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Winbond Electronics Corporation W29N02KZDIBE TR
- Part No.:
- W29N02KZDIBE TR
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
W29N02KZDIBE TR.pdf
- Description:
- IC FLASH 2GBIT ONFI 48-VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,712
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Product details
Overview
W29N02KZDIBE TR from Winbond is a 2G-bit (256MB) single-level cell (SLC) NAND Flash memory operating at 1.7V–1.95V, organized into 2,048 blocks of 64 pages each (2,176 bytes/page, x8 bus), with 128-byte spare area per page for ECC and metadata. It supports standard NAND commands including two-plane read/program, copy-back, and ONFI-compatible timing, targeting embedded storage in industrial controllers and boot code shadowing.
For engineers reviewing the W29N02KZDIBE TR datasheet, W29N02KZDIBE TR pinout, W29N02KZDIBE TR application, or W29N02KZDIBE TR equivalent, key selection criteria include its 48-ball VFBGA (x8) package, 25μs random read latency, 250μs typical page program time, 2ms block erase time, and 60,000 P/E cycle endurance under 8-bit/544-byte ECC - all critical for reliable firmware storage in space-constrained, low-power systems.
Technical Context
This device implements a multiplexed x8 I/O bus with five dedicated control signals (#CE, #RE, #WE, CLE, ALE) to manage command, address, and data transfers on shared pins. Its internal architecture includes a 2,048-block array where each block contains 64 pages, and each page holds 2,048 bytes of main data plus 128 bytes of spare area for error correction and wear-leveling metadata.
It supports ONFI 2.3–compatible timing modes, including #CE don't-care operations and EDO-style serial access, and features hardware write protection via #WP and status monitoring via open-drain RY/#BY. The device requires external ECC handling (8-bit/544-byte minimum) and uses standard NAND command set extensions for two-plane and copy-back operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 2G-bit / 256MB total capacity, enabling compact firmware and parameter storage without external expansion. |
| Bus Width | x8 interface (I/O[0–7]), reducing PCB trace count and simplifying controller interface design. |
| Page Size | 2,176 bytes (2,048 + 128 spare), supporting robust ECC and metadata storage per page. |
| Block Size | 139,264 bytes (64 × 2,176), defining minimum erasable unit for wear leveling and bad-block management. |
| Random Read | 25 μs max latency, enabling responsive code execution during boot or runtime data fetch. |
| Page Program | 250 μs typical time, balancing write speed against power and reliability in field-updatable systems. |
| Block Erase | 2 ms typical time, allowing rapid reconfiguration of storage partitions during firmware updates. |
| Endurance | 60,000 program/erase cycles with 8-bit/544-byte ECC, ensuring multi-year operation in industrial logging applications. |
Pinout & Package
W29N02KZDIBE TR is packaged in a 48-ball Very Fine-Pitch Ball Grid Array (VFBGA), 6mm × 8mm, 0.5mm pitch, marked with package code "D". All Vcc and Vss balls must be connected; DNU (Do Not Use) and N.C. (No Connect) balls are unconnected and must remain floating.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable input | Active-low global enable: high = standby (10μA), low = active; enables command/address/data latching. |
| #RE | Read Enable input | Active-low strobe controlling serial data output from register; column address auto-increments per pulse. |
| #WE | Write Enable input | Active-low strobe latching commands, addresses, or data on rising edge; defines write timing window. |
| CLE | Command Latch Enable input | High = next byte on I/O bus is command (e.g., 00h, 80h); enables command decode logic. |
| ALE | Address Latch Enable input | High = next byte on I/O bus is address; routes to internal row/column address registers. |
| RY/#BY | Ready/Busy output | Open-drain signal: low = device busy (program/erase/read in progress), high = ready for next command. |
| #WP | Write Protect input | Active-low hardware lock: low = prevents program/erase commands, protecting critical firmware regions. |
| I/O[0–7] | Multiplexed data/command/address bus | Shared 8-bit bidirectional path for all transfers; requires external timing control per ONFI spec. |
| Vcc | Power supply | 1.7V–1.95V core supply; all Vcc balls must be decoupled locally to meet AC noise limits. |
| Vss | Ground | Reference for all I/O and internal logic; all Vss balls require low-impedance PCB ground plane connection. |
Key Features
| Feature | Design Value |
|---|---|
| Two-plane operation | Enables concurrent read/program across two independent planes, doubling effective throughput for sequential firmware loads. |
| Copy-back programming | Allows page-to-page data relocation within same die without external buffering, reducing host RAM usage during wear leveling. |
| ONFI 2.3 timing compatibility | Supports standardized #CE don't-care and EDO-style serial reads, easing migration from other ONFI-compliant NAND devices. |
| Hardware write protection | #WP pin provides immediate, non-volatile lock against accidental firmware overwrite during power transitions or reset events. |
| 128-byte spare area per page | Dedicated space for ECC syndromes, logical-to-physical mapping, and bad-block flags - essential for host-based FTL implementation. |
| Industrial temperature range | -40°C to +85°C operation ensures reliability in extended-temperature embedded systems like PLCs and automotive ECUs. |
Applications
| Industrial Controller Firmware Storage | Medical Device Boot Memory |
|---|---|
Use Scenario: Storing boot loader and application firmware in programmable logic controllers with no external storage interface. IC Role / Device Role / Timing Role: Primary non-volatile code storage with direct XIP-capable read access and field-upgradable partitioning. Use Value: 25μs random read and 60,000-cycle endurance ensure fast startup and long-term reliability across 10+ years of continuous operation. |
Use Scenario: Holding certified diagnostic firmware and calibration data in portable ultrasound units requiring regulatory-compliant data integrity. IC Role / Device Role / Timing Role: Secure, ECC-managed storage for safety-critical binaries with hardware write protection against runtime corruption. Use Value: #WP pin and 128-byte spare area enable deterministic, audit-ready firmware versioning and rollback capability. |
