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Winbond Electronics Corporation W29N04KZBIBF TR

Part No.:
W29N04KZBIBF TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
63-VFBGA
Datasheet:
AetrixW29N04KZBIBF TR.pdf
Description:
IC FLASH 4GBIT ONFI 63VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,663

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Product details

Overview

W29N04KZBIBF from Winbond is a 4G-bit (512MB) single-level cell (SLC) NAND Flash memory operating at 1.7V–1.95V, organized into 4,096 erasable blocks of 139,264 bytes each, with 2,176-byte pages (2,048B main + 128B spare), supporting x8/x16 bus widths and ONFI-compatible command set for embedded code shadowing, solid-state storage, and media data retention in space-constrained industrial systems.

For engineers reviewing the W29N04KZBIBF datasheet, W29N04KZBIBF pinout, W29N04KZBIBF application, or W29N04KZBIBF equivalent, key selection considerations include its 25μs random read latency, 250μs typical page program time, 60,000 P/E cycle endurance with 4-bit/544-byte ECC, 10-year data retention, and dual-plane operation support for concurrent read/write across physical block planes.

Technical Context

This SLC NAND device implements a multiplexed I/O interface with five dedicated control signals (CLE, ALE, #CE, #RE, #WE), open-drain RY/#BY status output, and #WP write protection - enabling standard NAND protocol execution without external address latches. Its internal architecture includes a high-voltage generator, row/column decoders, and a 2,176-byte data register to support sequential and random access modes.

It supports two-plane operations (simultaneous read/program/erase on even- and odd-numbered block groups), copy-back programming (on-die data relocation without host I/O), and enhanced status reporting (78h command), all compliant with ONFI 2.3 timing and command definitions for interoperability with standard NAND controllers.

Key Specifications

ParameterValue and Actual Design Meaning
Density4G-bit / 512MB total capacity; enables compact boot/code storage where parallel NOR is cost-prohibitive.
Page size2,176 bytes (2,048B main + 128B spare); spare area reserved for ECC metadata and wear-leveling tags.
Block size139,264 bytes (64 × 2,176-byte pages); defines minimum erase granularity for firmware update partitioning.
Random read25μs max; determines latency for small-code fetches during boot or real-time interrupt handling.
Page program250μs typical; impacts firmware update speed and logging throughput in embedded logging applications.
Endurance60,000 P/E cycles (with 4-bit/544-byte ECC); specifies field lifetime under frequent reprogramming.
Data retention10 years at 85°C; guarantees data integrity in unpowered industrial deployments.

Pinout & Package

W29N04KZBIBF is packaged in a 63-ball VFBGA (package code B), footprint-optimized for high-density PCB layouts. Ball pitch is 0.8mm; body size is 9mm × 11mm × 1.0mm max. All Vcc and Vss balls must be connected per datasheet requirement.

Pin/TerminalCircuit RoleDesign Meaning
#CEChip EnableActive-low global enable; places device in standby (10μA) when high, enabling multi-chip select decoding.
CLECommand Latch EnableSignals I/O bus carries command byte (e.g., 00h, 80h, 60h); latched on rising #WE edge.
ALEAddress Latch EnableSignals I/O bus carries address byte; latched on rising #WE edge for column/row addressing.
#WEWrite EnableRising edge latches CLE/ALE-controlled data; controls timing of command/address/data input setup/hold.
#RERead EnableFalling edge initiates serial data output from data register; tREA = 25ns max delay to valid I/O.
RY/#BYReady/BusyOpen-drain output; low = active operation (read/program/erase); used for polling or interrupt-driven flow control.
#WPWrite ProtectActive-low hardware lock; disables all program/erase when asserted, preventing accidental corruption.
I/O[0–7]Bidirectional Data BusMultiplexed path for commands, addresses, and data; supports x8 mode only in this variant (B package).
Vcc / VssPower / Ground1.7–1.95V supply; all Vcc/Vss balls must be connected - no floating power pins permitted.

Key Features

FeatureDesign Value
Two-plane operationEnables concurrent read from one plane while programming another, doubling effective throughput in streaming applications.
Copy-back programmingPermits on-die page-to-page data relocation without host I/O, reducing bus occupancy during wear-leveling or garbage collection.
ONFI 2.3 complianceEnsures interoperability with standard NAND controllers and avoids custom driver development for timing/command mapping.
Dual temperature gradesIndustrial Plus (-40°C to +105°C) rating supports extended thermal operation in automotive infotainment and industrial HMIs.
Low-power standby10μA typical CMOS standby current minimizes system leakage in battery-backed or always-on embedded nodes.

Applications

Industrial HMI StorageMedical Device Firmware

Use Scenario: Storing GUI assets, configuration profiles, and firmware images in panel-mounted HMIs exposed to wide ambient temperature swings.

IC Role / Device Role / Timing Role: Nonvolatile code and asset storage with fast random read for UI responsiveness and robust erase-block management for field updates.

Use Value: 25μs random read latency ensures sub-50ms screen redraws; 105°C rating guarantees reliability in sealed enclosures without active cooling.

Use Scenario: Holding FDA-compliant bootloader, calibration tables, and diagnostic logs in portable ultrasound or infusion pumps.

IC Role / Device Role / Timing Role: Secure, long-retention storage for safety-critical firmware with hardware write protection and ECC-managed data integrity.

Use Value: #WP pin prevents runtime corruption; 60,000 P/E cycles and 10-year retention meet Class II medical device lifecycle requirements.

Automotive InfotainmentIndustrial PLC Log Buffer

Use Scenario: Caching navigation maps, voice prompts, and OTA update packages in head-unit systems operating across vehicle thermal zones.

