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Winbond Electronics Corporation W29N02GWBIBA
- Part No.:
- W29N02GWBIBA
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 63-VFBGA
- Datasheet:
-
W29N02GWBIBA.pdf
- Description:
- IC FLASH 2GBIT 63-VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,105
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Product details
Overview
W29N02GWBIBA from Winbond is a 2G-bit (256MB) single-level cell (SLC) NAND Flash memory operating at 1.7–1.95V, organized into 2,048 erasable blocks of 135,168 bytes each (64 pages × 2,112 bytes), with x8/x16 bus interface, 100,000 program/erase cycles endurance, and 10-year data retention - deployed in embedded storage for boot code, firmware, and media buffering in space-constrained industrial systems.
For engineers reviewing the W29N02GWBIBA datasheet, W29N02GWBIBA pinout, W29N02GWBIBA application, or W29N02GWBIBA equivalent, key selection considerations include TSOP1/VFBGA package compatibility, ONFI-compatible command set support (including two-plane read/program/erase), RY/#BY status signaling, and 1.8V low-power operation with 13mA active read current and 10µA standby.
Technical Context
The W29N02GWBIBA implements a standard NAND architecture with multiplexed I/O bus, separate CLE/ALE control for command/address latching, and open-drain RY/#BY for asynchronous operation monitoring. It supports both x8 and x16 configurations via dedicated VFBGA pinouts and includes dedicated #WP for hardware write protection.
Its internal organization features dual-plane architecture enabling concurrent operations across even/odd block planes, with full support for copy-back, random data input/output, read parameter page (ECh), and enhanced status register (78h). The device complies with ONFI 2.3 timing conventions for command/address/data setup/hold and tRC/tWC specifications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 2G-bit / 256MB total capacity - sufficient for full firmware images or multi-layer boot partitions in resource-limited controllers. |
| Supply Voltage | 1.7V to 1.95V - enables direct integration with 1.8V logic domains without level-shifting circuitry. |
| Page Size | 2,112 bytes (2,048B main + 64B spare) - accommodates standard ECC engines (e.g., 1-bit/528-byte) for robust error correction. |
| Block Size | 135,168 bytes (64 × 2,112B) - balances erase granularity and wear leveling efficiency in long-life embedded logging. |
| Endurance | 100,000 P/E cycles - validated under 1-bit/528-byte ECC, supporting >5 years of daily firmware updates in industrial gateways. |
| Data Retention | 10 years at 85°C - ensures reliable archival storage of calibration data or configuration profiles in extended-temperature deployments. |
| Random Read | 25 µs - enables fast instruction fetch during code shadowing from NAND to RAM in microcontroller-based bootloaders. |
| Page Program Time | 250 µs (typ.) - supports real-time logging of sensor events without blocking host CPU for extended durations. |
Pinout & Package
W29N02GWBIBA is packaged in a 63-ball Very Fine Pitch Ball Grid Array (VFBGA) with 0.5mm pitch, footprint 9mm × 11mm, and ball layout optimized for x8 bus configuration per datasheet Figure 3-2. All Vcc and Vss balls must be connected; DNU and N.C. balls are unconnected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low global enable: high = standby (10µA), low = active; enables power gating per chip select in multi-device systems. |
| #RE | Read Enable | Controls serial output timing: valid data appears after tREA (25ns min) from falling edge; increments column address per pulse. |
| #WE | Write Enable | Latches commands, addresses, and data on rising edge; defines setup/hold windows per ONFI AC timing table (tWP, tWH). |
| ALE | Address Latch Enable | Signals address transfer: when high, I/O pins carry row/column addresses latched on next #WE rise. |
| CLE | Command Latch Enable | Signals command transfer: when high, I/O pins carry opcodes (e.g., 00h, 80h, 60h) latched on next #WE rise. |
| RY/#BY | Ready/Busy Output | Open-drain status indicator: low = active operation (read/program/erase), high = ready; requires external pull-up. |