| Smart Meter Parameter Logging | Network Edge Router Configuration |
Use Scenario: Recording time-stamped energy consumption metrics in ANSI C12.19-compliant smart meters with limited battery-backed RAM. IC Role / Device Role / Timing Role: High-endurance data logger using block-level wear leveling and bad-block remapping managed by host MCU. Use Value: 2ms block erase and 250μs page program support frequent daily writes while maintaining >10-year data retention. |
Use Scenario: Storing boot configuration, routing tables, and secure keys in carrier-grade edge routers deployed in uncontrolled environments. IC Role / Device Role / Timing Role: Trusted configuration store with hardware write lock and deterministic timing for fail-safe recovery sequences. Use Value: -40°C to +85°C rating and ONFI-compatible timing ensure consistent behavior across thermal cycling and firmware update windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F2G08ABAEAH4-IT:E | 2G-bit x8 SLC NAND, 48-ball VFBGA, but rated for -40°C to +105°C and supports 3.3V I/O with level-shifter required for 1.8V systems. | Targeted at automotive under-hood use; higher temp grade increases cost and may over-spec for industrial control. | Select if extended temperature or AEC-Q100 qualification is mandatory; otherwise W29N02KZDIBE TR offers better cost/power fit for industrial designs. |
| TC58CVG2S3HRAIJ | 2G-bit x8 SLC NAND in 48-pin TSOP-I package (not BGA), identical 1.8V operation and timing, but lacks two-plane and copy-back commands. | Suitable for legacy board designs with TSOP footprint; no concurrent plane ops limits throughput in high-bandwidth logging. | Choose only when PCB layout prohibits BGA or when simplified command set suffices; W29N02KZDIBE TR delivers superior performance in new designs. |
Compared with MT29F2G08ABAEAH4-IT:E and TC58CVG2S3HRAIJ, W29N02KZDIBE TR uniquely balances industrial temperature compliance, 48-ball VFBGA footprint, ONFI 2.3 timing, and advanced two-plane/copy-back features - making it optimal for new embedded systems prioritizing density, power, and host-software efficiency.
Availability
W29N02KZDIBE TR is available at Aetrix Electronics and suitable for industrial controllers, medical diagnostics equipment, and smart metering systems requiring stable component supply, long-lifecycle support, and guaranteed traceability.
Supply support for W29N02KZDIBE TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.
The W29N series targets embedded systems needing high-reliability, low-voltage NAND Flash with SLC endurance and ONFI interoperability - designed specifically for boot code, firmware, and mission-critical data logging where bit errors and early wear-out are unacceptable.
FAQ
What is the operating voltage range for W29N02KZDIBE TR?
W29N02KZDIBE TR operates from 1.7V to 1.95V on its Vcc supply. This narrow 1.8V nominal range minimizes power consumption while maintaining signal integrity in battery-powered and thermally constrained embedded systems. Operation outside this range may cause data corruption or premature wear, and the device does not support 3.3V or dual-voltage interfaces.
Does W29N02KZDIBE TR support hardware write protection?
Yes, W29N02KZDIBE TR includes a dedicated #WP (Write Protect) input pin that, when driven low, disables all program and erase commands regardless of issued opcodes. This hardware lock protects firmware partitions during power-up, reset, or software faults - a critical feature for systems requiring IEC 62443 or ISO 26262 compliance.
What package type is used for W29N02KZDIBE TR?
W29N02KZDIBE TR uses a 48-ball Very Fine-Pitch Ball Grid Array (VFBGA) package, 6mm × 8mm with 0.5mm ball pitch, identified by package code "D". This compact, thermally efficient封装 supports high-density PCB layouts and meets IPC-7351B land pattern standards for automated assembly.
How many program/erase cycles does W29N02KZDIBE TR guarantee?
W29N02KZDIBE TR guarantees 60,000 program/erase cycles per block when used with 8-bit/544-byte ECC correction. This endurance rating assumes proper wear-leveling and bad-block management by the host controller - exceeding typical requirements for industrial firmware storage and parameter logging over 10+ year deployments.
Is W29N02KZDIBE TR compatible with ONFI specifications?
Yes, W29N02KZDIBE TR implements ONFI 2.3–compatible timing, including #CE don't-care operations and EDO-style serial data reads. While not a full ONFI-certified device, its timing parameters and command set alignment allow interoperability with ONFI-aware controllers and simplify migration from other compliant NAND Flash parts.
W29N02KZDIBE TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 2Gbit
- Memory Organization:
- 256M x 8
- Memory Interface:
- ONFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns, 700µs
- Access Time:
- 22 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (8x6.5)
W29N02KZDIBE TR FAQ
1.How can I place an order for W29N02KZDIBE TR through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N02KZDIBE TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N02KZDIBE TR reliable?
The price and inventory of W29N02KZDIBE TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N02KZDIBE TR is usually 5 days.
3.What payment methods are accepted for W29N02KZDIBE TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N02KZDIBE TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N02KZDIBE TR?
W29N02KZDIBE TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N02KZDIBE TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N02KZDIBE TR?
For technical support, including W29N02KZDIBE TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N02KZDIBE TR requirements.
6.How does Aetrix verify that W29N02KZDIBE TR is sourced from the original manufacturer or authorized distributors?
All W29N02KZDIBE TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N02KZDIBE TR meets industry standards.
7.What is the process for return or replacement of W29N02KZDIBE TR?
All W29N02KZDIBE TR units undergo pre-shipment inspection (PSI). If there is an issue with W29N02KZDIBE TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N02KZDIBE TR part is unused and in its original packaging.
Return procedure for W29N02KZDIBE TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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