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Winbond Electronics Corporation W29N02KVDIAF TR
- Part No.:
- W29N02KVDIAF TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
W29N02KVDIAF TR.pdf
- Description:
- IC FLASH 2GBIT 48-VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,436
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Product details
Overview
W29N02KVDIAF TR from Winbond is a 2G-bit (256MB) SLC NAND Flash memory in 48-ball VFBGA package, operating at 2.7–3.6V with x8 interface, 25μs random read access, and 60,000 program/erase cycles. It delivers embedded storage for code shadowing, media data buffering, and firmware logging in space-constrained industrial systems.
For engineers reviewing the W29N02KVDIAF TR datasheet, W29N02KVDIAF TR pinout, W29N02KVDIAF TR application, or W29N02KVDIAF TR equivalent, key selection criteria include its ONFI-compatible command set, two-plane parallel operation support, 2,176-byte page size with spare area for ECC, and industrial temperature range (–40°C to +85°C).
Technical Context
This device implements a standard NAND architecture with multiplexed x8 I/O bus, five dedicated control signals (CLE, ALE, #CE, #WE, #RE), and status monitoring via open-drain RY/#BY. Its block organization comprises 2,048 erasable blocks (1024 per plane), each holding 64 pages of 2,176 bytes (2,048 main + 128 spare).
It supports enhanced operations including two-plane read/program/erase, copy-back, GET/SET FEATURES (address 80h/81h), and OTP area access. Command execution follows strict timing windows-e.g., tREA ≤ 25ns for sequential read, tPROG = 250μs typical for page program-with all operations governed by internal state machine logic and external signal coordination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 2G-bit / 256MB total capacity; enables compact firmware or media storage without external expansion. |
| Page Size | 2,176 bytes (2,048 data + 128 spare); spare area accommodates 4-bit/544-byte ECC for reliable error correction. |
| Block Size | 139,264 bytes (64 × 2,176-byte pages); defines minimum erase granularity and wear-leveling unit. |
| Random Read Time | 25μs maximum; determines latency for non-sequential instruction or configuration fetches. |
| Page Program Time | 250μs typical; impacts firmware update speed and real-time logging throughput. |
| Endurance | 60,000 program/erase cycles; specifies usable lifetime under repeated field updates. |
| Data Retention | 10 years at 85°C; guarantees data integrity in high-temperature industrial deployments. |
Pinout & Package
W29N02KVDIAF TR uses a 48-ball Very Fine-Pitch Ball Grid Array (VFBGA) package (package code D), measuring 8mm × 9mm with 0.5mm ball pitch. All Vcc and Vss balls must be connected; DNU and N.C. balls are unconnected and must remain floating.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low global enable; places device in standby (10μA) when high, enabling low-power idle states. |
| #WE | Write Enable | Rising-edge latch control for commands, addresses, and input data; synchronizes all write-side transfers. |
| #RE | Read Enable | Rising-edge triggers serial data output from register; column address auto-increments per pulse for burst reads. |
| ALE | Address Latch Enable | Signals that I/O bus carries row/column address; latched on rising #WE edge during address cycles. |
| CLE | Command Latch Enable | Signals that I/O bus carries command byte (e.g., 00h, 80h, 60h); latched on rising #WE edge. |
| RY/#BY | Ready/Busy Output | Open-drain status indicator; low during active program/erase/read, high when ready for next command. |
| #WP | Write Protect | Active-low hardware lock; disables all program/erase when asserted, preventing accidental corruption. |
| I/O[0–7] | Multiplexed Data Bus | Bi-directional x8 interface carrying commands, addresses, and data; requires external bus arbitration. |
Key Features
| Feature | Design Value |
|---|---|
| Two-plane operation | Enables concurrent read/program/erase across even- and odd-numbered block planes, doubling effective bandwidth. |
| Copy-back programming | Allows page-to-page data relocation within same die without host RAM buffer, reducing system memory overhead. |
| ONFI-compliant interface | Supports standardized timing and command definitions (e.g., GET/SET FEATURES), easing migration and validation. |
| Industrial temperature range | Rated –40°C to +85°C; qualified for deployment in automotive ECUs, industrial HMIs, and outdoor IoT gateways. |
| Low standby current | 10μA typical CMOS standby draw; extends battery life in always-on edge devices with infrequent access. |
Applications
| Industrial HMI Firmware Storage | Automotive Telematics Log Buffer |
|---|---|
|
Use Scenario: Storing boot firmware, UI assets, and configuration profiles in panel-mounted HMIs exposed to thermal cycling and vibration. IC Role / Device Role / Timing Role: Non-volatile code and asset storage with deterministic 25μs random read for fast GUI initialization. Use Value: 60,000 P/E cycles and 10-year retention ensure firmware integrity over 10+ years of field operation without refresh. |
Use Scenario: Capturing GPS, CAN bus diagnostics, and sensor logs in vehicle telematics units during ignition-off periods. IC Role / Device Role / Timing Role: High-reliability sequential logging medium using two-plane operation to overlap log writes with background uploads. Use Value: Copy-back capability enables wear-leveling without host RAM, extending usable lifetime under continuous 24/7 logging. |
| Medical Device Configuration Archive | Smart Meter Firmware Update Storage |
|
