile code storage with fast sequential read (25ns) to accelerate boot time. Use Value: Eliminates need for external NOR flash or parallel interfaces while maintaining sub-100ms cold-boot latency. |
Use Scenario: Holding field-upgradable firmware images in networking gateways and industrial PLCs. IC Role / Device Role / Timing Role: High-endurance block-erasable storage supporting over-the-air (OTA) update rollback. Use Value: 100,000 P/E cycles allow >500 full-image updates over product lifetime with built-in bad-block management. |
| Media Buffering | Embedded Logging |
|
Use Scenario: Temporary storage of voice clips and UI assets in smart speakers and voice assistants. IC Role / Device Role / Timing Role: Low-latency random read (25μs) and Copy Back for rapid asset streaming. Use Value: Enables zero-copy audio playback from NAND using controller DMA, avoiding SRAM bottlenecks. |
Use Scenario: Persistent event logging in medical diagnostic equipment and energy meters. IC Role / Device Role / Timing Role: Reliable long-retention storage with hardware write protection (#WP pin). Use Value: Prevents accidental overwrite during power loss or software fault via hardware-level #WP assertion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F1G08ABAEAH4-IT:E | 1Gb SLC NAND, 3.3V supply, x8 interface, 48-TSOP I package; no Copy Back command support. | Requires level-shifting for 1.8V systems; lacks Copy Back, limiting in-system firmware relocation capability. | Select only if legacy 3.3V design or TSOP footprint compatibility is mandatory; verify controller command set alignment. |
| TC58CVG1S3HRAIJ | 1Gb SLC NAND, 1.8V supply, x8 interface, 63-ball VFBGA; supports ONFI 2.3 but higher tPROG (300μs). | Larger 63-ball footprint increases PCB area; slightly slower program timing affects high-frequency logging throughput. | Prefer when needing ONFI 2.3 features or tighter integration with Toshiba-based controller ecosystems. |
Compared with W29N01HZDINA, MT29F1G08ABAEAH4-IT:E requires voltage translation and lacks Copy Back, while TC58CVG1S3HRAIJ offers newer ONFI compliance but trades off layout density and program speed - W29N01HZDINA remains optimal for cost-sensitive, 1.8V, space-constrained SLC NAND deployments.
Availability
W29N01HZDINA is available at Aetrix Electronics and suitable for boot code storage, firmware update storage, and embedded logging applications requiring stable component supply, guaranteed long-term availability, and industrial-grade temperature performance.
Supply support for W29N01HZDINA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.
The W29N series targets embedded systems requiring reliable, low-voltage, high-endurance NAND Flash for code execution and firmware storage - optimized for direct connection to ARM Cortex-A/R-based SoCs and dedicated NAND controllers.
FAQ
What is the operating voltage range for W29N01HZDINA?
W29N01HZDINA operates from 1.7 V to 1.95 V, with full functionality and timing compliance guaranteed across this 1.8V nominal range. This eliminates need for external voltage regulators in 1.8V system designs and ensures compatibility with modern low-power SoCs.
Does W29N01HZDINA support Copy Back operations?
Yes, W29N01HZDINA supports Copy Back via READ for COPY BACK (00h-35h) and PROGRAM for COPY BACK (85h-10h) commands. This allows page-to-page relocation within the same die without host RAM involvement - essential for wear leveling and firmware patching.
What package type does W29N01HZDINA use?
W29N01HZDINA uses a 48-ball Very Fine-Pitch Ball Grid Array (VFBGA) package with 0.5 mm pitch and 8 mm × 6 mm body size (Package Code D). It is configured for x8 bus operation and includes four Vcc and four Vss balls for robust power delivery.
What is the endurance rating of W29N01HZDINA?
W29N01HZDINA guarantees 100,000 program/erase cycles when used with 1-bit-per-528-byte ECC correction. This endurance level is validated per JEDEC standards and enables multi-year deployment in frequently updated embedded firmware applications.
Is W29N01HZDINA suitable for industrial temperature applications?
Yes, W29N01HZDINA is rated for industrial temperature operation from –40°C to +85°C across its full electrical specification, including timing, voltage, and endurance. This makes it suitable for deployment in industrial HMIs, automotive infotainment head units, and outdoor networking equipment.
W29N01HZDINA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 1Gbit
- Memory Organization:
- 128M x 8
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns
- Access Time:
- 25 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (8x6.5)
W29N01HZDINA FAQ
1.How can I place an order for W29N01HZDINA through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N01HZDINA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N01HZDINA reliable?
The price and inventory of W29N01HZDINA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N01HZDINA is usually 5 days.
3.What payment methods are accepted for W29N01HZDINA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N01HZDINA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N01HZDINA?
W29N01HZDINA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N01HZDINA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N01HZDINA?
For technical support, including W29N01HZDINA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N01HZDINA requirements.
6.How does Aetrix verify that W29N01HZDINA is sourced from the original manufacturer or authorized distributors?
All W29N01HZDINA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N01HZDINA meets industry standards.
7.What is the process for return or replacement of W29N01HZDINA?
All W29N01HZDINA units undergo pre-shipment inspection (PSI). If there is an issue with W29N01HZDINA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N01HZDINA part is unused and in its original packaging.
Return procedure for W29N01HZDINA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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