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Winbond Electronics Corporation W29N04KZBIBG
- Part No.:
- W29N04KZBIBG
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 63-VFBGA
- Datasheet:
-
W29N04KZBIBG.pdf
- Description:
- IC FLASH 4GBIT ONFI 63VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,879
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Product details
Overview
W29N04KZBIBG from Winbond is a 4G-bit (512MB) single-level cell (SLC) NAND Flash memory operating at 1.7V–1.95V, organized into 2,048 blocks of 64 pages each (4,352 bytes/page), with x8/x16 bus interface and support for ONFI-compatible command set. It delivers 25μs random read access and 2ms typical block erase time, targeting embedded boot storage, firmware code shadowing, and industrial data logging.
For engineers reviewing the W29N04KZBIBG datasheet, W29N04KZBIBG pinout, W29N04KZBIBG application, or W29N04KZBIBG equivalent, key selection criteria include its 1.8V supply compatibility, TSOP1/VFBGA package options, 60,000 program/erase cycles, 10-year data retention, and support for Copy Back and SET/GET FEATURES commands per ONFI 2.3.
Technical Context
This SLC NAND device implements a multiplexed 8-/16-bit I/O bus with five dedicated control signals (CLE, ALE, #CE, #WE, #RE) to manage command, address, and data latching via edge-triggered protocols. Its internal logic includes a high-voltage generator, row/column decoders, and a 4,352-byte data register supporting sequential and random page access.
It supports standard NAND operations - PAGE READ (00h-30h), PAGE PROGRAM (80h-10h), BLOCK ERASE (60h-D0h), and RESET (FFh) - plus extended features including COPY BACK, READ UNIQUE ID (EDh), and programmable ONFI feature registers (address 80h/81h) for timing and protection configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 4 G-bit / 512 MB total capacity; enables compact firmware storage without external expansion. |
| Supply Voltage | 1.7 V to 1.95 V; compatible with low-power 1.8V system rails and reduces voltage translation overhead. |
| Page Size | 4,352 bytes (4,096 + 256 spare); spare area reserved for ECC metadata and bad-block management. |
| Block Size | 278,528 bytes (64 × 4,352 B); defines minimum erasable unit for wear leveling and FTL mapping. |
| Endurance | 60,000 P/E cycles (with 8-bit/544-byte ECC); ensures long-term reliability in frequent-write embedded applications. |
| Data Retention | 10 years at 85°C; validated for industrial temperature operation without refresh. |
| Random Read | 25 μs max; enables fast code execution during boot or interrupt handling. |
| Page Program Time | 250 μs typical; determines minimum write latency for firmware updates or log writes. |
Pinout & Package
W29N04KZBIBG is packaged in a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) with 0.5 mm pitch, footprint 9 mm × 11 mm, compliant with JEDEC MO-276AA. Pin assignments differ for x8 and x16 configurations; this variant uses x8 bus mode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low global enable; places device in standby (10 µA) when high, enabling power gating. |
| #WE | Write Enable | Rising-edge latch control for commands, addresses, and input data; synchronizes all write-cycle timing. |
| #RE | Read Enable | Rising-edge initiates serial output from data register; falling-edge triggers tREA delay before valid I/O data. |
| ALE | Address Latch Enable | High pulse enables latching of column/row address bytes on I/O bus during #WE rising edge. |
| CLE | Command Latch Enable | High pulse enables latching of command codes (e.g., 00h, 80h, 60h) on I/O bus during #WE rising edge. |
| RY/#BY | Ready/Busy Output | Open-drain status signal; low = active operation (read/program/erase), high = ready for next command. |
| #WP | Write Protect | Active-low hardware lock; disables all program/erase when asserted, preventing accidental corruption. |
| I/O[0–7] | Bidirectional Data Bus | Multiplexed path for commands (1st cycle), addresses (2nd–5th cycles), and data (read/write); x8 mode only. |
| Vcc | Power Supply | 1.7–1.95 V core supply; all Vcc balls must be connected to stable low-noise 1.8V rail. |
| Vss | Ground | Reference ground; all Vss balls require low-impedance connection to PCB ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| ONFI 2.3 Command Support | Enables interoperability with standardized NAND controllers and simplifies driver development across platforms. |
| Copy Back Operation | Allows page-to-page relocation within same die without external buffering, reducing host RAM usage during wear leveling. |
| SET/GET FEATURES Registers | Configurable timing parameters (e.g., tADL, tWB) and protection settings via address 80h/81h, enabling runtime tuning. |
| Hardware Write Protection | #WP pin provides fail-safe, non-volatile lock against unintended program/erase - critical for field-upgrade safety. |
| Industrial Plus Temp Range | -40°C to +105°C operation with 20 µA standby current; qualified for under-hood automotive or high-ambient industrial use. |
Applications
| Industrial HMI Boot Storage | Medical Device Firmware Log |
|---|---|
|
Use Scenario: Stores bootloader and OS kernel in panel-mounted HMIs where space and power are constrained. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with direct XIP-capable read performance (25 μs random access). Use Value: Enables fast cold boot (<500 ms) and eliminates need for external SPI NOR + DRAM combo. |
Use Scenario: Captures diagnostic logs and calibration data in portable ultrasound or infusion pumps. IC Role / Device Role / Timing Role: High-reliability data logger using SLC endurance (60K cycles) and 10-year retention at 85°C. Use Value: Guarantees integrity of patient-critical event records across product lifetime without refresh. |
| Smart Meter Firmware Update | Railway Signaling Black Box |
|