Use Scenario: Archiving calibration data, audit trails, and user settings in Class II medical instruments requiring traceable data history. IC Role / Device Role / Timing Role: Secure, tamper-resistant parameter storage with hardware #WP pin to prevent unauthorized reconfiguration. Use Value: 128-byte spare area per page supports robust BCH ECC, meeting IEC 62304 data integrity requirements. |
Use Scenario: Holding signed firmware images and rollback partitions in utility smart meters deployed in remote, unattended locations. IC Role / Device Role / Timing Role: Dual-image storage medium supporting atomic OTA updates with verified rollback capability. Use Value: Block-level erase (2ms typical) and 256MB density allow full image swaps within sub-second time budgets during maintenance windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F2G08ABAEAH4-IT:E | 2G-bit SLC NAND in 48-VFBGA; identical x8 interface and ONFI 2.3 compliance, but 30μs random read (vs. 25μs) and 50,000 P/E cycles. | Slightly lower endurance and slower random access; suitable where firmware update frequency is low and latency budget allows. | Select when leveraging Micron's long-term supply assurance or existing qualification on MT29F platform. |
| TC58NVG2S3HTAI0 | 2G-bit SLC NAND in 48-VFBGA; supports toggle DDR mode (not supported by W29N02KVDIAF TR), but only 30,000 P/E cycles and no two-plane operation. | Lacks two-plane concurrency and has halved endurance; better suited for cost-sensitive consumer storage than industrial logging. | Choose only if DDR interface compatibility is required and endurance demands are ≤30k cycles. |
Compared with MT29F2G08ABAEAH4-IT:E and TC58NVG2S3HTAI0, W29N02KVDIAF TR offers superior random read speed and highest endurance-critical for frequent field updates-and unique two-plane operation for sustained throughput in real-time data capture systems.
Availability
W29N02KVDIAF TR is available at Aetrix Electronics and suitable for industrial HMI firmware storage, automotive telematics log buffering, and medical device configuration archiving requiring stable component supply and long-term lifecycle support.
Supply support for W29N02KVDIAF TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash and SRAM, with global manufacturing and quality certifications.
The W29N02KV series targets industrial and automotive embedded systems needing high-reliability, low-power, and space-efficient NAND storage-designed specifically for code execution, secure logging, and firmware update resilience.
FAQ
What is the operating voltage range for W29N02KVDIAF TR?
W29N02KVDIAF TR operates across a single 2.7V to 3.6V supply rail. This wide Vcc range ensures compatibility with diverse power architectures-including buck-boost regulators and battery-backed rails-while maintaining full specification compliance for timing, endurance, and data retention throughout the range.
Does W29N02KVDIAF TR support hardware write protection?
Yes, W29N02KVDIAF TR includes a dedicated #WP (Write Protect) pin. When driven low, it disables all program and erase operations globally, providing hardware-level immunity against accidental or malicious firmware corruption-critical for safety-critical and certified systems.
How many blocks and pages does W29N02KVDIAF TR contain?
W29N02KVDIAF TR contains 2,048 erasable blocks, each composed of 64 programmable pages. With each page sized at 2,176 bytes (2,048 data + 128 spare), the total array yields 256MB usable capacity and supports robust ECC implementation in the spare area.
Is W29N02KVDIAF TR compatible with ONFI standards?
Yes, W29N02KVDIAF TR implements ONFI 2.3-compliant command and timing behavior-including GET/SET FEATURES commands at addresses 80h and 81h-enabling interoperability with standardized NAND controllers and simplifying qualification in multi-vendor platforms.
What package type is used for W29N02KVDIAF TR?
W29N02KVDIAF TR uses a 48-ball Very Fine-Pitch Ball Grid Array (VFBGA) package (code D), measuring 8mm × 9mm with 0.5mm ball pitch. It is footprint-compatible with other Winbond 48-ball VFBGA NAND devices but not pin-compatible with TSOP1 or 63-ball variants.
W29N02KVDIAF TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- -
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (8x6.5)
W29N02KVDIAF TR FAQ
1.How can I place an order for W29N02KVDIAF TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N02KVDIAF TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N02KVDIAF TR reliable?
The price and inventory of W29N02KVDIAF TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N02KVDIAF TR is usually 5 days.
3.What payment methods are accepted for W29N02KVDIAF TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N02KVDIAF TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N02KVDIAF TR?
W29N02KVDIAF TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N02KVDIAF TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N02KVDIAF TR?
For technical support, including W29N02KVDIAF TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N02KVDIAF TR requirements.
6.How does Aetrix verify that W29N02KVDIAF TR is sourced from the original manufacturer or authorized distributors?
All W29N02KVDIAF TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N02KVDIAF TR meets industry standards.
7.What is the process for return or replacement of W29N02KVDIAF TR?
All W29N02KVDIAF TR units undergo pre-shipment inspection (PSI). If there is an issue with W29N02KVDIAF TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N02KVDIAF TR part is unused and in its original packaging.
Return procedure for W29N02KVDIAF TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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