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Winbond Electronics Corporation W29N02GVSIAA TR
- Part No.:
- W29N02GVSIAA TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
W29N02GVSIAA TR.pdf
- Description:
- IC FLASH 2GBIT 48-TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,045
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Product details
Overview
W29N02GVSIAA TR from Winbond is a 2G-bit (256MB) automotive-grade ONFi-compliant NAND Flash memory with 3V operation, AEC-Q100 Grade 2 qualification (-40°C to +105°C), and TS16949 certification, designed for code storage and data logging in ADAS ECUs and digital clusters.
For engineers reviewing the W29N02GVSIAA TR datasheet, W29N02GVSIAA TR pinout, W29N02GVSIAA TR application, or W29N02GVSIAA TR equivalent, key selection criteria include ONFi 2.3 interface compliance, 3V Vcc tolerance, 48-pin TSOP-I package, page size of 8KB + 640B, and block erase capability of 128 pages per block.
Technical Context
The W29N02GVSIAA TR implements ONFi 2.3-compliant asynchronous NAND interface with command, address, and data multiplexed on an 8-bit I/O bus. It supports standard ONFi commands including Read Page, Program Page, Block Erase, and Read ID, and uses internal ECC (typically 4-bit/512B) managed via host controller.
It operates at 3V nominal supply (2.7–3.6V), features hardware reset (RESET# pin), and requires external VccQ decoupling. The device uses planar SLC NAND technology with 128K blocks, each containing 128 pages of 8KB main + 640B spare area, enabling high endurance for automotive data recorder use cases.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 2G-bit (256MB) raw capacity; usable ~244MB after bad block management and spare area allocation |
| Interface | ONFi 2.3-compliant 8-bit asynchronous NAND; requires host-managed command protocol and timing control |
| Supply Voltage | 3V (2.7–3.6V); separate VccQ not required - single 3V rail powers core and I/O |
| Temperature Grade | AEC-Q100 Grade 2: -40°C to +105°C ambient; qualified for under-hood and center-console ECU deployment |
| Package | 48-pin TSOP-I (12mm × 20mm × 1.2mm); industry-standard footprint compatible with W29N02GV series |
| Page / Block Size | 8KB main + 640B spare per page; 128 pages (1MB + 80KB) per block; enables efficient firmware update partitioning |
| Endurance | 3K program/erase cycles per block; sufficient for infotainment OS caching and event-triggered data logging |
Pinout & Package
W29N02GVSIAA TR is housed in a 48-pin TSOP-I (Type I) plastic thin small-outline package with 0.5mm pitch, JEDEC MO-142AC compliant. Pin 1 marked by notch or dot; pins arranged in single row on both long edges.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| I/O[7:0] | Bi-directional data/command/address bus | Multiplexed 8-bit bus for all ONFi transfers; requires external pull-up resistors during reset/idle |
| CE# | Chip Enable | Active-low enable; device ignores commands when CE# is high; supports multi-chip addressing |
| WE# | Write Enable | Controls latching of command/address/data on rising edge; used for write and erase operations |
| RE# | Read Enable | Controls output enable and data sampling on falling edge; governs read data strobing |
| ALE | Address Latch Enable | Signals that current I/O byte is address; must be asserted before address bytes in command sequence |
| CLE | Command Latch Enable | Signals that current I/O byte is command; must be asserted before command byte (e.g., 0x00, 0x30) |
| R/B# | Ready/Busy Output | Open-drain status signal; low during internal operations (program/erase), high when ready |
| RESET# | Hardware Reset Input | Active-low asynchronous reset; forces device into known state without power cycle |
Key Features
| Feature | Design Value |
|---|---|
| ONFi 2.3 Compliance | Guarantees interoperability with ONFi-aware controllers and standardized command set (e.g., Get Features, Set Features) |
| AEC-Q100 Grade 2 | Validated for continuous operation at 105°C ambient; includes HTOL, TC, and ESD testing per automotive stress requirements |
| TSOP-I 48-pin Footprint | Enables drop-in replacement within existing automotive PCB layouts designed for W29N02GV-series NAND devices |
| Single 3V Supply | Eliminates need for dual-rail power design; simplifies BOM and layout vs. 1.8V/3V dual-voltage NAND |
| Hardware RESET# Pin | Allows full device recovery without power cycling - critical for fail-safe reinitialization in ADAS domain controllers |
Applications
| Digital Cluster Storage | Rear Camera Data Buffer |
|---|---|
Use Scenario: Storing instrument cluster firmware, calibration maps, and driver preference profiles with fast random access. IC Role / Device Role / Timing Role: Nonvolatile code and parameter storage; accessed via ONFi controller during boot and runtime updates. Use Value: 2G-bit density supports multi-language UI assets and OTA update staging partitions while meeting Grade 2 thermal requirements. | Use Scenario: Temporary buffering of high-resolution video frames before compression and transmission to central ADAS ECU. IC Role / Device Role / Timing Role: High-throughput sequential write buffer; leverages 8KB page programming for burst capture. Use Value: 3V operation and TSOP-I package allow integration into space-constrained camera module PCBs without voltage translation. |
| ADAS ECU Log Recorder | Infotainment System Firmware |
Use Scenario: Recording sensor fusion logs, CAN message traces, and fault snapshots triggered by safety-critical events. IC Role / Device Role / Timing Role: Reliable, temperature-hardened data logger; managed via wear-leveling and bad-block handling in host firmware. Use Value: 3K P/E cycles and built-in spare area support >5 years of cyclic logging at 100MB/day in vehicle lifetime simulations. | Use Scenario: Storing Linux kernel, root filesystem, and application binaries for head-unit boot and runtime execution. IC Role / Device Role / Timing Role: Primary boot media for ARM-based infotainment SoC; accessed via ONFi NAND controller in XIP-capable mode. Use Value: ONFi 2.3 command set enables deterministic timing for secure boot verification and authenticated firmware loading. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash storage applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| W29N02GVSIAB TR | Same 2G-bit ONFi NAND, identical TSOP-I package, but AEC-Q100 Grade 3 (-40°C to +85°C) | Suitable for cabin-zone modules (e.g., rear-seat entertainment) where ambient temp stays ≤85°C | Select W29N02GVSIAB TR only if Grade 2 thermal margin is unnecessary and cost optimization is prioritized. |
| MT29F2G08ABBDAH4-IT:E TR | 2G-bit ONFi 2.3 NAND in 48-pin TSOP-I, but rated -40°C to +85°C (Industrial, not AEC-Q100 qualified) | Lacks automotive qualification evidence; requires additional system-level validation for automotive use | Choose MT29F2G08ABBDAH4-IT:E TR only for non-safety-critical prototyping or industrial gateway designs. |
Compared with W29N02GVSIAB TR and MT29F2G08ABBDAH4-IT:E TR, the W29N02GVSIAA TR uniquely delivers production-ready AEC-Q100 Grade 2 qualification with zero additional validation overhead for ADAS and cluster applications requiring 105°C operation.
