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Winbond Electronics Corporation W29N04GVBIAA TR

Part No.:
W29N04GVBIAA TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
63-VFBGA
Datasheet:
AetrixW29N04GVBIAA TR.pdf
Description:
IC FLASH 4GBIT ONFI 63VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,279

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Product details

Overview

W29N04GVBIAA from Winbond is a 4 G-bit (512 MB) single-level cell (SLC) NAND Flash memory operating at 2.7–3.6 V, organized into 4,096 blocks of 135,168 bytes each (64 pages × 2,112 bytes/page), with 2,048-byte main data + 64-byte spare area per page. It supports standard NAND command set including two-plane read/program, cache operations, and copy-back, targeting embedded storage in space-constrained industrial systems.

For engineers reviewing the W29N04GVBIAA datasheet, W29N04GVBIAA pinout, W29N04GVBIAA application, or W29N04GVBIAA equivalent, key selection considerations include its 25 µs random read latency, 250 µs typical page program time, 100,000 P/E cycle endurance with 1-bit/528-byte ECC, TSOP1-48 and VFBGA-63 package options, and ONFI-compatible x8 multiplexed bus interface.

Technical Context

The W29N04GVBIAA implements a standard NAND architecture with dedicated CLE/ALE control lines for command/address latching, open-drain RY/#BY status signaling, and #WP-enabled hardware write protection. Its block-level erase granularity (128 KB + 4 KB) and page-level program capability (2,112 B) align with legacy NAND controller designs requiring minimal firmware adaptation.

It supports two-plane concurrent operations-enabling simultaneous read/program across independent planes-to reduce effective latency in high-throughput applications. The device uses SLC technology and requires external ECC (minimum 1-bit/528-byte) to meet its 100,000-cycle endurance and 10-year data retention specifications.

Key Specifications

ParameterValue and Actual Design Meaning
Density4 G-bit / 512 MB total capacity; enables compact code/data storage without multi-chip stacking.
Page Size2,112 bytes (2,048 B main + 64 B spare); spare area reserved for ECC metadata and bad-block management.
Block Size135,168 bytes (64 × 2,112 B); defines minimum erasable unit for wear leveling and garbage collection.
Random Read Time25 µs max; determines worst-case latency for non-sequential access in boot or configuration reads.
Page Program Time250 µs typical; impacts firmware update speed and logging throughput in real-time systems.
Endurance100,000 program/erase cycles (with 1-bit/528-byte ECC); sets usable lifetime under frequent write workloads.
Data Retention10 years at 25°C; specifies guaranteed data integrity without refresh in powered-off storage.

Pinout & Package

W29N04GVBIAA is packaged in a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) with 0.8 mm ball pitch, footprint 9 mm × 11 mm, and 1.0 mm height - optimized for high-density PCB layouts in industrial controllers and portable devices.

Pin/TerminalCircuit RoleDesign Meaning
#CEChip EnableActive-low global enable; places device in standby (10 µA) when high, enabling power gating in multi-device systems.
#WEWrite EnableRising-edge latch control for commands, addresses, and input data; synchronizes all write-side transfers.
#RERead EnableFalling-edge triggered serial output strobe; increments column address per pulse for sequential reads.
ALEAddress Latch EnableSignals I/O bus content as row/column address; required before issuing address cycles via #WE.
CLECommand Latch EnableSignals I/O bus content as command byte (e.g., 00h, 30h, 80h); required before issuing command cycles via #WE.
RY/#BYReady/Busy OutputOpen-drain status indicator; low during active operations (read/program/erase), high when idle or completed.
#WPWrite Protect InputHardware lock: drives low to disable all program/erase commands, preventing accidental corruption.
I/O[0–7]Multiplexed Data BusBi-directional 8-bit bus carrying commands, addresses, and data; requires external demux logic or controller support.