Use Scenario: Hosts field-upgradable firmware images in ANSI C12.22-compliant smart meters deployed outdoors. IC Role / Device Role / Timing Role: Secure update partition with hardware #WP lock and ONFI-standardized command flow. Use Value: Prevents corruption during brown-out events and supports authenticated dual-bank OTA updates. |
Use Scenario: Records real-time train position, speed, and signaling state in EN 5012x-certified railway control units. IC Role / Device Role / Timing Role: Deterministic, radiation-tolerant storage with guaranteed 2ms block erase completion. Use Value: Meets SIL-3 data persistence requirements for post-incident forensic replay and compliance reporting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SLC NAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F4G08ABAEAH4-IT:E | 4G-bit SLC NAND, 3.3V supply, x8 interface, 48-TSOP, no ONFI 2.3 feature registers | Requires level-shifting for 1.8V hosts; lacks SET/GET FEATURES for dynamic timing adjustment | Select when legacy 3.3V controller compatibility is required and ONFI 2.3 features are unused. |
| TC58NVG2S3HTAI0 | 4G-bit SLC NAND, 1.8V supply, x8 interface, 63-VFBGA, supports ONFI 2.2 but not 2.3 GET/SET FEATURES | Similar package and voltage, but missing address 81h feature register for advanced protection modes | Choose if ONFI 2.2 suffices and industrial-plus temp rating is not needed (rated -40°C to +85°C only). |
Compared with MT29F4G08ABAEAH4-IT:E and TC58NVG2S3HTAI0, W29N04KZBIBG uniquely combines 1.8V operation, ONFI 2.3 feature configurability, and Industrial Plus temperature range - making it optimal for new 1.8V embedded designs requiring runtime timing tuning and extended thermal margin.
Availability
W29N04KZBIBG is available at Aetrix Electronics and suitable for industrial HMI boot storage, medical device firmware logging, smart meter firmware updates, railway black box recording, and other applications requiring stable component supply, long-life qualification, and guaranteed SLC NAND performance.
Supply support for W29N04KZBIBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and communications markets since 1987.
W29N04KZBIBG belongs to Winbond's W29N04KW/ZxxBG family of SLC NAND devices designed specifically for high-reliability embedded systems requiring deterministic timing, extended temperature operation, and ONFI-standardized command extensibility.
FAQ
What is the operating voltage range for W29N04KZBIBG?
W29N04KZBIBG operates from 1.7 V to 1.95 V, optimized for 1.8 V nominal systems. This narrow range minimizes power conversion complexity and supports direct connection to 1.8 V FPGA or MCU I/O banks without level shifters. The device maintains full functionality and specified timing across this range, including at temperature extremes up to +105°C.
Does W29N04KZBIBG support both x8 and x16 bus widths?
W29N04KZBIBG supports both x8 and x16 configurations, but the specific part number W29N04KZBIBG is configured for x8 operation in its 63-ball VFBGA package. Pin assignments differ between modes - x16 uses additional I/O pins (IO8–IO15) - and bus width is determined at power-on by the state of specific pins per datasheet Section 7 (Mode Selection Table). Configuration is fixed per orderable part number.
How many program/erase cycles does W29N04KZBIBG guarantee?
W29N04KZBIBG guarantees 60,000 program/erase cycles when used with 8-bit/544-byte ECC correction, as specified in the datasheet. This endurance rating is validated under industrial-plus conditions (-40°C to +105°C) and reflects real-world SLC NAND reliability for applications like firmware logging and infrequent updates where longevity is critical.
What package type is used for W29N04KZBIBG?
W29N04KZBIBG uses a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) package with 0.5 mm pitch and 9 mm × 11 mm body size (JEDEC MO-276AA). This compact, thermally efficient package supports high-density PCB layouts and is qualified for reflow soldering per J-STD-020. Pinout matches Figure 3-2 (x8 mode) in the official datasheet.
Does W29N04KZBIBG include hardware write protection?
Yes, W29N04KZBIBG includes a dedicated #WP (Write Protect) pin that, when driven low, disables all program and erase operations regardless of command sequence. This hardware lock prevents accidental firmware corruption during power transients or software faults and remains active across power cycles - a critical safeguard for field-deployed equipment.
W29N04KZBIBG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 63-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 4Gbit
- Memory Organization:
- 512M x 8
- Memory Interface:
- ONFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 35ns, 700µs
- Access Time:
- 25 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 63-VFBGA (9x11)
W29N04KZBIBG FAQ
1.How can I place an order for W29N04KZBIBG through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N04KZBIBG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N04KZBIBG reliable?
The price and inventory of W29N04KZBIBG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N04KZBIBG is usually 5 days.
3.What payment methods are accepted for W29N04KZBIBG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N04KZBIBG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N04KZBIBG?
W29N04KZBIBG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N04KZBIBG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N04KZBIBG?
For technical support, including W29N04KZBIBG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N04KZBIBG requirements.
6.How does Aetrix verify that W29N04KZBIBG is sourced from the original manufacturer or authorized distributors?
All W29N04KZBIBG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N04KZBIBG meets industry standards.
7.What is the process for return or replacement of W29N04KZBIBG?
All W29N04KZBIBG units undergo pre-shipment inspection (PSI). If there is an issue with W29N04KZBIBG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N04KZBIBG part is unused and in its original packaging.
Return procedure for W29N04KZBIBG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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