Winbond Electronics Corporation W29N02KVBIAF TR
- Part No.:
- W29N02KVBIAF TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 63-VFBGA
- Datasheet:
-
W29N02KVBIAF TR.pdf
- Description:
- IC FLASH 2GBIT 63-VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,834
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Product details
Overview
W29N02KVBIAF from Winbond is a 2G-bit (256MB) SLC NAND Flash memory operating on a single 2.7V–3.6V supply, organized into 2,048 blocks of 64 pages each (2,176 bytes/page), with 25μs random read access and 250μs typical page program time. It supports two-plane operations, copy-back, and ONFI-compatible command set for embedded storage in space-constrained systems requiring reliable code shadowing and media data retention.
For engineers reviewing the W29N02KVBIAF datasheet, W29N02KVBIAF pinout, W29N02KVBIAF application, or W29N02KVBIAF equivalent, key selection criteria include its x8 multiplexed I/O interface, industrial temperature range (−40°C to +85°C), 60,000 P/E cycle endurance with 4-bit/544-byte ECC, and support for RY/#BY status monitoring and hardware write protection via #WP.
Technical Context
This device implements a standard NAND architecture with dedicated CLE/ALE control logic for command/address latching, enabling sequential and random access via a shared 8-bit I/O bus. Its two-plane organization allows concurrent operations-e.g., read from one plane while programming the other-improving effective throughput without external buffering.
The internal logic control block manages high-voltage generation for program/erase, interfaces with a 2,176-byte data register per page, and enforces timing compliance per ONFI 2.3–compatible AC specifications-including tREA = 25ns for sequential reads and tPROG = 250μs (typ.) for page programming.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 2 G-bit (256 M-byte) raw capacity; usable after ECC and bad-block management |
| Page size | 2,176 bytes (2,048 data + 128 spare); spare area reserved for ECC metadata and wear-leveling tags |
| Block size | 64 pages × 2,176 bytes = 139,264 bytes; minimum erasable unit for wear leveling |
| Read speed | 25 μs random access; 25 ns sequential cycle time enables high-bandwidth streaming |
| Program time | 250 μs typical page program; impacts firmware update latency and log-structured filesystem write performance |
| Erase endurance | 60,000 program/erase cycles at 4-bit/544-byte ECC; defines field lifetime under sustained write load |
| Data retention | 10 years at 85°C; validated for industrial storage in thermally demanding environments |
| Operating voltage | 2.7 V to 3.6 V single supply; compatible with 3.3 V system rails without level-shifting |
Pinout & Package
W29N02KVBIAF is packaged in a 48-ball Very Fine-Pitch Ball Grid Array (VFBGA) with package code "D", measuring 8 mm × 10 mm × 0.8 mm (JEDEC MO-276AA). All Vcc and Vss balls must be connected; DNU and N.C. balls are unconnected and must remain floating.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low chip select; places device in standby (10 μA) when high, enabling low-power idle states |
| #WE | Write Enable | Rising-edge latch control for commands, addresses, and input data; synchronizes all write-side transfers |
| #RE | Read Enable | Falling-edge triggered serial output enable; controls data valid window (tREA = 25 ns) and column increment |
| ALE | Address Latch Enable | Signals I/O bus content as address; used during row/column address loading in multi-cycle sequences |
| CLE | Command Latch Enable | Signals I/O bus content as command byte (e.g., 00h, 80h, 60h); initiates all device operations |
| RY/#BY | Ready/Busy Output | Open-drain status indicator; low during active program/erase/read; required for polling-based driver flow control |
| #WP | Write Protect Input | Hardware lock: asserts low to disable all program/erase commands, preventing accidental corruption |
| I/O[0–7] | Multiplexed Data Bus | Shared 8-bit path for commands, addresses, and main/spare data; requires external protocol sequencing |
Key Features
| Feature | Design Value |
|---|---|
| Two-plane operation | Enables concurrent read/program across even/odd block planes, doubling effective bandwidth for sequential workloads |
| Copy-back programming | Allows page-to-page relocation within same die without host RAM buffering-reducing garbage collection overhead |
| ONFI 2.3 compatibility | Ensures interoperability with standardized NAND controllers and drivers supporting ONFI timing and command extensions |
| Hardware write protection | #WP pin provides fail-safe, zero-software-dependency lock against unintended erase/program during power transitions |
| Industrial temperature range | Rated −40°C to +85°C ambient; qualified for deployment in automotive infotainment, industrial HMIs, and outdoor edge nodes |
Applications
| Embedded Code Storage | Media Data Logging |
|---|---|
|
Use Scenario: Storing boot firmware and application binaries in resource-constrained microcontrollers with no external NOR flash. IC Role / Device Role / Timing Role: Nonvolatile code storage with fast random read (25 μs) for shadowing to RAM during startup. Use Value: Eliminates need for external SPI NOR; leverages existing NAND controller interface while maintaining deterministic boot timing. |
Use Scenario: Continuous logging of sensor telemetry (vibration, temperature, GPS) in railway signaling equipment. IC Role / Device Role / Timing Role: High-endurance, temperature-stable data sink supporting 60,000 P/E cycles and 10-year retention at 85°C. Use Value: Reduces field failure risk in unattended deployments where maintenance intervals exceed five years. |
| Industrial HMI Storage | Edge AI Model Caching |
|
