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Winbond Electronics Corporation W29N02KVDIAE TR

Part No.:
W29N02KVDIAE TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
48-VFBGA
Datasheet:
AetrixW29N02KVDIAE TR.pdf
Description:
IC FLASH 2GBIT ONFI 48VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,061

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Product details

Overview

W29N02KVDIAE from Winbond is a 2G-bit (256MB) SLC NAND Flash memory operating at 2.7–3.6V, organized into 2,048 blocks of 64 pages each (2,176 bytes/page), with x8 multiplexed I/O interface and standard NAND command set including Copy Back and Two-Plane operations. It delivers 25ns sequential read cycle time, 250μs typical page program time, and supports industrial temperature range (−40°C to +85°C) for embedded storage in space-constrained systems.

For engineers reviewing the W29N02KVDIAE datasheet, W29N02KVDIAE pinout, W29N02KVDIAE application, or W29N02KVDIAE equivalent, key selection considerations include its 48-ball VFBGA (D-code) package, ONFI-compatible control interface (CLE/ALE/#CE/#WE/#RE), RY/#BY open-drain status signaling, and support for OTP and Block Lock features via SET/GET FEATURES commands.

Technical Context

This device implements a standard NAND architecture with two independent planes (even/odd block addressing), enabling concurrent operations such as Two-Plane Page Program or Two-Plane Block Erase. Its command-latched interface uses CLE and ALE to distinguish command, address, and data phases on the shared 8-bit I/O bus.

Internal logic includes a high-voltage generator for program/erase, a 2,176-byte data register per plane, and status register with bit-defined flags for ready/busy, write protection, and error conditions. The device requires external ECC (8-bit/544-byte) to achieve its rated 60,000 P/E cycles and 10-year data retention.

Key Specifications

Parameter Value and Actual Design Meaning
Density 2G-bit / 256M-byte total capacity; enables compact code/data storage without external expansion.
Page size 2,176 bytes (2,048B main + 128B spare); spare area reserved for ECC metadata and bad-block management.
Block size 64 pages × 2,176 bytes = 139,264 bytes; defines minimum erasable unit for wear leveling.
Read performance 25ns sequential read cycle; supports high-throughput streaming in media or firmware loading.
Program time 250μs typical page program; determines minimum latency for firmware updates or log writes.
Erase endurance 60,000 program/erase cycles (with 8-bit/544-byte ECC); sets usable lifetime under frequent rewrites.
Data retention 10 years at 85°C; ensures long-term reliability in industrial thermal environments.
Supply voltage 2.7V–3.6V single supply; compatible with standard 3.3V system rails and low-power designs.

Pinout & Package

W29N02KVDIAE is packaged in a 48-ball Very Fine-Pitch Ball Grid Array (VFBGA) with D-code footprint (6.0mm × 8.0mm, 0.5mm pitch), compliant with JEDEC MO-276AA. All Vcc and Vss balls must be connected; DNU and N.C. balls are unconnected and must remain floating.

Pin/Terminal Circuit Role Design Meaning
#CE Chip Enable Active-low global enable; places device in standby (10μA) when high, enabling power gating.
#WE Write Enable Rising-edge latch control for commands, addresses, and input data; synchronizes all write-phase transfers.
#RE Read Enable Falling-edge triggered serial output strobe; increments column address and outputs next byte after tREA delay.
ALE Address Latch Enable Signals that I/O bus carries row/column address; latched on rising #WE edge during address phase.
CLE Command Latch Enable Signals that I/O bus carries command code (e.g., 00h, 80h, 60h); latched on rising #WE edge.
#WP Write Protect Active-low hardware lock; disables all program/erase when asserted, preventing accidental corruption.
RY/#BY Ready/Busy Open-drain status indicator; low = internal operation in progress (read/program/erase), high = idle.
I/O[0–7] Bidirectional Data Bus Multiplexed 8-bit path for commands, addresses, and data; requires external timing control per ONFI spec.

Key Features

Feature Design Value
Two-Plane Operation Enables concurrent access to even/odd block planes, reducing effective latency for interleaved reads/writes.
Copy Back Command Permits page-to-page move within same die without external buffering, accelerating wear-leveling and garbage collection.
ONFI-Compatible Interface Supports standardized timing and command protocol (e.g., GET/SET FEATURES), easing migration and controller compatibility.
OTP Area Dedicated one-time programmable region for secure boot keys or calibration data, inaccessible to standard erase.
Block Lock Function Allows software-controlled locking/unlocking of individual blocks to prevent unauthorized firmware modification.

Applications

Industrial HMI Storage Medical Device Firmware

Use Scenario: Storing GUI assets, configuration profiles, and audit logs in panel-mounted HMIs with limited PCB area.

IC Role / Device Role / Timing Role: Primary nonvolatile storage for firmware images and runtime data, interfaced via NAND controller with hardware ECC.

Use Value: 256MB density in 48-ball VFBGA meets space constraints; 10-year retention ensures field longevity without recalibration.

Use Scenario: Holding certified bootloader, application binaries, and patient history logs in portable diagnostic equipment.

IC Role / Device Role / Timing Role: Secure, field-upgradable code storage with OTP-protected root keys and Block Lock for regulatory compliance.

Use Value: 60,000 P/E cycles support frequent firmware validation updates; −40°C to +85°C rating covers clinical environments.

Automotive Telematics Smart Meter Data Logging

Use Scenario: Recording GPS tracks, CAN bus diagnostics, and OTA update packages in vehicle telematics units.

