Winbond Electronics Corporation W29N04KZBIBG TR

Overview

W29N04KZBIBG TR from Winbond is a 4G-bit (512MB) single-level cell (SLC) NAND Flash memory operating at 1.7V–1.95V, organized into 2,048 blocks of 278,528 bytes each (64 × 4,352-byte pages), with x8/x16 bus interface and standard NAND command set including Copy Back. It delivers 25μs random read access and 250μs typical page program time for embedded code shadowing, solid-state storage, and media data buffering in space-constrained industrial systems.

For engineers reviewing the W29N04KZBIBG TR datasheet, W29N04KZBIBG TR pinout, W29N04KZBIBG TR application, or W29N04KZBIBG TR equivalent, key selection criteria include its 1.8V operation, TSOP1/VFBGA package options, ONFI-compatible control interface (CLE/ALE/#CE/#WE/#RE), RY/#BY status signaling, and support for ECC-based endurance up to 60,000 P/E cycles with 10-year data retention.

Technical Context

This SLC NAND device implements a multiplexed I/O bus architecture where CLE and ALE decode command and address latching on rising #WE edges, enabling full compatibility with standard NAND controllers. Its block-level erase (2ms typ.) and page-level program (250μs typ.) operations are managed via discrete control signals without internal address counters or serial interfaces.

The memory array uses dedicated spare area (256 bytes/page) for error management metadata, and supports both x8 and x16 configurations with distinct addressing schemes-column addresses (A0–A12 for x8, A0–A10 for x16) and row addresses (A13–A29 for x8, A11–A27 for x16)-all validated per ONFI timing specifications.

Key Specifications

Pinout & Package

W29N04KZBIBG TR is packaged in a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) with 0.5mm pitch, footprint 9mm × 11mm, suitable for high-density PCB layouts. Pin assignments match the x8 bus configuration per Figure 3-2.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND Flash memory applications.

Compared with MT29F4G08ABAEAH4-IT:E and TH58TVG7D2FLA89, W29N04KZBIBG TR uniquely combines 1.8V operation, Industrial Plus temperature range, and dual-package availability without requiring DDR or level-shift adaptations-making it optimal for new 1.8V embedded designs demanding long-term reliability and layout flexibility.

Availability

W29N04KZBIBG TR is available at Aetrix Electronics and suitable for industrial HMI storage, medical device firmware, smart meter data logging, and automotive telematics boot applications requiring stable component supply, long-lifecycle assurance, and traceable sourcing.

Supply support for W29N04KZBIBG TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash and SRAM, serving industrial, automotive, and communications markets since 1987.

W29N04KZBIBG TR belongs to Winbond's W29N04KW/ZxxBG family of SLC NAND Flash devices designed specifically for high-reliability embedded storage where endurance, data retention, and wide temperature operation are non-negotiable.

FAQ

What is the operating voltage range for W29N04KZBIBG TR?

W29N04KZBIBG TR operates from 1.7V to 1.95V, with nominal 1.8V supply. This narrow range simplifies power design in low-voltage embedded systems and eliminates need for external regulators when interfacing with 1.8V I/O SoCs. All DC and AC specifications-including 13mA active current and 20μA standby-are validated across this full range at +105°C.

Does W29N04KZBIBG TR support both x8 and x16 bus widths?

W29N04KZBIBG TR supports both x8 and x16 configurations at the die level, but the specific part number W29N04KZBIBG TR is configured for x8 operation in its 63-ball VFBGA (B-code) package. Pin assignments and timing parameters for x16 mode are documented separately for other variants-not applicable to this exact orderable part.

What is the endurance rating of W29N04KZBIBG TR and under what conditions is it specified?

W29N04KZBIBG TR guarantees 60,000 program/erase cycles, specified with 8-bit/544-byte ECC correction applied. This endurance is measured under JEDEC-standard conditions at 25°C and confirmed across the full Industrial Plus temperature range (-40°C to +105°C). No derating is required for operation within datasheet limits.

How does the Ready/Busy (RY/#BY) pin function on W29N04KZBIBG TR?

RY/#BY on W29N04KZBIBG TR is an open-drain output that goes low during any active operation-page read, program, block erase, or reset-and returns high upon completion. It must be externally pulled up; its state directly reflects internal state machine progress and is used by controllers to avoid command collisions without polling status registers.

Is W29N04KZBIBG TR compatible with ONFI standards?

Yes, W29N04KZBIBG TR implements ONFI 1.0–compatible command, timing, and electrical signaling-including CLE/ALE protocol, #WE-driven latching, and tREA/tR timing parameters. While not certified ONFI 2.x, its interface behavior aligns with baseline ONFI interoperability requirements for host controller integration.