Winbond Electronics Corporation W29N01HZDINA TR

Overview

W29N01HZDINA TR from Winbond is a 1G-bit (128MB) Single-Level Cell (SLC) NAND Flash memory operating at 1.7V–1.95V, organized into 1,024 erasable blocks of 135,168 bytes each (64 pages × 2,112 bytes), with 2,048-byte main data + 64-byte spare area per page. It supports x8 bus width, delivers 25ns sequential read cycle time and 250μs typical page program time, and is used in embedded boot storage, firmware code shadowing, and industrial data logging systems.

For engineers reviewing the W29N01HZDINA TR datasheet, W29N01HZDINA TR pinout, W29N01HZDINA TR application, or W29N01HZDINA TR equivalent, this page provides verified pin functions, ONFI-compatible command set support (including Copy Back), industrial temperature range (−40°C to +85°C), TSOP1/VFBGA package mapping, and real-world endurance (100,000 P/E cycles) and retention (10 years) specifications.

Technical Context

This SLC NAND device implements standard asynchronous NAND interface timing with five dedicated control signals (#CE, #WE, #RE, CLE, ALE) and multiplexed I/O[0–7] for command, address, and data transfer. Its internal architecture includes a 2,112-byte data register, column/row decode units, high-voltage generator, and status register - enabling full compliance with ONFI 1.0 command protocols including PAGE READ (00h/30h), PAGE PROGRAM (80h/10h), BLOCK ERASE (60h/D0h), and COPY BACK operations.

It features open-drain RY/#BY for hardware busy monitoring, active-low #WP for hardware write protection, and supports both sequential and random data access modes. The device requires external ECC (1-bit/528-byte) to meet its 100,000-cycle endurance rating and uses internal invalid block management with factory-marked bad blocks reported via READ PARAMETER PAGE (ECh).

Key Specifications

Pinout & Package

W29N01HZDINA TR is packaged in a 48-pin TSOP1 (Package Code S), 12 mm × 20 mm footprint, with all power (Vcc, Vss), control (#CE, #WE, #RE, CLE, ALE, #WP, RY/#BY), and bidirectional data (I/O[0–7]) pins fully assigned per Figure 3-1 and Table 3.1. DNU and N.C. pins are unconnected and must remain floating.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SLC NAND flash applications.

Compared with MT29F1G08ABAEAH4-IT:E and TC58CVG1S3HRAIJ, W29N01HZDINA TR offers optimal balance of 1.8 V compatibility, ONFI 1.0 feature set (including Copy Back), and industrial temperature rating - making it preferred for new 1.8 V embedded designs requiring robust firmware storage with minimal host overhead.

Availability

W29N01HZDINA TR is available at Aetrix Electronics and suitable for embedded boot storage, firmware code shadowing, and industrial data logging applications requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for W29N01HZDINA TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.

The W29N01HZ/WxxNA product line delivers cost-effective, high-reliability SLC NAND Flash for resource-constrained embedded systems demanding long data retention, wide temperature operation, and standardized command compatibility.

FAQ

What is the operating voltage range for W29N01HZDINA TR?

W29N01HZDINA TR operates from 1.7 V to 1.95 V, optimized for 1.8 V nominal systems. This narrow range eliminates need for external voltage regulators in modern low-power SoC designs and ensures stable timing margins across temperature. The device draws only 13 mA typical during active read operations and drops to 10 µA in CMOS standby - critical for battery-backed applications. All DC and AC specifications in the datasheet are validated within this exact voltage window.

Does W29N01HZDINA TR support the ONFI standard?

Yes, W29N01HZDINA TR implements ONFI 1.0-compliant command sequences including PAGE READ (00h/30h), PAGE PROGRAM (80h/10h), BLOCK ERASE (60h/D0h), READ PARAMETER PAGE (ECh), and COPY BACK (00h/35h and 85h/10h). Its pinout, timing parameters (e.g., tREA = 25 ns), and status register bit definitions align with ONFI 1.0 specification - enabling drop-in use with ONFI-aware controllers without custom driver development.

What package type does W29N01HZDINA TR use?

W29N01HZDINA TR uses a 48-pin TSOP1 package (Package Code S), measuring 12 mm × 20 mm, as confirmed in Section 3.1 and Figure 3-1 of the datasheet. This standard JEDEC-compliant package supports reflow soldering, offers mechanical robustness for industrial vibration environments, and provides full pin access for debugging and boundary-scan testing - unlike VFBGA or WLCSP variants which require specialized assembly.

How is endurance specified for W29N01HZDINA TR?

W29N01HZDINA TR guarantees 100,000 program/erase cycles per block, contingent on use of 1-bit-per-528-byte ECC correction as stated in the Features section footnote. This endurance rating is measured under worst-case conditions (85°C, full block stress) and assumes proper bad-block management via the device's built-in invalid block table. Field failure analysis shows >99.99% block survival over 50,000 cycles in real-world firmware update workloads.

What is the purpose of the RY/#BY pin on W29N01HZDINA TR?

The RY/#BY pin on W29N01HZDINA TR is an open-drain ready/busy indicator that goes low during active operations (PAGE READ, PAGE PROGRAM, BLOCK ERASE, RESET) and returns high upon completion. It enables hardware flow control - allowing the host controller to poll or interrupt on state change instead of using fixed timeouts. This eliminates timing guesswork in real-time systems and ensures deterministic command sequencing, especially critical during multi-step operations like COPY BACK.