Availability
W29N02GVSIAA TR is available at Aetrix Electronics and suitable for ADAS ECUs, digital clusters, and automotive data recorders requiring stable component supply, long-term lifecycle assurance, and automotive-grade traceability.
Supply support for W29N02GVSIAA TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics Corporation is a Taiwan-based global leader in specialty DRAM, mobile DRAM, and serial flash memory, certified to IATF 16949 for automotive semiconductor manufacturing.
The W29N ONFi NAND product line targets automotive data-intensive systems - delivering high-density, thermally robust, standards-compliant NAND for code storage, logging, and multimedia buffering in safety-critical domains.
FAQ
What is the operating temperature range for W29N02GVSIAA TR?
The W29N02GVSIAA TR is qualified to AEC-Q100 Grade 2 specifications, supporting continuous operation from -40°C to +105°C ambient temperature. This rating is validated per automotive stress test standards including HTOL and temperature cycling, making it suitable for engine-bay-proximate or center-console ECU deployments where thermal margins exceed Grade 3 limits. The W29N02GVSIAA TR maintains full ONFi command functionality across this full range.
Does W29N02GVSIAA TR require a separate VccQ supply?
No, the W29N02GVSIAA TR operates from a single 3V supply (2.7–3.6V) for both core logic and I/O interface - no separate VccQ rail is needed. This simplifies power delivery design versus dual-voltage NAND devices and eliminates level-shifting components. All I/O pins (I/O[7:0], CLE, ALE, etc.) are 3V-tolerant, and the RESET# pin accepts 3V logic levels directly.
Is W29N02GVSIAA TR pin-compatible with other Winbond 2G-bit NAND devices?
Yes, the W29N02GVSIAA TR uses the standard 48-pin TSOP-I package (JEDEC MO-142AC) and shares identical pinout with W29N02GV-series parts including W29N02GVSIAB TR. Signal mapping (I/O[7:0], CE#, RE#, WE#, R/B#, RESET#, CLE, ALE) is functionally and physically identical, enabling direct PCB-level substitution where thermal grade permits.
What ONFi specification version does W29N02GVSIAA TR implement?
The W29N02GVSIAA TR implements ONFi 2.3 specification, supporting mandatory commands (Read Page, Program Page, Block Erase, Read ID), optional features including Get Features and Set Features, and timing parameters aligned with ONFi 2.3 tRC, tREA, and tR requirements. Host controllers must be ONFi 2.3-aware to leverage full functionality including status register access and feature configuration.
How is ECC handled in W29N02GVSIAA TR?
The W29N02GVSIAA TR incorporates on-die ECC capable of correcting up to 4 bits per 512-byte sector, but ECC management remains host-controlled: the device reports correction status via status register bits, and the host controller must execute read-modify-write sequences for error recovery. No transparent BCH or LDPC acceleration is performed internally - full ECC algorithm implementation resides in the host SoC or NAND controller firmware.
W29N02GVSIAA TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns
- Access Time:
- 25 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
W29N02GVSIAA TR FAQ
1.How can I place an order for W29N02GVSIAA TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N02GVSIAA TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N02GVSIAA TR reliable?
The price and inventory of W29N02GVSIAA TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N02GVSIAA TR is usually 5 days.
3.What payment methods are accepted for W29N02GVSIAA TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N02GVSIAA TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N02GVSIAA TR?
W29N02GVSIAA TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N02GVSIAA TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N02GVSIAA TR?
For technical support, including W29N02GVSIAA TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N02GVSIAA TR requirements.
6.How does Aetrix verify that W29N02GVSIAA TR is sourced from the original manufacturer or authorized distributors?
All W29N02GVSIAA TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N02GVSIAA TR meets industry standards.
7.What is the process for return or replacement of W29N02GVSIAA TR?
All W29N02GVSIAA TR units undergo pre-shipment inspection (PSI). If there is an issue with W29N02GVSIAA TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N02GVSIAA TR part is unused and in its original packaging.
Return procedure for W29N02GVSIAA TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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