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Winbond Electronics Corporation W29N04KZSIBG TR

Part No.:
W29N04KZSIBG TR
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
48-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixW29N04KZSIBG TR.pdf
Description:
IC FLASH 4GBIT ONFI 48TSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,420

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Product details

Overview

W29N04KZSIBG TR from Winbond is a 4G-bit (512MB) single-level cell (SLC) NAND Flash memory operating at 1.7–1.95V, organized into 2,048 blocks of 64 pages each (4,352 bytes/page), with x8/x16 bus interface and standard NAND command set. It delivers 25 µs random read access and 250 µs typical page program time, supporting code shadowing, media storage, and embedded solid-state applications.

For engineers reviewing the W29N04KZSIBG TR datasheet, W29N04KZSIBG TR pinout, W29N04KZSIBG TR application, or W29N04KZSIBG TR equivalent, key selection criteria include industrial temperature support (–40°C to +85°C), ONFI-compatible control interface (CLE/ALE/#CE/#WE/#RE), 60,000 program/erase cycles, and VFBGA-63 (x8) package compatibility for space-constrained designs.

Technical Context

The W29N04KZSIBG TR implements a standard NAND architecture with multiplexed I/O bus handling commands, addresses, and data via CLE and ALE strobes. Its internal logic includes dedicated Command and Address Registers, High-Voltage Generator, and Data Register synchronized to #WE and #RE edges.

It supports full ONFI 2.3–compatible operations including PAGE READ (00h–30h), PAGE PROGRAM (80h–10h), BLOCK ERASE (60h–D0h), COPY BACK, and GET/SET FEATURES (EEh/EFh). The device uses open-drain RY/#BY for status monitoring and features hardware write protection via active-low #WP.

Key Specifications

Parameter Value and Actual Design Meaning
Density 4 G-bit (512 MB total capacity), enabling compact firmware and media storage in resource-limited systems.
Page Size 4,352 bytes (4,096 main + 256 spare), providing dedicated ECC metadata space per page for robust error correction.
Block Size 278,528 bytes (64 × 4,352-byte pages), defining minimum erasable unit for wear leveling and bad-block management.
Endurance 60,000 program/erase cycles (with 8-bit/544-byte ECC), ensuring long-term reliability in frequent-write embedded logging.
Data Retention 10 years at 85°C, meeting industrial storage requirements without refresh under thermal stress.
Random Read 25 µs max latency, enabling responsive boot code execution and real-time data lookup.
Page Program Time 250 µs typical, supporting high-throughput firmware updates and buffered data writes.
Operating Voltage 1.7–1.95 V supply range, compatible with low-voltage SoC I/O domains and reducing system power overhead.

Pinout & Package

W29N04KZSIBG TR is packaged in a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) with 0.5 mm pitch, footprint 9.0 × 11.0 mm, suitable for high-density PCB layouts. Pin assignments are defined for x8 bus configuration per Figure 3-2.

Pin/Terminal Circuit Role Design Meaning
#CE Chip Enable Active-low global enable; places device in standby (10 µA) when high, enabling power-gating in idle states.
#WE Write Enable Rising-edge latch control for commands, addresses, and input data - critical for timing-critical NAND protocol compliance.
#RE Read Enable Rising-edge triggered serial data output from Data Register; governs tREA (25 ns) timing for reliable read sampling.
ALE Address Latch Enable Signals I/O bus content as row/column address; enables multi-cycle addressing for large 29-bit address space.
CLE Command Latch Enable Signals I/O bus content as command byte (e.g., 00h, 80h, 60h); required for all NAND state transitions.
RY/#BY Ready/Busy Output Open-drain status indicator; low during operation (program/erase/read), used for polling or interrupt-driven flow control.
#WP Write Protect Hardware lock: active-low disables all program/erase commands, preventing accidental corruption during power transients.
I/O[0–7] Bidirectional Data Bus Multiplexed path for commands (8-bit), addresses (5 cycles), and data (4,352 bytes/page); requires external bus arbitration.
Vcc / Vss Power / Ground Multiple dedicated Vcc/Vss balls ensure stable core voltage delivery and low-noise grounding for NAND array integrity.

Key Features

Feature Design Value
SLC NAND Architecture Guarantees deterministic performance and endurance vs. MLC/TLC, essential for industrial firmware storage.
ONFI-Compatible Interface Supports standardized command set (including COPY BACK, GET/SET FEATURES), simplifying driver portability across vendors.
Integrated Spare Area 256-byte per-page spare region pre-allocated for ECC syndromes, bad-block markers, and logical-to-physical mapping.
Industrial Temp Range –40°C to +85°C operation validated per JEDEC JESD22-A104, enabling deployment in automotive infotainment and industrial HMI.
Low Standby Current 10 µA typical CMOS standby current minimizes battery drain in always-on edge devices with periodic wake-up.
Hardware Write Protection Dedicated #WP pin provides fail-safe, non-software-dependent block against unintended erase/write during brown-out conditions.

Applications

Industrial HMI Storage Embedded Boot Media

Use Scenario: Storing GUI assets, firmware images, and configuration logs in panel-mounted HMIs deployed in factory automation cabinets.

IC Role / Device Role / Timing Role: Nonvolatile code and data storage with direct XIP-capable read access via NAND controller interface.

Use Value: 25 µs random read and 60,000-cycle endurance ensure responsive UI rendering and multi-year field reliability without refresh.

Use Scenario: Hosting bootloader and kernel image for ARM-based industrial gateways requiring secure, field-upgradable firmware.

IC Role / Device Role / Timing Role: Primary boot memory mapped through NAND flash controller; supports fast page reads and verified program/erase.

Use Value: 4,352-byte page size with 256-byte spare area enables robust BCH ECC implementation for bit-error resilience during OTA updates.