| #WP | Write Protect Input | Hardware lock: low = disables all program/erase; prevents accidental corruption during power transitions or firmware updates. |
| I/O[0–7] | Bidirectional Data Bus | Multiplexed path for commands (8-bit), addresses (5-cycle), and data (2,112B/page); shared across all NAND protocol phases. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-plane architecture | Enables concurrent read/program/erase across even/odd block planes - reduces effective latency by up to 50% in streaming firmware updates. |
| Copy-back programming | Allows page-to-page relocation within same plane without host DRAM buffer - critical for wear-leveling in memory-constrained bootloaders. |
| ONFI 2.3 command set | Ensures interoperability with standard NAND controllers and Linux MTD drivers without custom HAL layers. |
| Parameter page (ECh) | Provides runtime-accessible device geometry, timing, and feature flags - eliminates hard-coded assumptions in BSP initialization. |
| Enhanced status register (78h) | Returns extended error codes (e.g., program fail, erase fail, ECC threshold exceeded) - enables precise failure diagnostics in field-deployed units. |
| Two-plane block erase | Permits simultaneous erasure of paired blocks - accelerates bulk reformatting in industrial data loggers requiring rapid partition reset. |
Applications
| Industrial PLC Firmware Storage | Medical Device Boot Image |
|---|---|
|
Use Scenario: Storing and executing bootloader and application firmware in programmable logic controllers exposed to wide temperature swings (-40°C to 85°C). IC Role / Device Role / Timing Role: Non-volatile code storage with direct XIP-capable read performance (25µs random access) and SLC reliability for mission-critical restart sequences. Use Value: 100,000 P/E cycles and 10-year retention ensure firmware integrity over 15+ year product lifecycles without refresh maintenance. |
Use Scenario: Holding certified boot images and calibration data in portable diagnostic equipment subject to strict regulatory traceability requirements. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with hardware #WP and ECC-managed spare area for audit logs and cryptographic keys. Use Value: Dual-plane operation enables background firmware validation while maintaining real-time patient data acquisition - zero downtime during updates. |
| Smart Meter Data Logging | Automotive Telematics Black Box |
|
Use Scenario: Recording time-stamped energy consumption metrics in utility meters with infrequent but high-integrity writes. IC Role / Device Role / Timing Role: High-endurance SLC NAND acting as circular buffer with wear-leveling managed by host MCU using copy-back and block lock commands. Use Value: 250µs page program time allows sub-millisecond logging bursts during voltage sag events without data loss. |
Use Scenario: Capturing pre-crash vehicle bus data (CAN, LIN) and sensor streams in automotive black box recorders with crash-triggered write acceleration. IC Role / Device Role / Timing Role: Low-voltage (1.8V) NAND with RY/#BY signaling for deterministic interrupt-driven capture initiation upon airbag ECU trigger. Use Value: Two-plane block erase clears previous session data in <2ms - guaranteeing clean buffer state before next incident recording. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F2G08ABAEAH4 | 2G-bit SLC NAND, 3.3V supply, 48-pin TSOP1 only - no VFBGA option; slower random read (35µs) and higher active current (25mA). | Requires level-shifting for 1.8V hosts; unsuitable for ultra-low-power battery-backed loggers. | Select when legacy 3.3V controller interface exists and board space permits TSOP1 footprint. |
| TC58NVG2S3ETA00 | 2G-bit SLC NAND, 1.8V, 63-ball VFBGA - supports ONFI 2.3 but lacks two-plane erase and enhanced status register (78h). | No concurrent plane operations; limited diagnostics capability for field failure analysis. | Select when dual-plane features are non-critical and cost sensitivity outweighs advanced diagnostics needs. |
Compared with MT29F2G08ABAEAH4 and TC58NVG2S3ETA00, W29N02GWBIBA delivers superior 1.8V efficiency, dual-plane concurrency, and enhanced status visibility - making it optimal for new designs prioritizing power, speed, and field-serviceability in industrial and medical edge devices.