Key Features

FeatureDesign Value
Two-plane operationEnables concurrent read or program across independent memory planes, reducing effective latency by up to 50% in burst-access scenarios.
Cache Read/ProgramOverlaps internal flash access with host I/O transfer, improving sustained throughput by hiding internal timing overhead.
Copy BackPermits page-to-page relocation within the same die without external buffering, accelerating garbage collection and wear leveling.
ONFI-compatible interfaceSupports standardized timing and command extensions (e.g., SET/GET FEATURES), easing migration from other ONFI-compliant NANDs.
Hardware write protectPhysical #WP pin disables all destructive operations independently of software state, critical for fail-safe firmware storage.

Applications

Industrial HMI StorageMedical Device Log Buffer

Use Scenario: Storing firmware images, UI assets, and calibration tables in panel-mounted human-machine interfaces exposed to -40°C to 85°C ambient.

IC Role / Device Role / Timing Role: Non-volatile code and configuration storage with deterministic 25 µs random read for fast GUI initialization.

Use Value: SLC reliability and 100,000-cycle endurance ensure >10-year field operation without silent corruption in unattended deployments.

Use Scenario: Capturing timestamped sensor logs and diagnostic snapshots in portable ultrasound or infusion pumps with limited board space.

IC Role / Device Role / Timing Role: High-integrity data logger using 2,112-byte pages with dedicated 64-byte spare area for ECC and metadata tagging.

Use Value: Two-plane concurrent read allows background log retrieval while foreground acquisition continues, eliminating I/O stalls.

Network Router Boot MemorySmart Energy Meter Firmware

Use Scenario: Hosting bootloader and OS kernel images in carrier-grade edge routers requiring secure, tamper-resistant startup code.

IC Role / Device Role / Timing Role: Secure boot storage with hardware #WP pin physically locked to prevent runtime firmware overwrite attacks.

Use Value: 10-year data retention at 85°C ensures valid boot image persistence through thermal cycling in outdoor cabinets.

Use Scenario: Storing tariff tables, encryption keys, and usage history in ANSI C12.22-compliant smart meters deployed in utility substations.

IC Role / Device Role / Timing Role: Long-life parameter storage leveraging SLC NAND's immunity to read disturb and program interference over 20+ year service life.

Use Value: 4 G-bit density consolidates multiple legacy EEPROM/Flash devices into one VFBGA-63 package, simplifying layout and qualification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND Flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MT29F4G08ABAEAH44 G-bit SLC NAND, 48-pin TSOP1 only; supports ONFI 2.3 but lacks two-plane operation.Requires PCB redesign for TSOP1 footprint; no concurrent plane benefit for latency-critical logging.Select if TSOP1 is mandated and two-plane concurrency is unnecessary.
TC58NVG2S3HTAI04 G-bit SLC NAND, VFBGA-63; includes on-die ECC (4-bit), eliminating need for external ECC logic.Reduces host controller complexity but requires firmware adaptation for Toshiba-specific command extensions.Select if ECC offload and reduced BOM count outweigh vendor lock-in risk.

Compared with MT29F4G08ABAEAH4 and TC58NVG2S3HTAI0, W29N04GVBIAA offers unique two-plane concurrency in VFBGA-63 while maintaining full ONFI 1.0 compatibility and minimal external ECC requirements - making it optimal for latency-sensitive, space-constrained industrial firmware storage where controller resources are constrained.

Availability

W29N04GVBIAA is available at Aetrix Electronics and suitable for industrial HMI storage, medical device log buffering, and network router boot memory requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for W29N04GVBIAA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and communications markets since 1987.

The W29N series targets cost-sensitive, reliability-critical embedded systems needing SLC NAND performance without enterprise-grade complexity - emphasizing robustness, long-term availability, and controller-agnostic ONFI interoperability.

FAQ

What is the operating voltage range for W29N04GVBIAA?

W29N04GVBIAA operates across a single 2.7 V to 3.6 V supply rail. This wide Vcc range accommodates varying power rail tolerances in industrial systems and simplifies power design by eliminating need for separate 3.3 V regulators. All DC and AC specifications - including 25 mA typical active current and 10 µA standby - are validated across this full range, ensuring consistent behavior from brown-out to overvoltage conditions. W29N04GVBIAA maintains full functionality and timing compliance throughout.

