My Inquiry
My Account
Winbond Electronics Corporation W29N02KZDIBE
- Part No.:
- W29N02KZDIBE
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
W29N02KZDIBE.pdf
- Description:
- IC FLASH 2GBIT ONFI 48-VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,563
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
W29N02KZDIBE from Winbond is a 2G-bit (256MB) single-level cell (SLC) NAND Flash memory operating at 1.7–1.95V, organized into 2,048 blocks of 139,264 bytes each with 64 pages per block and 2,176-byte pages (2048B main + 128B spare). It supports x8 bus interface, ONFI-compatible command set, and is used in industrial embedded storage for firmware logging, boot code shadowing, and media buffering.
For engineers reviewing the W29N02KZDIBE datasheet, W29N02KZDIBE pinout, W29N02KZDIBE application, or W29N02KZDIBE equivalent, key selection considerations include its 1.8V supply, 48-ball VFBGA (D-code) package, 25μs random read latency, 250μs typical page program time, and support for two-plane operations and Copy Back commands in space-constrained industrial systems.
Technical Context
This SLC NAND device implements a multiplexed x8 I/O bus with five dedicated control signals (#CE, #RE, #WE, CLE, ALE) and status signaling via RY/#BY. Its architecture enables concurrent two-plane read/program operations to improve throughput without requiring external arbitration logic.
It complies with ONFI 2.3 timing conventions and supports standard NAND commands (00h/30h, 80h/10h, 60h/D0h), plus extended features including GET/SET FEATURES (EEh/EFh), Read Parameter Page (ECh), and Read Unique ID (EDh), all accessible through the same command/address/data bus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 2G-bit / 256MB total capacity; enables compact firmware and log storage in resource-limited controllers. |
| Supply Voltage | 1.7V–1.95V; compatible with low-voltage 1.8V system rails and reduces power delivery complexity. |
| Page Size | 2,176 bytes (2048B main + 128B spare); spare area reserved for ECC metadata and bad-block management. |
| Block Size | 139,264 bytes (64 × 2,176-byte pages); defines minimum erase granularity for wear leveling. |
| Random Read Time | 25 μs max; determines latency for non-sequential access in boot code or configuration retrieval. |
| Page Program Time | 250 μs typical; impacts firmware update speed and real-time logging write overhead. |
| Endurance | 60,000 program/erase cycles (with 8-bit/544-byte ECC); supports long-life industrial logging applications. |
| Data Retention | 10 years at 85°C; ensures reliability in unattended industrial deployments without refresh. |
Pinout & Package
W29N02KZDIBE uses a 48-ball Very Fine-Pitch Ball Grid Array (VFBGA) package with D-code footprint (7.0mm × 9.0mm, 0.5mm pitch), optimized for high-density PCB layouts in industrial controllers and edge gateways.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable (active-low) | Asserts device enable; high-Z I/O and standby mode when deasserted - critical for multi-device bus sharing. |
| #RE | Read Enable (active-low) | Controls serial data output timing; falling edge initiates tREA delay before valid data appears on I/O[0–7]. |
| #WE | Write Enable (active-low) | Latches commands, addresses, and data on rising edge - defines setup/hold timing for all input cycles. |
| ALE | Address Latch Enable | Signals that bus carries address data; must be asserted during address phase of command sequence. |
| CLE | Command Latch Enable | Signals that bus carries command codes (e.g., 00h, 80h, 60h); required before every command cycle. |
| RY/#BY | Ready/Busy (open-drain output) | Active-low indicator of internal operation progress; used for polling or interrupt-driven flow control. |
| #WP | Write Protect (active-low) | Hardware lock preventing accidental program/erase; tied high for normal operation, grounded for protection. |
| I/O[0–7] | Multiplexed Data Bus (x8) | Shared path for commands, addresses, and data; requires external sequencing via CLE/ALE control. |
| Vcc | Power Supply | 1.7–1.95V core supply; all Vcc balls must be decoupled locally to meet AC noise and current-surge requirements. |
| Vss | Ground | Reference for all I/O and internal logic; multiple Vss balls require low-inductance connection to ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| Two-plane operation | Enables concurrent read/program across two independent planes, doubling effective bandwidth without increasing clock rate. |
| Copy Back command | Permits page-to-page relocation within the same die without external data buffering - reduces host RAM usage in wear leveling. |
| ONFI 2.3 compatibility | Ensures interoperability with standard NAND controllers and avoids custom driver development for timing and command mapping. |
| 128-byte spare area per page | Provides dedicated space for ECC syndromes, logical-to-physical mapping, and bad-block flags - essential for robust FTL implementation. |
| Industrial temperature range | -40°C to +85°C operation confirmed; supports deployment in factory automation, transportation, and outdoor edge nodes. |
Applications
| Industrial Firmware Storage | Secure Boot Code Shadowing |
|---|---|
|
Use Scenario: Storing bootloader, FPGA bitstreams, and OS kernel images in programmable logic controllers (PLCs) and HMIs where field updates are infrequent but mission-critical. IC Role / Device Role / Timing Role: Non-volatile code storage with deterministic read latency and guaranteed 10-year data retention at elevated ambient temperatures. Use Value: Eliminates need for external SPI NOR for boot code while providing higher density and lower cost-per-bit than parallel NOR. |
Use Scenario: Loading verified firmware images from persistent storage into RAM at power-on for secure execution in medical diagnostic equipment. IC Role / Device Role / Timing Role: High-integrity storage medium supporting authenticated read sequences and hardware write-protection via #WP pin. Use Value: Enables root-of-trust chain by ensuring boot code integrity against corruption or tampering during power cycling. |
| Embedded Data Logging | Media Buffering in Edge Gateways |
|
