Winbond Electronics Corporation W29N04KZBIBF
- Part No.:
- W29N04KZBIBF
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 63-VFBGA
- Datasheet:
-
W29N04KZBIBF.pdf
- Description:
- IC FLASH 4GBIT ONFI 63VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
W29N04KZBIBF from Winbond is a 4G-bit (512MB) single-level cell (SLC) NAND Flash memory operating at 1.8V, organized into 4,096 erasable blocks of 139,264 bytes each, with 64 pages per block and 2,176-byte pages (2,048-byte main + 128-byte spare). It supports x8/x16 bus widths, ONFI-compatible command set, and targets embedded storage in space-constrained systems requiring reliable code shadowing and media data retention.
For engineers reviewing the W29N04KZBIBF datasheet, W29N04KZBIBF pinout, W29N04KZBIBF application, or W29N04KZBIBF equivalent, key selection criteria include its 1.7–1.95V supply range, 25μs random read latency, 250μs typical page program time, 2ms block erase time, and support for two-plane operations and copy-back commands in industrial temperature (-40°C to 85°C) operation.
Technical Context
The W29N04KZBIBF implements a standard NAND interface with multiplexed I/O[0–7] for command, address, and data transfer, controlled by five dedicated signals: CLE, ALE, #CE, #RE, and #WE. Its internal architecture includes a high-voltage generator, row/column decoders, and a 2,176-byte data register enabling page-level access and status monitoring via open-drain RY/#BY.
It supports ONFI 2.3-compliant timing and command protocols including enhanced status reads (78h), parameter page access (ECh), unique ID read (EDh), and feature configuration (EEh/EFh). Two-plane operation allows concurrent read/program/erase across even- and odd-numbered block planes, improving effective throughput without increasing clock frequency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 4G-bit / 512MB total capacity; enables compact boot code and firmware storage in resource-limited embedded systems. |
| Supply Voltage | 1.7V–1.95V; compatible with low-power 1.8V system rails and reduces voltage translation complexity. |
| Page Size | 2,176 bytes (2,048 + 128 spare); spare area reserved for ECC metadata and bad-block management. |
| Block Size | 139,264 bytes (64 × 2,176-byte pages); defines minimum erasable unit for wear leveling and firmware update granularity. |
| Random Read Time | 25μs max; determines latency for small-code fetches or configuration data lookups in real-time applications. |
| Page Program Time | 250μs typical; impacts firmware update speed and logging throughput in data-logging subsystems. |
| Endurance | 60,000 program/erase cycles (with 4-bit/544-byte ECC); specifies usable lifetime under repeated field updates. |
| Data Retention | 10 years at 85°C; guarantees nonvolatile data integrity over full industrial temperature lifecycle. |
Pinout & Package
W29N04KZBIBF is packaged in a 63-ball VFBGA (package code B), footprint-optimized for high-density PCB layouts. Ball pitch is 0.5mm; package dimensions are 9mm × 11mm × 1.0mm (max).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low global enable; places device in standby (10μA) when high, enabling power gating in multi-chip systems. |
| #WE | Write Enable | Rising-edge latch control for commands, addresses, and input data; synchronizes all write-side bus transactions. |
| #RE | Read Enable | Falling-edge triggered serial output strobe; controls data output timing and column address increment during sequential reads. |
| ALE | Address Latch Enable | Signals that I/O bus carries row/column address data; latched on rising #WE edge for internal address decoding. |
| CLE | Command Latch Enable | Signals that I/O bus carries command codes (e.g., 00h, 30h, 80h, 10h); latched on rising #WE edge to initiate operations. |
| RY/#BY | Ready/Busy Output | Open-drain status indicator; low = active operation (read/program/erase), high = ready for next command. |
| #WP | Write Protect | Hardware lock; active-low assertion disables all program and erase commands, preventing accidental corruption. |
| I/O[0–7] | Multiplexed Data Bus | Bi-directional 8-bit bus for command, address, and data transfer; supports both x8 and x16 configurations via internal mapping. |
| Vcc / Vss | Power / Ground | Multiple Vcc/Vss balls ensure stable core voltage delivery and low-impedance return paths for noise-sensitive flash operations. |
Key Features
| Feature | Design Value |
|---|---|
| Two-plane operation | Enables concurrent read/program/erase across even- and odd-numbered block planes, doubling effective bandwidth for streaming workloads. |
| Copy-back programming | Allows page-to-page data relocation within NAND array without external buffering, reducing host RAM usage and improving wear-leveling efficiency. |
| ONFI 2.3 compatibility | Ensures interoperability with standardized NAND controllers and simplifies driver development across multiple vendors' platforms. |
| Parameter page access (ECh) | Provides standardized, vendor-agnostic access to device geometry, timing, and feature configuration-critical for auto-detection in bootloader environments. |
| Unique ID read (EDh) | Returns factory-programmed 128-bit serial number per die, enabling secure device authentication and traceability in certified industrial deployments. |
Applications
| Industrial HMI Storage | Medical Device Firmware |
|---|---|
Use Scenario: Storing GUI assets, calibration tables, and localized language packs in panel-mounted HMIs with limited board space and no removable media. IC Role / Device Role / Timing Role: Nonvolatile code and data storage with fast random read for UI responsiveness and robust erase endurance for field-upgradable firmware. Use Value: 25μs random read latency ensures sub-30ms screen refresh on menu navigation; 60,000 P/E cycles support >5 years of quarterly firmware updates. | Use Scenario: Holding FDA-compliant boot firmware, device configuration, and audit logs in portable diagnostic equipment requiring long-term data integrity. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage with guaranteed 10-year data retention at 85°C and hardware write protection against unintended reprogramming. Use Value: #WP pin enables fail-safe lockdown during clinical use; 10-year retention meets IEC 62304 software lifecycle requirements for Class II devices. |
| Automotive Telematics Boot | Edge AI Inference Logging |