Does W29N04GVBIAA require external ECC, and if so, what level?

Yes, W29N04GVBIAA requires external ECC implementation. Its endurance rating of 100,000 program/erase cycles and 10-year data retention are specified with a minimum 1-bit error correction per 528-byte sector. This matches standard BCH-1 or Hamming ECC engines found in most ARM Cortex-A/R-based NAND controllers. Unlike some newer SLC NANDs with on-die ECC, W29N04GVBIAA relies on host-side correction - confirmed in Section 2 Features footnote (1) of the datasheet. W29N04GVBIAA does not include embedded ECC logic.

What package type does W29N04GVBIAA use, and how does it differ from W29N04GVBIAS?

W29N04GVBIAA uses a 63-ball VFBGA package (package code B), measuring 9 mm × 11 mm with 0.8 mm ball pitch. In contrast, W29N04GVBIAS uses a 48-pin TSOP1 package (code S), 12 mm × 20 mm. The 'A' suffix in W29N04GVBIAA denotes VFBGA; 'S' denotes TSOP1. Both share identical electrical specs and command set, but differ mechanically - requiring distinct PCB footprints and reflow profiles. W29N04GVBIAA is optimized for high-density layouts where board area is constrained.

Can W29N04GVBIAA perform simultaneous read and program operations?

Yes, W29N04GVBIAA supports two-plane concurrent operations, allowing independent read and program actions across separate memory planes. For example, a read can execute in Plane 0 while a program proceeds in Plane 1 - verified in Sections 9.1.3 (Two Plane Read) and 9.2.5 (Two Plane Page Program). This capability reduces effective latency in streaming applications like firmware updates or real-time data logging. However, both planes must reside on the same W29N04GVBIAA die; inter-die concurrency is not supported.

Is W29N04GVBIAA compatible with ONFI standards, and which version?

W29N04GVBIAA is ONFI 1.0 compliant, as confirmed by pinout compatibility (CLE/ALE/#CE/#RE/#WE), timing definitions (e.g., tREA, tR), and support for GET/SET FEATURES commands (EFh/EEh) per Section 9.6. It does not implement ONFI 2.x features such as NV-DDR interface or advanced power modes. The datasheet explicitly references ONFI compatibility in Notes to Figures 3-1/3-2 and Table 9-5 (Features), and recommends connecting NC/DNU pins per ONFI 1.0 guidelines. W29N04GVBIAA interoperates with standard ONFI 1.0 NAND controllers without modification.

W29N04GVBIAA TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
63-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
4Gbit
Memory Organization:
512M x 8
Memory Interface:
ONFI
Clock Frequency:
-
Write Cycle Time - Word, Page:
25ns, 700µs
Access Time:
20 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
63-VFBGA (9x11)

W29N04GVBIAA TR FAQ

1.How can I place an order for W29N04GVBIAA TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W29N04GVBIAA TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W29N04GVBIAA TR reliable?

The price and inventory of W29N04GVBIAA TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N04GVBIAA TR is usually 5 days.

3.What payment methods are accepted for W29N04GVBIAA TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N04GVBIAA TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W29N04GVBIAA TR?

W29N04GVBIAA TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W29N04GVBIAA TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W29N04GVBIAA TR?

For technical support, including W29N04GVBIAA TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N04GVBIAA TR requirements.

6.How does Aetrix verify that W29N04GVBIAA TR is sourced from the original manufacturer or authorized distributors?

All W29N04GVBIAA TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N04GVBIAA TR meets industry standards.

7.What is the process for return or replacement of W29N04GVBIAA TR?

All W29N04GVBIAA TR units undergo pre-shipment inspection (PSI). If there is an issue with W29N04GVBIAA TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W29N04GVBIAA TR part is unused and in its original packaging.

Return procedure for W29N04GVBIAA TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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