Use Scenario: Capturing sensor telemetry, error logs, and event timestamps in railway signaling systems operating continuously for >15 years. IC Role / Device Role / Timing Role: Wear-leveling-aware storage with 60,000 P/E cycles and built-in bad-block management for long-term reliability. Use Value: Reduces maintenance frequency and eliminates need for periodic manual log archive replacement. |
Use Scenario: Temporarily buffering video streams from IP cameras before compression and upload in smart city surveillance gateways. IC Role / Device Role / Timing Role: High-throughput sequential write buffer leveraging two-plane programming to sustain >10 MB/s sustained write rates. Use Value: Absorbs bursty camera traffic without dropping frames, even during network congestion or reconnection events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F2G08ABAEAH4 | 2G-bit x8 SLC NAND, 3.3V supply, 48-TSOP package; lacks ONFI 2.3 compliance and two-plane operation. | Suitable for legacy 3.3V systems with existing TSOP footprints; not drop-in for 1.8V or high-speed dual-plane use cases. | Select only if voltage compatibility and board layout constrain migration from 3.3V designs. |
| TC58NVG2S3HTAI0 | 2G-bit x8 SLC NAND, 1.8V supply, 48-VFBGA; supports ONFI 2.3 but has slower 30μs random read and no Copy Back command. | Better suited for cost-sensitive consumer applications where advanced wear-leveling features are unnecessary. | Prefer when strict 25μs read latency or in-die data relocation is not required, and BOM simplification is prioritized. |
Compared with MT29F2G08ABAEAH4 and TC58NVG2S3HTAI0, W29N02KZDIBE delivers superior random access performance, integrated two-plane concurrency, and Copy Back capability - making it optimal for industrial firmware and real-time logging where latency, endurance, and feature-richness are design-critical.
Availability
W29N02KZDIBE is available at Aetrix Electronics and suitable for industrial firmware storage, secure boot code shadowing, and embedded data logging requiring stable component supply across extended product lifecycles.
Supply support for W29N02KZDIBE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and communications markets.
W29N02KZDIBE belongs to Winbond's W29N02KW/Z series of SLC NAND Flash devices, designed specifically for high-reliability embedded applications demanding long data retention, wide temperature operation, and ONFI-standard interoperability.
FAQ
What is the operating voltage range for W29N02KZDIBE?
W29N02KZDIBE operates from 1.7V to 1.95V, with nominal 1.8V supply. This narrow range ensures compatibility with modern low-power industrial SoCs and eliminates need for level-shifting circuitry. All electrical characteristics-including read current (13mA typ.), program current (10mA typ.), and standby current (10μA typ.)-are specified within this window. Operation outside this range may cause functional failure or accelerated wear.
Does W29N02KZDIBE support ONFI standards?
Yes, W29N02KZDIBE supports ONFI 2.3 timing conventions and command definitions, enabling plug-and-play integration with standard NAND controllers. It responds to ONFI identification commands (e.g., Read ID at 90h, Read Parameter Page at ECh) and adheres to ONFI-specified tRC, tREA, and tWB timing parameters. This eliminates custom timing register configuration in most host drivers.
What package type is used by W29N02KZDIBE?
W29N02KZDIBE uses a 48-ball Very Fine-Pitch Ball Grid Array (VFBGA) package with D-code footprint (7.0mm × 9.0mm, 0.5mm pitch). Pin assignments match Figure 3-2 and Figure 3-3 in the datasheet for x8 bus configuration. The package includes dedicated Vcc/Vss balls requiring proper PCB decoupling and thermal relief for reflow soldering in industrial-grade assemblies.
How many program/erase cycles does W29N02KZDIBE guarantee?
W29N02KZDIBE guarantees 60,000 program/erase cycles when used with 8-bit/544-byte ECC correction, as specified in the datasheet. This endurance rating assumes proper wear-leveling firmware and adherence to recommended voltage, temperature, and timing margins. Exceeding the specified 1.95V max supply or operating above 85°C ambient will reduce actual cycle life.
What is the purpose of the spare area in each page of W29N02KZDIBE?
Each 2,176-byte page of W29N02KZDIBE contains a 128-byte spare area used exclusively for metadata: ECC syndromes, logical-to-physical address mapping, bad-block flags, and wear-leveling counters. This area is inaccessible during normal main-data read/write but is essential for robust flash translation layer (FTL) implementation and cannot be repurposed for user data.
W29N02KZDIBE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- ONFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns, 700µs
- Access Time:
- 22 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (8x6.5)
W29N02KZDIBE FAQ
1.How can I place an order for W29N02KZDIBE through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N02KZDIBE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N02KZDIBE reliable?
The price and inventory of W29N02KZDIBE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N02KZDIBE is usually 5 days.
3.What payment methods are accepted for W29N02KZDIBE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N02KZDIBE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N02KZDIBE?
W29N02KZDIBE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N02KZDIBE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N02KZDIBE?
For technical support, including W29N02KZDIBE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N02KZDIBE requirements.
6.How does Aetrix verify that W29N02KZDIBE is sourced from the original manufacturer or authorized distributors?
All W29N02KZDIBE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N02KZDIBE meets industry standards.
7.What is the process for return or replacement of W29N02KZDIBE?
All W29N02KZDIBE units undergo pre-shipment inspection (PSI). If there is an issue with W29N02KZDIBE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N02KZDIBE part is unused and in its original packaging.
Return procedure for W29N02KZDIBE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29N02KZDIBE Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