Use Scenario: Storing localized UI assets (fonts, icons, language packs) in factory-floor HMIs subject to thermal cycling. IC Role / Device Role / Timing Role: Reliable x8 NAND interface with hardware #WP lock to prevent corruption during brown-out events. Use Value: Ensures UI integrity across power interruptions without requiring complex software rollback mechanisms. |
Use Scenario: Caching inference models and calibration parameters in battery-powered edge vision sensors. IC Role / Device Role / Timing Role: Two-plane operation enables background model reload while foreground inference runs uninterrupted. Use Value: Achieves zero-downtime model updates by overlapping read (active plane) and program (idle plane) operations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F2G08ABAEAH4 | 2 G-bit SLC NAND, 48-ball VFBGA, but uses ONFI 2.2 and lacks two-plane operation | No concurrent plane execution; lower effective throughput in streaming workloads | Prefer W29N02KVBIAF when two-plane overlap or ONFI 2.3 features are required |
| TC58NVG2S3HTAI0 | 2 G-bit SLC NAND, 48-ball VFBGA, supports two-plane but specifies only 30,000 P/E cycles | Halved endurance rating; requires more aggressive wear leveling in high-write applications | Choose W29N02KVBIAF for deployments demanding >50,000-cycle field life under sustained writes |
Compared with MT29F2G08ABAEAH4 and TC58NVG2S3HTAI0, W29N02KVBIAF delivers higher endurance (60k vs. 30k cycles), native ONFI 2.3 compliance, and guaranteed two-plane concurrency-making it optimal for industrial firmware storage and real-time logging where reliability and deterministic timing outweigh cost sensitivity.
Availability
W29N02KVBIAF is available at Aetrix Electronics and suitable for embedded code storage, industrial data logging, HMI asset caching, and edge AI model persistence requiring stable component supply across extended product lifecycles.
Supply support for W29N02KVBIAF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.
The W29N02KV series targets cost-sensitive, space-constrained embedded systems needing robust, long-life NAND storage with industrial-grade reliability and ONFI-standard interoperability-particularly where SLC performance and endurance outweigh TLC density advantages.
FAQ
What is the operating temperature range specified for W29N02KVBIAF?
W29N02KVBIAF is rated for industrial temperature operation from −40°C to +85°C. This specification is validated per JEDEC JESD22-A108 and applies across all guaranteed performance parameters-including read/write timing, endurance, and data retention-ensuring reliable function in harsh thermal environments such as factory automation controllers and outdoor telematics units.
Does W29N02KVBIAF support hardware write protection, and how is it implemented?
Yes, W29N02KVBIAF implements hardware write protection via the #WP (Write Protect) pin. When #WP is driven low, all program and erase operations are disabled regardless of command sequence or timing-preventing accidental corruption during power-up/down or system reset. This feature is independent of internal status registers and requires no firmware configuration to activate.
What NAND interface standard does W29N02KVBIAF comply with?
W29N02KVBIAF complies with ONFI 2.3 (Open NAND Flash Interface) specifications for command set, timing parameters, and electrical interface behavior. This ensures interoperability with ONFI-compliant controllers and simplifies driver porting across platforms-unlike legacy or proprietary NAND implementations that require custom timing tuning.
How many program/erase cycles is W29N02KVBIAF rated for, and what ECC requirement enables this rating?
W29N02KVBIAF is rated for 60,000 program/erase cycles. This endurance figure is specified under conditions requiring 4-bit error correction per 544-byte sector (i.e., BCH 4-bit ECC), as defined in the datasheet's footnote. Using weaker ECC (e.g., 1-bit Hamming) reduces achievable cycle life and voids the 60k guarantee.
What package type is used for W29N02KVBIAF, and what are its mechanical dimensions?
W29N02KVBIAF uses a 48-ball Very Fine-Pitch Ball Grid Array (VFBGA) package with JEDEC MO-276AA footprint, designated package code "D". Its dimensions are 8.0 mm × 10.0 mm × 0.8 mm, with 0.5 mm ball pitch. This compact, surface-mount package supports high-density PCB layouts common in portable and industrial edge devices.
W29N02KVBIAF TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 63-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 63-VFBGA (9x11)
W29N02KVBIAF TR FAQ
1.How can I place an order for W29N02KVBIAF TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N02KVBIAF TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N02KVBIAF TR reliable?
The price and inventory of W29N02KVBIAF TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N02KVBIAF TR is usually 5 days.
3.What payment methods are accepted for W29N02KVBIAF TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N02KVBIAF TR transactions.
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4.How is shipping managed for W29N02KVBIAF TR?
W29N02KVBIAF TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N02KVBIAF TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N02KVBIAF TR?
For technical support, including W29N02KVBIAF TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N02KVBIAF TR requirements.
6.How does Aetrix verify that W29N02KVBIAF TR is sourced from the original manufacturer or authorized distributors?
All W29N02KVBIAF TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N02KVBIAF TR meets industry standards.
7.What is the process for return or replacement of W29N02KVBIAF TR?
All W29N02KVBIAF TR units undergo pre-shipment inspection (PSI). If there is an issue with W29N02KVBIAF TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N02KVBIAF TR part is unused and in its original packaging.
Return procedure for W29N02KVBIAF TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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