Medical Device Data Logging Smart Meter Firmware Archive

Use Scenario: Capturing timestamped sensor diagnostics and calibration records in portable ultrasound and ECG units.

IC Role / Device Role / Timing Role: Buffered write storage with hardware write protection (#WP) to prevent accidental overwrite during power loss.

Use Value: 250 µs typical page program time enables high-frequency logging without CPU blocking; 10-year retention ensures audit-compliant record longevity.

Use Scenario: Archiving firmware revisions and regulatory compliance certificates in ANSI C12.22–compliant smart electricity meters.

IC Role / Device Role / Timing Role: Secure, tamper-resistant firmware repository with hardware-level write disable during meter reset sequences.

Use Value: Industrial temperature rating (–40°C to +85°C) and 60,000-cycle endurance meet ANSI C12.22 lifetime requirements for 20+ year deployments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SLC NAND flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT29F4G08ABAEAH4-IT:E 4G-bit SLC NAND, 3.3V supply, x8 interface, 48-TSOP I package; lacks ONFI feature set and has higher Vcc. Requires level-shifting for 1.8V SoCs; suited for legacy 3.3V controller designs with simpler command sets. Select when interfacing with older NAND controllers lacking ONFI 2.3 support and where 3.3V rail is available.
TC58NVG2S3ETA00 4G-bit SLC NAND, 1.8V, x8, VFBGA-63; supports ONFI 2.3 but specifies 50,000 P/E cycles and 5-year retention at 85°C. Lower endurance and retention limit restrict use in long-life firmware archive applications. Prefer for cost-sensitive consumer-grade logging where 5-year data hold is sufficient and ECC overhead is minimized.

Compared with MT29F4G08ABAEAH4-IT:E and TC58NVG2S3ETA00, W29N04KZSIBG TR offers superior 10-year data retention and 60,000-cycle endurance at 1.8V, making it optimal for industrial firmware storage where long-term bit integrity and thermal stability are mandatory.

Availability

W29N04KZSIBG TR is available at Aetrix Electronics and suitable for industrial HMI storage, embedded boot media, medical data logging, and smart meter firmware archive applications requiring stable component supply, long-lifecycle assurance, and qualified SLC NAND performance.

Supply support for W29N04KZSIBG TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and communications markets.

The W29N series targets high-reliability embedded systems needing SLC NAND with industrial temperature support, ONFI compliance, and robust ECC-ready architecture for firmware and data storage.

FAQ

What is the operating voltage range for W29N04KZSIBG TR?

W29N04KZSIBG TR operates from 1.7 V to 1.95 V, optimized for low-power 1.8 V system interfaces. This narrow range ensures stable NAND array operation while minimizing I/O voltage translation complexity in modern SoC designs. The device's DC characteristics-including 13 mA typical active read current and 10 µA standby-are fully specified across this range per Table 10-2.

Does W29N04KZSIBG TR support ONFI commands?

Yes, W29N04KZSIBG TR supports ONFI 2.3–compliant commands including GET FEATURES (EEh) and SET FEATURES (EFh), as documented in Section 9.6 of the datasheet. These enable dynamic configuration of timing parameters, ECC modes, and vendor-specific features-critical for interoperability with standardized NAND controllers.

What package type is used for W29N04KZSIBG TR?

W29N04KZSIBG TR uses a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) package with 0.5 mm pitch and 9.0 × 11.0 mm body size (Package Code B). Pin assignments are defined for x8 bus operation per Figure 3-2, and the package supports automated reflow assembly per JEDEC J-STD-020.

How many program/erase cycles does W29N04KZSIBG TR guarantee?

W29N04KZSIBG TR guarantees 60,000 program/erase cycles when used with 8-bit/544-byte ECC, as stated in Section 2 Features and Table 10-7. This endurance rating is validated under industrial temperature conditions and forms the basis for wear-leveling algorithm design in host firmware.

What is the page and block structure of W29N04KZSIBG TR?

W29N04KZSIBG TR organizes memory into 2,048 erasable blocks, each containing 64 programmable pages of 4,352 bytes (4,096 main + 256 spare). This yields 512 MB total capacity. The spare area is reserved for ECC, bad-block markers, and logical-to-physical mapping metadata-enabling robust data integrity in embedded applications.

W29N04KZSIBG TR Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
48-TFSOP (0.724", 18.40mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
4Gbit
Memory Organization:
512M x 8
Memory Interface:
ONFI
Clock Frequency:
-
Write Cycle Time - Word, Page:
35ns, 700µs
Access Time:
25 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TSOP

W29N04KZSIBG TR FAQ

1.How can I place an order for W29N04KZSIBG TR through Aetrix?

Please submit a Request for Quotation (RFQ) for W29N04KZSIBG TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W29N04KZSIBG TR reliable?

The price and inventory of W29N04KZSIBG TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N04KZSIBG TR is usually 5 days.

3.What payment methods are accepted for W29N04KZSIBG TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N04KZSIBG TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W29N04KZSIBG TR?

W29N04KZSIBG TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W29N04KZSIBG TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W29N04KZSIBG TR?

For technical support, including W29N04KZSIBG TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N04KZSIBG TR requirements.

6.How does Aetrix verify that W29N04KZSIBG TR is sourced from the original manufacturer or authorized distributors?

All W29N04KZSIBG TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N04KZSIBG TR meets industry standards.

7.What is the process for return or replacement of W29N04KZSIBG TR?

All W29N04KZSIBG TR units undergo pre-shipment inspection (PSI). If there is an issue with W29N04KZSIBG TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W29N04KZSIBG TR part is unused and in its original packaging.

Return procedure for W29N04KZSIBG TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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