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Winbond Electronics Corporation W29N08GVBIAA
- Part No.:
- W29N08GVBIAA
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 63-VFBGA
- Datasheet:
-
W29N08GVBIAA.pdf
- Description:
- IC FLASH 8GBIT PAR 63VFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:530
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Product details
Overview
W29N08GVBIAA from Winbond is an 8G-bit (1GB) single-chip-stacked SLC NAND Flash memory in 63-ball VFBGA package, operating at 2.7–3.6V with x8 bus interface, supporting standard ONFI-compatible command set including Cache Read/Program, Copy Back, and Two-Plane operations. It delivers 25μs random read access and 250μs typical page program time for embedded storage in space-constrained systems such as industrial HMIs and boot media.
For engineers reviewing the W29N08GVBIAA datasheet, W29N08GVBIAA pinout, W29N08GVBIAA application, or W29N08GVBIAA equivalent, key selection criteria include its 1CE configuration, 63-ball VFBGA footprint, 100,000 P/E cycle endurance with 1-bit/528-byte ECC, and support for sequential/random cache operations in resource-limited embedded designs.
Technical Context
The W29N08GVBIAA implements a single-die NAND architecture organized into 8,192 erasable blocks (128KB + 4KB each), with 64 pages per block and 2,112-byte pages (2,048B main + 64B spare). It uses multiplexed x8 I/O with five dedicated control signals (CLE, ALE, #CE, #RE, #WE) and status signaling via RY/#BY.
It supports ONFI 1.0–compatible timing modes including EDO (Extended Data Out) for accelerated sequential reads, and features programmable features via SET/GET FEATURES commands (address 80h/81h), enabling configuration of timing parameters, protection settings, and OTP access - all under single 3.3V supply operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 8 G-bit (1,073,741,824 bytes usable); enables compact boot code and firmware storage without external memory expansion. |
| Page Size | 2,112 bytes (2,048B main + 64B spare); spare area supports ECC metadata and wear-leveling tables in host controller. |
| Block Size | 135,168 bytes (64 × 2,112B); defines minimum erase granularity for flash translation layer (FTL) implementation. |
| Random Read Time | 25 μs max; determines latency for small data fetches (e.g., configuration registers, boot headers). |
| Page Program Time | 250 μs typical; impacts firmware update speed and logging throughput in real-time applications. |
| Endurance | 100,000 program/erase cycles (with 1-bit/528-byte ECC); sets lifetime limit for write-intensive logging or parameter storage. |
| Data Retention | 10 years at 25°C; ensures long-term reliability of stored calibration data or device identity without refresh. |
Pinout & Package
W29N08GVBIAA is housed in a 63-ball Fine-Pitch Ball Grid Array (VFBGA) package, 9 mm × 11 mm × 1.0 mm, with 1 Chip Enable (1CE) configuration. All Vcc and Vss balls must be connected per datasheet requirement; DNU and N.C. balls are unconnected and must remain floating.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable input | Active-low enable signal; high = standby mode (20 μA), low = active operation; critical for power-gating in battery-powered systems. |
| CLE | Command Latch Enable input | Latches command codes (e.g., 00h, 30h, 80h, 10h) on rising edge of #WE; required before address/data transfer. |
| ALE | Address Latch Enable input | Latches column/row addresses on rising edge of #WE; separates command/address/data phases on shared x8 bus. |
| #WE | Write Enable input | Rising-edge-triggered strobe for latching CLE/ALE-controlled inputs; controls timing of command, address, and data setup/hold. |
| #RE | Read Enable input | Falling-edge-triggered strobe for serial data output; tREA = 25 ns max delay to valid I/O data; enables burst reads. |
| RY/#BY | Ready/Busy output | Open-drain active-low status indicator; asserts low during internal operations (read/program/erase); used for polling or interrupt-driven control. |
| #WP | Write Protect input | Active-low hardware lock; prevents accidental program/erase when asserted; supports sector-level protection via SET FEATURES. |
| I/O[0–7] | Multiplexed data/address/command bus | 8-bit bidirectional bus; carries commands (e.g., 90h ID), addresses (5-byte row/column), and data (2,112B/page); requires external bus arbitration. |
Key Features
| Feature | Design Value |
|---|---|
| Two-Plane Operation | Enables concurrent read/program across two independent planes (e.g., 00h-00h-30h), reducing effective latency by ~50% for interleaved access patterns. |
| Cache Read / Cache Program | Overlaps bus transfer with internal array access: sequential cache read achieves 25 ns cycle time; cache program hides page buffer load overhead. |
| Copy Back Program | Permits page-to-page move within same die without external buffering (85h-10h), accelerating wear leveling and garbage collection in FTL. |
| ONFI-Compatible Timing | Supports EDO mode and standardized AC timing (tRC, tREA, tWB), ensuring interoperability with ONFI-compliant controllers and simplifying timing validation. |
| OTP Area Support | One-Time Programmable region accessible via GET/SET FEATURES (contact Winbond); suitable for secure device ID, calibration constants, or anti-cloning keys. |
Applications
| Industrial HMI Boot Storage | Medical Device Firmware Archive |
|---|---|
|
Use Scenario: Storing boot loader, kernel image, and UI assets in a panel-mounted HMI with strict PCB area limits and no SD card slot. IC Role / Device Role / Timing Role: Primary non-volatile boot medium interfaced directly to ARM Cortex-A MCU via NAND controller peripheral. Use Value: 63-ball VFBGA footprint (9×11 mm) saves >40% board area vs. TSOP; 25 μs random read enables sub-100ms cold boot time. |
Use Scenario: Archiving FDA-mandated firmware revisions and audit logs in Class II medical imaging equipment requiring 10-year data integrity. IC Role / Device Role / Timing Role: Secure, long-retention firmware repository with ECC-managed writes and block-lock protection against field corruption. Use Value: 100K P/E cycles + 10-year retention meets IEC 62304 software lifecycle requirements; #WP pin enables hardware write lock during clinical operation. |
