Winbond Electronics Corporation W29N04KZSIBF

Overview

W29N04KZSIBF from Winbond is a 4G-bit (512MB) single-level cell (SLC) NAND Flash memory operating at 1.8V, organized into 4,096 erasable blocks of 139,264 bytes each, with 64 pages per block and 2,176-byte pages (2,048B main + 128B spare). It supports x8/x16 bus widths, ONFI-compatible command set, and targets embedded code storage, firmware boot images, and media data buffering in space-constrained industrial systems.

For engineers reviewing the W29N04KZSIBF datasheet, W29N04KZSIBF pinout, W29N04KZSIBF application, or W29N04KZSIBF equivalent, key selection considerations include its 1.7–1.95V supply range, 25μs random read latency, 250μs typical page program time, 60,000 P/E cycles with 4-bit/544-byte ECC, and support for two-plane operations to improve throughput in real-time firmware update and logging applications.

Technical Context

This SLC NAND device implements a multiplexed 8-/16-bit I/O bus controlled by five dedicated signals-CLE, ALE, #CE, #RE, and #WE-to latch commands, addresses, and data on rising edges of #WE. Its internal architecture includes a high-voltage generator, row/column decoders, and a 2,176-byte data register enabling pipelined read/write and copy-back operations.

It supports standard NAND commands plus enhanced features including two-plane concurrent read/program/erase, random data input/output, unique ID read (EDh), parameter page access (ECh), and configurable features via EFh/EEh commands. Ready/Busy (RY/#BY) provides open-drain status signaling, while #WP enables hardware write protection independent of command execution.

Key Specifications

Pinout & Package

W29N04KZSIBF is packaged in a 63-ball VFBGA (package code B), footprint-optimized for high-density PCB layouts. Ball pitch is 0.8mm; package size is 9mm × 11mm × 1.0mm (max).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND Flash memory applications.

Compared with MT29F4G08ABAEAH4 and JS28F400C3BD95, W29N04KZSIBF offers optimal balance of 1.8V efficiency, x8 simplicity, and ONFI 2.3 interoperability-making it ideal for cost-sensitive, space-constrained industrial controllers where power and layout density are primary constraints.

Availability

W29N04KZSIBF is available at Aetrix Electronics and suitable for industrial firmware storage, medical device boot media, and automotive telematics units requiring stable component supply, long-lifecycle support, and guaranteed SLC NAND reliability.

Supply support for W29N04KZSIBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.

The W29N series delivers high-reliability SLC NAND optimized for embedded code storage and firmware update applications in harsh environments, emphasizing endurance, data retention, and ONFI-standardized interoperability.

FAQ

What is the operating voltage range for W29N04KZSIBF?

W29N04KZSIBF operates from 1.7V to 1.95V, with nominal 1.8V supply. This narrow range ensures compatibility with modern low-power SoCs and eliminates need for voltage translators. All DC and AC specifications-including 13mA typical read current and 10μA standby-are validated across this full range, making W29N04KZSIBF suitable for battery-backed and energy-harvesting systems where rail stability is critical.

Does W29N04KZSIBF support ONFI standards?

Yes, W29N04KZSIBF is compliant with ONFI 2.3 specifications, including standardized command set (e.g., GET FEATURES/SET FEATURES), timing parameters, and parameter page structure (ECh). This ensures plug-and-play integration with ONFI-aware controllers and simplifies driver development. Pin assignments and electrical characteristics align with ONFI 2.3 requirements, and Winbond confirms compatibility in official documentation for W29N04KZSIBF.

What is the endurance rating of W29N04KZSIBF and under what conditions?

W29N04KZSIBF is rated for 60,000 program/erase cycles, specified with 4-bit-per-544-byte ECC correction capability. This endurance assumes operation within the industrial-plus temperature range (-40°C to 105°C) and adherence to recommended voltage, timing, and command protocols. The rating reflects real-world SLC NAND behavior-not extrapolated from accelerated testing-and is validated per JEDEC JESD22-A117.

How does the two-plane operation in W29N04KZSIBF improve system performance?

W29N04KZSIBF partitions its 4,096-block array into two independent planes (even/odd block numbers), allowing concurrent operations-such as reading from one plane while programming to the other. This overlap reduces effective latency for firmware updates and logging, delivering up to 2× throughput versus single-plane execution. The feature is enabled via standard ONFI commands and requires no special controller hardware beyond ONFI 2.3 support.

What package type and ball count does W29N04KZSIBF use?

W29N04KZSIBF uses a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) package with 0.8mm pitch and 9mm × 11mm body size. The "SIBF" suffix explicitly denotes this VFBGA variant in x8 configuration. Pin assignments match Figure 3-2 in the datasheet, with dedicated I/O[0–7], control signals (#CE, #RE, #WE, CLE, ALE, #WP, RY/#BY), and multiple Vcc/Vss balls for robust power delivery.