IC Role / Device Role / Timing Role: High-reliability logging medium with Two-Plane operation enabling simultaneous telemetry capture and background upload.

Use Value: 25ns read speed accelerates map tile loading; Copy Back reduces garbage collection overhead during continuous write.

Use Scenario: Archiving hourly consumption readings and tariff tables in utility smart meters deployed outdoors.

IC Role / Device Role / Timing Role: Endurance-optimized storage for cyclic data writes, managed by host microcontroller with wear-leveling firmware.

Use Value: Industrial temp range and 10-year retention eliminate need for battery-backed SRAM; low 10μA standby extends battery life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT29F2G08ABAEAH4 2G-bit SLC NAND in 48-ball VFBGA; supports ONFI 2.3 but lacks Two-Plane and Copy Back commands. Requires host-side emulation of copy-back; suitable where simpler command set suffices. Prefer when ONFI 2.3 timing compliance is mandatory and advanced features are unused.
TC58NVG2S3ETA00 2G-bit SLC NAND in 48-pin TSOP1; identical command set and timing, but larger 12×20mm package. Acceptable for legacy board designs with TSOP footprint; no layout change needed if migrating from TSOP variant. Choose when mechanical compatibility with existing TSOP sockets is required over space savings.

Compared with MT29F2G08ABAEAH4 and TC58NVG2S3ETA00, W29N02KVDIAE uniquely combines 48-ball VFBGA miniaturization with Two-Plane and Copy Back acceleration-critical for real-time logging and firmware update throughput in constrained embedded systems.

Availability

W29N02KVDIAE is available at Aetrix Electronics and suitable for industrial HMI storage, medical device firmware, automotive telematics, smart meter data logging, and embedded code shadowing requiring stable component supply across extended temperature ranges and multi-year production cycles.

Supply support for W29N02KVDIAE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND Flash, PSRAM, and audio codecs, serving industrial, automotive, and consumer markets since 1987.

The W29N02KV series targets cost-sensitive, space-constrained embedded systems needing reliable, high-endurance NAND storage with ONFI-compliant interoperability and advanced features like Two-Plane operation and Copy Back.

FAQ

What is the exact memory organization of W29N02KVDIAE?

W29N02KVDIAE contains 2,048 erasable blocks, each consisting of 64 pages of 2,176 bytes (2,048 bytes main + 128 bytes spare). Total capacity is 2G-bit (256M-byte), organized across two independent planes to enable concurrent operations. This structure is fixed and confirmed in the device's Memory Array Organization section (Section 6.1).

Does W29N02KVDIAE support ONFI compliance?

Yes, W29N02KVDIAE supports ONFI 2.3-compliant timing and command protocols, including GET FEATURES (EEh) and SET FEATURES (EFh) commands. Pin assignments and AC timing characteristics align with ONFI specifications, and Winbond explicitly references ONFI compatibility in the datasheet's pin notes and feature descriptions.

What package type does W29N02KVDIAE use, and how is it identified?

W29N02KVDIAE uses the 48-ball VFBGA package with D-code designation (6.0mm × 8.0mm, 0.5mm pitch), as specified in Section 3.2 and Figure 3-2 of the datasheet. The "D" in the part number suffix "DIAE" directly maps to this VFBGA-D package variant per Winbond's ordering information table.

What ECC requirement is necessary to achieve the rated 60,000 P/E cycles for W29N02KVDIAE?

W29N02KVDIAE requires an external 8-bit/544-byte ECC correction capability to achieve its specified 60,000 program/erase cycles and 10-year data retention. This ECC strength is explicitly stated in Note 1 of the Features section and governs the minimum error-correction capability the host controller must provide.

Can W29N02KVDIAE perform concurrent operations across its two planes?

Yes, W29N02KVDIAE supports true concurrent operations via its two-plane architecture - including Two-Plane Page Program, Two-Plane Block Erase, and Two-Plane Copy Back - allowing independent execution in even- and odd-numbered block planes. This capability is documented in Sections 9.1.2, 9.2.4, 9.4.2, and 9.3.4 of the datasheet.

W29N02KVDIAE TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
48-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
2Gbit
Memory Organization:
256M x 8
Memory Interface:
ONFI
Clock Frequency:
-
Write Cycle Time - Word, Page:
25ns
Access Time:
20 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-VFBGA (8x6.5)

W29N02KVDIAE TR FAQ

1.How can I place an order for W29N02KVDIAE TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W29N02KVDIAE TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W29N02KVDIAE TR reliable?

The price and inventory of W29N02KVDIAE TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N02KVDIAE TR is usually 5 days.

3.What payment methods are accepted for W29N02KVDIAE TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N02KVDIAE TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W29N02KVDIAE TR?

W29N02KVDIAE TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W29N02KVDIAE TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W29N02KVDIAE TR?

For technical support, including W29N02KVDIAE TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N02KVDIAE TR requirements.

6.How does Aetrix verify that W29N02KVDIAE TR is sourced from the original manufacturer or authorized distributors?

All W29N02KVDIAE TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N02KVDIAE TR meets industry standards.

7.What is the process for return or replacement of W29N02KVDIAE TR?

All W29N02KVDIAE TR units undergo pre-shipment inspection (PSI). If there is an issue with W29N02KVDIAE TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W29N02KVDIAE TR part is unused and in its original packaging.

Return procedure for W29N02KVDIAE TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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