Winbond Electronics Corporation W29N01HZSINA

Overview

W29N01HZSINA from Winbond is a 1G-bit (128MB) single-level cell (SLC) NAND Flash memory operating at 1.8V, organized into 1,024 erasable blocks of 135,168 bytes each, with 64 pages per block and 2,112-byte pages (2,048B main + 64B spare). It supports x8 bus width, delivers 25ns sequential read cycle time, and targets embedded code shadowing, solid-state storage, and media data retention in space-constrained industrial systems.

For engineers reviewing the W29N01HZSINA datasheet, W29N01HZSINA pinout, W29N01HZSINA application, or W29N01HZSINA equivalent, this page provides verified electrical specs, TSOP1-48 pin mapping, ONFI-compatible command set support (including Copy Back), endurance (100,000 P/E cycles), and 10-year data retention - all confirmed for the SINA suffix (Industrial temperature, -40°C to +85°C, 48-pin TSOP1 package).

Technical Context

The W29N01HZSINA implements a standard NAND interface with multiplexed I/O[0–7], using five dedicated control signals (#CE, #WE, #RE, CLE, ALE) to manage command, address, and data latching via edge-triggered protocols. Its internal architecture includes a 2,112-byte data register, column/row decoders, high-voltage generator, and status register with RY/#BY open-drain output for real-time operation monitoring.

It executes ONFI-aligned operations including PAGE READ (00h–30h), PAGE PROGRAM (80h–10h), BLOCK ERASE (60h–D0h), and COPY BACK (00h–35h / 85h–10h), with built-in invalid block management and requires external ECC (1-bit/528-byte) to meet its 100,000-cycle endurance rating.

Key Specifications

Pinout & Package

W29N01HZSINA is packaged in a 48-pin TSOP1 (Package Code S), 12 mm × 20 mm footprint, with all Vcc and Vss pins requiring connection per datasheet requirement. Pin 1 is corner-marked; pinout follows JEDEC-standard orientation with #CE, #WE, #RE, CLE, ALE, #WP, RY/#BY, and I/O[0–7] assigned as defined in Figure 3-1 and Table 3.1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND Flash memory applications.

Compared with MT29F1G08ABAEAH4-IT:E and TC58CVG1S3HRAIJ, W29N01HZSINA uniquely combines 1.8V TSOP1 packaging, full ONFI command support (including COPY BACK), and guaranteed industrial temperature operation - making it optimal for new designs prioritizing serviceability, update speed, and thermal robustness.

Availability

W29N01HZSINA is available at Aetrix Electronics and suitable for industrial HMI boot storage, network router firmware image retention, and medical diagnostic device logs requiring stable component supply, long-lifecycle assurance, and no-last-time-buy risk.

Supply support for W29N01HZSINA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and communications markets since 1987.

The W29N series is Winbond's industrial-grade SLC NAND product line designed specifically for embedded systems demanding high reliability, low-voltage operation, and extended temperature support - not general-purpose data storage.

FAQ

What is the exact memory organization of the W29N01HZSINA?

The W29N01HZSINA contains a 1G-bit (128 MB) SLC NAND array organized into 1,024 erasable blocks. Each block holds 64 pages of 2,112 bytes (2,048B main + 64B spare), resulting in 135,168 bytes per block. This structure is fixed for the x8 configuration and confirmed in Section 6.1 of the datasheet.

Does the W29N01HZSINA support the COPY BACK command, and how is it used?

Yes, the W29N01HZSINA supports COPY BACK via READ for COPY BACK (00h–35h) and PROGRAM for COPY BACK (85h–10h) commands. It enables internal page-to-page data movement without host RAM buffering - critical for atomic firmware updates. This capability is explicitly documented in Table 8.1 and Section 9.3 of the datasheet.

What package type and pin count does the W29N01HZSINA use?

The W29N01HZSINA uses a 48-pin TSOP1 package (Package Code S), measuring 12 mm × 20 mm, as shown in Figure 3-1 and specified in Section 3.1. It is distinct from VFBGA or WLCSP variants - the "SINA" suffix denotes this specific TSOP1-48 industrial-grade configuration.

What ECC requirements apply to the W29N01HZSINA to achieve its rated endurance?

The W29N01HZSINA's 100,000 program/erase cycle endurance is specified with 1-bit error correction per 528-byte sector (i.e., BCH or similar ECC). The device does not include on-die ECC logic; external controller-based ECC is mandatory to meet this rating, as noted in Feature section footnote (1) and Section 12.1.

Is the W29N01HZSINA compatible with ONFI standards, and which version?

The W29N01HZSINA implements ONFI 1.0–compatible command sets and timing (e.g., READ PARAMETER PAGE ECh, standardized timing parameters), as confirmed by its support for ONFI-defined commands and electrical AC characteristics in Tables 8.1 and 10.5–10.6. It is not compliant with ONFI 2.x or later versions.