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Winbond Electronics Corporation W29N04GZBIBA

Part No.:
W29N04GZBIBA
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
63-VFBGA
Datasheet:
AetrixW29N04GZBIBA.pdf
Description:
IC FLASH 4GBIT ONFI 63VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,411

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Product details

Overview

W29N04GZBIBA from Winbond is a 4G-bit (512MB) SLC NAND Flash memory operating at 1.7–1.95V, organized into 4,096 erasable blocks of 135,168 bytes each (64 pages × 2,112 bytes), with x8/x16 bus interface, standard NAND command set including Copy Back and Two-Plane operations, and targeted for embedded code shadowing, media storage, and solid-state applications.

For engineers reviewing the W29N04GZBIBA datasheet, W29N04GZBIBA pinout, W29N04GZBIBA application, or W29N04GZBIBA equivalent, key selection considerations include its 1.8V single-supply operation, 25μs random read latency, 250μs typical page program time, 2ms block erase time, 100,000 P/E cycles endurance, and support for industrial temperature range (−40°C to +85°C).

Technical Context

The W29N04GZBIBA implements a standard NAND architecture with multiplexed I/O bus, five dedicated control signals (CLE, ALE, #CE, #RE, #WE), and status monitoring via open-drain RY/#BY. It supports both x8 and x16 data widths using shared I/O pins and uses plane addressing (A18) to enable concurrent Two-Plane operations.

Its internal organization includes a 2,048-byte main data area + 64-byte spare area per page, enabling ECC-based error management. The device executes commands-including READ ID (90h), READ STATUS (70h), PAGE PROGRAM (80h-10h), BLOCK ERASE (60h-D0h), and COPY BACK-via CLE/ALE-latched sequences on the same I/O bus.

Key Specifications

Parameter Value and Actual Design Meaning
Density 4 G-bit (512 MB total capacity), single-chip SLC solution eliminating multi-die stacking complexity
Supply Voltage 1.7 V to 1.95 V - enables direct integration with low-voltage SoCs and battery-powered systems
Page Size 2,112 bytes (2,048 B main + 64 B spare) - provides dedicated ECC metadata space for robust error correction
Block Size 135,168 bytes (64 × 2,112 B) - defines minimum erasable unit for wear leveling and bad-block management
Random Read Time 25 μs - determines latency for non-sequential access in boot code or configuration retrieval
Page Program Time 250 μs (typ.) - impacts firmware update speed and logging throughput in real-time systems
Endurance 100,000 program/erase cycles - specifies maximum write cycles before failure under 1-bit/528-byte ECC
Data Retention 10 years at 85°C - guarantees long-term reliability in industrial environments without refresh

Pinout & Package

W29N04GZBIBA is packaged in a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) with package code "B", footprint 9 mm × 11 mm × 1.0 mm, ball pitch 0.8 mm, and RoHS-compliant matte tin finish. This package supports high-density PCB layouts and thermal performance suitable for industrial embedded applications.

Pin/Terminal Circuit Role Design Meaning
#CE Chip Enable Active-low global enable; places device in standby (10 µA) when high, enabling power-gating in multi-chip systems
#WE Write Enable Rising-edge latch control for commands, addresses, and data - synchronizes all input transfers
#RE Read Enable Controls serial output timing; valid data appears after tREA (25 ns) from falling edge, enabling burst reads
ALE Address Latch Enable Signals that I/O bus carries row/column address - required before issuing address cycles in command sequence
CLE Command Latch Enable Signals that I/O bus carries command byte (e.g., 00h, 30h, 80h) - initiates operation state machine transitions
RY/#BY Ready/Busy Output Open-drain status indicator; low = active operation (read/program/erase), high = ready for next command
#WP Write Protect Input Hardware lock: low disables all program/erase - prevents corruption during power transients or firmware faults
I/O[0–7] Bidirectional Data Bus (x8 mode) Multiplexed path for commands, addresses, and data - reduces pin count vs parallel NOR, requires protocol-aware controller
Vcc / Vss Power / Ground Four Vcc and four Vss balls ensure stable 1.8V core supply and low-noise grounding for reliable NAND operation

Key Features

Feature Design Value
Two-Plane Operation Enables concurrent read/write across even/odd block planes - doubles effective bandwidth for streaming media or log buffering
Copy Back Command Permits page-to-page relocation within same die without external data buffering - reduces host RAM usage in wear-leveling algorithms
ONFI-Compatible Interface Supports standardized timing and command definitions - simplifies migration from other ONFI 2.x NAND devices
Industrial Temperature Range Guaranteed operation from −40°C to +85°C - qualified for automotive infotainment, industrial HMIs, and outdoor IoT gateways
Low Standby Current 10 µA typical CMOS standby - extends battery life in always-on edge sensors and portable diagnostic tools
ECC-Ready Spare Area 64-byte per-page spare region preallocated for BCH or RS ECC metadata - eliminates need for custom layout or padding logic

Applications

Embedded Boot Storage Industrial Data Logging

Use Scenario: Storing bootloader, FPGA bitstream, and OS kernel in resource-constrained microcontroller-based systems.

IC Role / Device Role / Timing Role: Non-volatile code storage with fast random read (25 μs) for rapid instruction fetch during cold start.

Use Value: Eliminates external SPI NOR + RAM combo; enables direct XIP-like execution via cache shadowing with deterministic latency.

Use Scenario: Continuous timestamped sensor data capture in factory automation PLCs and predictive maintenance gateways.

IC Role / Device Role / Timing Role: High-endurance (100K P/E) sequential write buffer supporting 250 μs page writes and background garbage collection.