IC Role / Device Role / Timing Role: High-reliability local storage interfacing with SoC NAND controller via standard ONFI timing, supporting dual-plane streaming.

Use Value: Two-plane operation enables simultaneous map tile loading and voice buffer writing, eliminating I/O contention bottlenecks.

Use Scenario: Capturing sensor timestamps, fault codes, and process events in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: High-endurance cyclic logging medium with deterministic block erase timing (2ms typ.) for predictable log rotation intervals.

Use Value: 2ms block erase enables precise 100ms log flush cycles; 63-ball VFBGA allows dense placement near MCU without routing congestion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND Flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MT29F4G08ABAEAH4-IT:E4G-bit SLC NAND, 48-pin TSOP1, 1.7–1.95V, but uses Micron's proprietary command set and lacks ONFI 2.3 compliance.Requires custom driver adaptation; not drop-in compatible with ONFI-based controllers.Select only if existing design uses Micron toolchain and layout accommodates TSOP1 footprint.
TC58NVG2S3ETA004G-bit SLC NAND, 48-pin TSOP1, 2.7–3.6V supply - incompatible voltage domain; no 1.8V operation.Cannot replace W29N04KZBIBF without level-shifting or power rail redesign.Consider only for legacy 3.3V systems where voltage compatibility is confirmed.

Compared with MT29F4G08ABAEAH4-IT:E and TC58NVG2S3ETA00, W29N04KZBIBF offers ONFI 2.3 compliance for plug-and-play controller integration, 1.8V operation for ultra-low-power systems, and VFBGA packaging for space-constrained layouts - making it optimal for new industrial and automotive designs requiring standardized NAND interfaces.

Availability

W29N04KZBIBF is available at Aetrix Electronics and suitable for industrial HMI storage, medical device firmware, automotive infotainment, and industrial PLC log buffer applications requiring stable component supply, long-term lifecycle assurance, and guaranteed traceable sourcing.

Supply support for W29N04KZBIBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.

The W29N series targets embedded systems needing reliable, low-voltage, high-endurance NAND Flash with ONFI-standardized interfaces - designed specifically for code storage, firmware updates, and mission-critical data logging where NOR density or cost is prohibitive.

FAQ

What is the operating voltage range for W29N04KZBIBF?

W29N04KZBIBF operates from 1.7V to 1.95V, with typical performance characterized at 1.8V. This narrow 1.8V supply range enables ultra-low-power system design and eliminates need for voltage translation in modern 1.8V SoC platforms. The device does not support 3.3V or dual-voltage operation - using outside this range may cause functional failure or reduced endurance.

Does W29N04KZBIBF support ONFI-compliant timing and commands?

Yes, W29N04KZBIBF fully complies with ONFI 2.3 specifications for command set, timing parameters, and electrical interface. It supports standard commands (00h, 30h, 80h, 10h, 60h, D0h), timing diagrams (tREA, tR, tPROG), and features like Get/Set Features (EEh/EFh). This ensures interoperability with off-the-shelf ONFI NAND controllers without custom timing tuning.

What package type is used for W29N04KZBIBF?

W29N04KZBIBF uses a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) package with 0.8mm ball pitch and 9mm × 11mm body size. This package is optimized for high-density PCB layouts and supports both x8 and x16 configurations - though W29N04KZBIBF is configured for x8 operation. Pin assignments match Figure 3-2 in the official datasheet.

How many program/erase cycles does W29N04KZBIBF guarantee?

W29N04KZBIBF guarantees 60,000 program/erase cycles when used with 4-bit/544-byte ECC correction, as specified in the datasheet. This endurance rating assumes proper wear-leveling firmware and adherence to recommended voltage/timing margins. Without ECC, endurance drops significantly - system-level error correction is mandatory for sustained operation.

What is the purpose of the RY/#BY pin on W29N04KZBIBF?

The RY/#BY pin on W29N04KZBIBF is an open-drain Ready/Busy output that signals active internal operations: low indicates ongoing read, program, or erase; high confirms completion. It enables efficient polling or interrupt-driven host control - critical for deterministic timing in real-time embedded systems. Pull-up resistor (typically 10kΩ) is required externally per datasheet guidelines.

W29N04KZBIBF TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
63-VFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
4Gbit
Memory Organization:
512M x 8
Memory Interface:
ONFI
Clock Frequency:
-
Write Cycle Time - Word, Page:
25ns, 700µs
Access Time:
25 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
63-VFBGA (9x11)

W29N04KZBIBF TR FAQ

1.How can I place an order for W29N04KZBIBF TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W29N04KZBIBF TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W29N04KZBIBF TR reliable?

The price and inventory of W29N04KZBIBF TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N04KZBIBF TR is usually 5 days.

3.What payment methods are accepted for W29N04KZBIBF TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N04KZBIBF TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W29N04KZBIBF TR?

W29N04KZBIBF TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W29N04KZBIBF TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W29N04KZBIBF TR?

For technical support, including W29N04KZBIBF TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N04KZBIBF TR requirements.

6.How does Aetrix verify that W29N04KZBIBF TR is sourced from the original manufacturer or authorized distributors?

All W29N04KZBIBF TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N04KZBIBF TR meets industry standards.

7.What is the process for return or replacement of W29N04KZBIBF TR?

All W29N04KZBIBF TR units undergo pre-shipment inspection (PSI). If there is an issue with W29N04KZBIBF TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W29N04KZBIBF TR part is unused and in its original packaging.

Return procedure for W29N04KZBIBF TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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