Availability
W29N02GWBIBA is available at Aetrix Electronics and suitable for industrial PLC firmware storage, medical device boot image retention, smart meter data logging, automotive telematics black boxes, and embedded code shadowing requiring stable component supply across extended product lifecycles.
Supply support for W29N02GWBIBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, with ISO/TS 16949 and ISO 14001 certifications.
The W29N series targets industrial and automotive embedded systems requiring high-reliability, low-voltage NAND with extended temperature support and ONFI-standardized command sets - designed specifically for firmware storage and secure data logging where bit-error resilience and long-term data integrity are mandatory.
FAQ
What is the operating voltage range for W29N02GWBIBA?
W29N02GWBIBA operates from 1.7V to 1.95V, with typical operation at 1.8V. This narrow range eliminates need for external voltage regulation in 1.8V system designs and ensures compatibility with modern low-power microcontrollers and SoCs. The device's DC characteristics - including 13mA read current and 10µA standby - are specified across this full range, enabling robust performance across voltage tolerances in industrial power supplies.
Does W29N02GWBIBA support both x8 and x16 bus widths?
Yes, W29N02GWBIBA supports both x8 and x16 configurations, implemented via distinct pin mappings in its 63-ball VFBGA package - x8 uses I/O[0–7] (ball positions D1–D8), while x16 uses I/O[0–15] (D1–D8 and G1–G8). The device automatically detects bus width during power-up based on external hardware strapping or initialization sequence, and all command timing parameters in the datasheet are defined for both modes.
How does the dual-plane architecture in W29N02GWBIBA improve performance?
W29N02GWBIBA's dual-plane architecture divides the 2,048-block array into two independent 1,024-block planes, allowing concurrent operations - e.g., reading from one plane while programming or erasing the other. This reduces effective latency for sequential firmware updates and enables true background garbage collection without halting host operations, directly improving throughput in real-time embedded applications.
What is the purpose of the enhanced status register (78h) in W29N02GWBIBA?
The enhanced status register (accessed via command 78h) in W29N02GWBIBA extends the basic status byte with additional bits indicating specific failure causes - such as program fail due to over-programming, erase fail from oxide degradation, or ECC uncorrectable errors exceeding threshold. This enables precise root-cause diagnostics in deployed systems, reducing field return rates and accelerating firmware recovery logic development for W29N02GWBIBA-based products.
Is W29N02GWBIBA compatible with standard NAND controllers?
Yes, W29N02GWBIBA implements the ONFI 2.3 specification for command set, timing, and electrical interface, ensuring drop-in compatibility with industry-standard NAND controllers (e.g., those in NXP i.MX, TI Sitara, and Microchip SAM9 families). Its parameter page (ECh) provides controller-agnostic geometry and timing data, eliminating hardcoded assumptions and simplifying BSP porting for W29N02GWBIBA integration.
W29N02GWBIBA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 63-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 128M x 16
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 63-VFBGA (9x11)
W29N02GWBIBA FAQ
1.How can I place an order for W29N02GWBIBA through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N02GWBIBA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N02GWBIBA reliable?
The price and inventory of W29N02GWBIBA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N02GWBIBA is usually 5 days.
3.What payment methods are accepted for W29N02GWBIBA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N02GWBIBA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N02GWBIBA?
W29N02GWBIBA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N02GWBIBA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N02GWBIBA?
For technical support, including W29N02GWBIBA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N02GWBIBA requirements.
6.How does Aetrix verify that W29N02GWBIBA is sourced from the original manufacturer or authorized distributors?
All W29N02GWBIBA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N02GWBIBA meets industry standards.
7.What is the process for return or replacement of W29N02GWBIBA?
All W29N02GWBIBA units undergo pre-shipment inspection (PSI). If there is an issue with W29N02GWBIBA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N02GWBIBA part is unused and in its original packaging.
Return procedure for W29N02GWBIBA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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