Use Value: Sustains >10-year field operation under cyclic logging workloads without premature block wear-out.

Media Playback Buffer Secure Firmware Vault

Use Scenario: Local video/audio caching in digital signage, kiosks, and medical imaging displays.

IC Role / Device Role / Timing Role: Two-plane concurrent read enables seamless playback while prefetching next segment from alternate plane.

Use Value: Achieves >40 MB/s sustained read throughput without stutter, leveraging 25 ns sequential cycle time.

Use Scenario: Tamper-resistant storage of cryptographic keys, secure boot images, and OTA update packages.

IC Role / Device Role / Timing Role: Hardware write-protection (#WP pin) combined with block-lock capability prevents unauthorized firmware modification.

Use Value: Meets IEC 62443-3-3 SL2 requirements for immutable root-of-trust storage in certified industrial controllers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND Flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT29F4G08ABAEAH4-IT:E 4 G-bit SLC NAND, 3.3V supply, x8 only, 48-pin TSOP1 package Requires level-shifting for 1.8V hosts; lacks Two-Plane and Copy Back commands Select when legacy 3.3V controller compatibility is mandatory and advanced features are unused
TC58CVG2S0HRAIJ 4 G-bit SLC NAND, 1.8V supply, x8/x16, 63-ball VFBGA, supports ONFI 2.3 Higher random read latency (35 μs); identical endurance and retention specs Choose when ONFI 2.3 extended feature set (e.g., enhanced parameter page) is required over raw speed

Compared with MT29F4G08ABAEAH4-IT:E and TC58CVG2S0HRAIJ, W29N04GZBIBA delivers superior random read performance (25 μs vs. 35–50 μs), native Two-Plane concurrency, and lower active power (13 mA vs. ~18 mA), making it optimal for latency-sensitive, power-constrained embedded designs.

Availability

W29N04GZBIBA is available at Aetrix Electronics and suitable for embedded boot storage, industrial data logging, media playback buffering, and secure firmware vault applications requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature compliance.

Supply support for W29N04GZBIBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and TrustME® secure memory products, serving industrial, automotive, and communications markets since 1987.

The W29N series is Winbond's industrial-grade SLC NAND product line designed specifically for embedded systems demanding high reliability, low voltage operation, and extended temperature support - not general-purpose consumer storage.

FAQ

What is the operating voltage range for the W29N04GZBIBA?

The W29N04GZBIBA operates from 1.7 V to 1.95 V, with 1.8 V nominal supply. This narrow range ensures compatibility with modern low-power SoCs and eliminates need for external voltage regulation in battery-backed or energy-harvesting systems. All AC/DC specifications in the datasheet are characterized at 1.8 V, and operation outside this range may cause timing violations or data corruption.

Does the W29N04GZBIBA support both x8 and x16 bus widths?

Yes, the W29N04GZBIBA supports both x8 and x16 configurations in its 63-ball VFBGA package. Pin assignments differ between modes (e.g., I/O[8–15] used only in x16), and bus width is selected at power-up via specific address pin states per datasheet Section 7 (Mode Selection Table). No hardware reconfiguration is needed once initialized.

How many program/erase cycles does the W29N04GZBIBA guarantee?

The W29N04GZBIBA guarantees 100,000 program/erase cycles per block when used with 1-bit-per-528-byte ECC correction, as specified in the datasheet footnote. This endurance rating applies across the full industrial temperature range (−40°C to +85°C) and is validated using JEDEC JESD22-A117 stress methodology.

What NAND command set does the W29N04GZBIBA implement?

The W29N04GZBIBA implements the standard NAND command set (e.g., 00h/30h read, 80h/10h program, 60h/D0h erase) plus extended functions including Copy Back (00h/35h + 85h/10h) and Two-Plane operations (00h/00h/30h, 80h/00h/10h). It also supports GET/SET FEATURES (EEh/EFh) for runtime configuration of timing and protection settings.

Is the W29N04GZBIBA compatible with ONFI standards?

Yes, the W29N04GZBIBA is ONFI 2.2-compliant. Its timing parameters, command definitions, and electrical interface align with ONFI 2.2 specifications, enabling interoperability with ONFI-aware controllers. Winbond confirms ONFI compatibility in datasheet Section 2 (Features) and recommends connecting NC pins per ONFI guidelines for full compliance.

W29N04GZBIBA Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
63-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
4Gbit
Memory Organization:
512M x 8
Memory Interface:
ONFI
Clock Frequency:
-
Write Cycle Time - Word, Page:
25ns, 700µs
Access Time:
35 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
63-VFBGA (9x11)

W29N04GZBIBA FAQ

1.How can I place an order for W29N04GZBIBA through Aetrix?

Please submit a Request for Quotation (RFQ) for W29N04GZBIBA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W29N04GZBIBA reliable?

The price and inventory of W29N04GZBIBA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N04GZBIBA is usually 5 days.

3.What payment methods are accepted for W29N04GZBIBA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N04GZBIBA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W29N04GZBIBA?

W29N04GZBIBA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W29N04GZBIBA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W29N04GZBIBA?

For technical support, including W29N04GZBIBA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N04GZBIBA requirements.

6.How does Aetrix verify that W29N04GZBIBA is sourced from the original manufacturer or authorized distributors?

All W29N04GZBIBA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N04GZBIBA meets industry standards.

7.What is the process for return or replacement of W29N04GZBIBA?

All W29N04GZBIBA units undergo pre-shipment inspection (PSI). If there is an issue with W29N04GZBIBA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W29N04GZBIBA part is unused and in its original packaging.

Return procedure for W29N04GZBIBA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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