Use Scenario: Storing boot images and OTA update staging partitions in automotive telematics control units operating across -40°C to 85°C ambient. IC Role / Device Role / Timing Role: Industrial-temperature SLC NAND providing deterministic boot timing and ECC-managed reliability in vibration-prone environments. Use Value: 2ms block erase enables <500ms OTA partition swap; dual-plane operation accelerates firmware validation before activation. | Use Scenario: Capturing sensor inference outputs and model weights in battery-powered edge AI nodes where power budget prohibits DRAM-based logging. IC Role / Device Role / Timing Role: Low-active-power (13mA read, 10μA standby) persistent buffer supporting burst-mode logging with minimal wake-up latency. Use Value: 10μA CMOS standby current extends battery life between uploads; copy-back feature enables seamless log rotation without host intervention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F4G08ABAEAH4-IT:E | 4G-bit x8 SLC NAND, 3.3V supply, 48-pin TSOP1 only; lacks two-plane and copy-back commands. | Requires level-shifting for 1.8V systems; unsuitable for high-throughput streaming or in-field wear leveling. | Select only if legacy 3.3V design exists and ONFI 2.3 features are unnecessary. |
| TC58CVG2S0HRAIJ | 4G-bit x8 SLC NAND, 1.8V, 63-ball VFBGA; supports ONFI 2.3 but has 30μs random read and no unique ID read (EDh) command. | Slightly lower read performance; missing factory-unique ID limits traceability in regulated deployments. | Prefer when cost sensitivity outweighs need for EDh-based authentication or sub-25μs latency. |
Compared with MT29F4G08ABAEAH4-IT:E and TC58CVG2S0HRAIJ, W29N04KZBIBF delivers superior random read speed (25μs), integrated two-plane concurrency, and factory-programmed unique ID-making it optimal for secure, high-reliability industrial and medical edge storage where timing determinism and device identity matter.
Availability
W29N04KZBIBF is available at Aetrix Electronics and suitable for industrial HMI storage, medical device firmware, and automotive telematics boot applications requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature operation.
Supply support for W29N04KZBIBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and communications markets since 1987.
The W29N series is Winbond's industrial-grade SLC NAND product line designed for mission-critical embedded storage where reliability, longevity, and standardized ONFI interoperability supersede raw density or cost-per-bit.
FAQ
What is the operating voltage range for W29N04KZBIBF?
W29N04KZBIBF operates from 1.7V to 1.95V, optimized for 1.8V system rails. This narrow range reduces power supply complexity and eliminates need for voltage translators in modern low-power embedded designs. The device maintains full functionality-including read, program, and erase-across this entire window, with DC and AC characteristics fully characterized per datasheet Table 10-2.
Does W29N04KZBIBF support ONFI standards, and which version?
Yes, W29N04KZBIBF is compliant with ONFI 2.3 specifications. It supports standardized command sets (e.g., ECh for parameter page, 78h for enhanced status), timing models, and electrical interfaces defined in ONFI 2.3, ensuring plug-and-play compatibility with ONFI-aware controllers and simplifying firmware portability across platforms.
What is the purpose of the spare area in each 2,176-byte page of W29N04KZBIBF?
The 128-byte spare area in each W29N04KZBIBF page is reserved for error correction code (ECC) metadata, logical-to-physical block mapping, wear-leveling counters, and bad-block flags. It is not user-accessible for general storage and must be managed by the host controller or flash translation layer to maintain data integrity across 60,000 program/erase cycles.
How does the two-plane operation in W29N04KZBIBF improve performance?
Two-plane operation in W29N04KZBIBF allows independent read, program, or erase actions on even- and odd-numbered block planes simultaneously-for example, reading from one plane while programming to the other. This concurrency effectively doubles sustained throughput for streaming applications without increasing clock speed or bus width, reducing effective latency in firmware update and media playback scenarios.
Is W29N04KZBIBF pin-compatible with other Winbond W29N04KW/Z variants?
W29N04KZBIBF shares identical 63-ball VFBGA pinout (package code B) and signal definitions with other W29N04KW/ZxxBF variants, including same ball assignments for #CE, CLE, ALE, #RE, #WE, RY/#BY, #WP, I/O[0–7], Vcc, and Vss. However, temperature grade (Industrial vs. Industrial Plus) and bus width configuration (x8 vs. x16) are masked in the suffix and do not affect pin compatibility.
W29N04KZBIBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 63-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 4Gbit
- Memory Organization:
- 512M x 8
- Memory Interface:
- ONFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns, 700µs
- Access Time:
- 25 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 63-VFBGA (9x11)
W29N04KZBIBF FAQ
1.How can I place an order for W29N04KZBIBF through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N04KZBIBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N04KZBIBF reliable?
The price and inventory of W29N04KZBIBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N04KZBIBF is usually 5 days.
3.What payment methods are accepted for W29N04KZBIBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N04KZBIBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N04KZBIBF?
W29N04KZBIBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N04KZBIBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N04KZBIBF?
For technical support, including W29N04KZBIBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N04KZBIBF requirements.
6.How does Aetrix verify that W29N04KZBIBF is sourced from the original manufacturer or authorized distributors?
All W29N04KZBIBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N04KZBIBF meets industry standards.
7.What is the process for return or replacement of W29N04KZBIBF?
All W29N04KZBIBF units undergo pre-shipment inspection (PSI). If there is an issue with W29N04KZBIBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N04KZBIBF part is unused and in its original packaging.
Return procedure for W29N04KZBIBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29N04KZBIBF Tags

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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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