| Automotive Telematics Log Buffer | Smart Meter Firmware Update Store |
|
Use Scenario: Capturing CAN bus diagnostics and GPS traces in vehicle telematics units operating across -40°C to 85°C ambient. IC Role / Device Role / Timing Role: High-reliability logging buffer using Copy Back and Two-Plane ops to sustain 50 KB/s continuous write under thermal stress. Use Value: Industrial temperature grade (-40°C to 85°C) and 250 μs page program ensure deterministic log commit timing even at temperature extremes. |
Use Scenario: Storing encrypted OTA firmware updates in utility smart meters deployed in remote, unattended locations. IC Role / Device Role / Timing Role: Field-upgradeable code store managed by lightweight FTL; leverages SET FEATURES for custom timing and protection. Use Value: 1CE configuration simplifies routing on 2-layer meter PCBs; 64B spare area accommodates AES-GCM authentication tags per page. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F8G08ABABH4-IT | 8G-bit MLC NAND, 48-pin TSOP1, ONFI 2.3, 50K P/E cycles, 1-year retention at 85°C | Higher density per pin count but lower endurance; requires stronger ECC (4-bit/512B) | Select for cost-sensitive consumer apps where longevity < 5 years is acceptable; not drop-in due to MLC vs. SLC behavior and TSOP1 vs. VFBGA. |
| TC58NVG2S3HTAI0 | 8G-bit SLC NAND, 63-ball VFBGA, ONFI 2.1, 100K P/E, but 40 μs random read, no Two-Plane support | Same package and endurance, but lacks cache/two-plane acceleration; slower sequential throughput | Choose when pin compatibility is critical and performance headroom allows 60% longer read latency; verify FTL compatibility with missing features. |
Compared with MT29F8G08ABABH4-IT and TC58NVG2S3HTAI0, the W29N08GVBIAA uniquely combines VFBGA packaging, SLC reliability, Two-Plane concurrency, and Cache Read/Program - making it optimal for industrial boot storage where deterministic timing, long life, and compact layout are jointly required.
Availability
W29N08GVBIAA is available at Aetrix Electronics and suitable for industrial HMI boot storage, medical device firmware archive, and automotive telematics log buffer applications requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for W29N08GVBIAA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and communications markets since 1987.
The W29N08GVBIAA belongs to Winbond's W29N08GV SLC NAND family, designed specifically for embedded systems demanding high reliability, low-power operation, and compact packaging in harsh environments - not general-purpose data storage.
FAQ
What is the operating voltage range for the W29N08GVBIAA?
The W29N08GVBIAA operates over a single supply voltage range of 2.7V to 3.6V. Its DC electrical characteristics-including input thresholds, leakage current, and active/standby current-are fully specified across this range, with typical active current at 25mA (3V) and CMOS standby current at 20μA. This wide tolerance supports direct integration with 3.3V system rails while accommodating brown-out conditions down to 2.7V without functional loss.
Does the W29N08GVBIAA support ONFI compliance?
Yes, the W29N08GVBIAA supports ONFI 1.0–compatible timing and command protocols, including EDO (Extended Data Out) mode for accelerated sequential reads. It responds to ONFI ID commands (e.g., Read ID at 90h, Parameter Page at ECh) and adheres to ONFI-specified AC timing parameters (tRC, tREA, tWB). However, it does not implement ONFI 2.x features like NV-DDR or advanced power modes.
How many program/erase cycles does the W29N08GVBIAA guarantee?
The W29N08GVBIAA guarantees 100,000 program/erase cycles per block when used with 1-bit-per-528-byte ECC correction, as specified in the datasheet. This endurance rating assumes proper wear-leveling management by the host controller or FTL. Without ECC, endurance drops significantly; Winbond validates the 100K-cycle spec only under the defined ECC configuration.
What is the purpose of the DNU and N.C. balls in the W29N08GVBIAA VFBGA package?
In the W29N08GVBIAA's 63-ball VFBGA, DNU (Do Not Use) balls must remain unconnected and unpopulated on the PCB, as they are reserved for future use or test structures. N.C. (No Connect) balls have no internal connection and may be left floating or tied to ground/power per board design rules-but Winbond explicitly states they are not internally bonded and carry no electrical function in the W29N08GVBIAA.
Can the W29N08GVBIAA be used in automotive applications?
The W29N08GVBIAA is rated for industrial temperature range (–40°C to +85°C), which satisfies many under-hood and cabin automotive subsystems (e.g., telematics, infotainment displays). However, it is not AEC-Q100 qualified. For safety-critical or engine-control applications requiring automotive-grade qualification, designers must perform additional system-level validation and consider AEC-Q100 alternatives - the W29N08GVBIAA itself is not certified for those use cases.
W29N08GVBIAA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 63-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 8Gbit
- Memory Organization:
- 1G x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 40 MHz
- Write Cycle Time - Word, Page:
- 25ns
- Access Time:
- 25 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 63-VFBGA (9x11)
W29N08GVBIAA FAQ
1.How can I place an order for W29N08GVBIAA through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N08GVBIAA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N08GVBIAA reliable?
The price and inventory of W29N08GVBIAA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N08GVBIAA is usually 5 days.
3.What payment methods are accepted for W29N08GVBIAA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N08GVBIAA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N08GVBIAA?
W29N08GVBIAA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N08GVBIAA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N08GVBIAA?
For technical support, including W29N08GVBIAA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N08GVBIAA requirements.
6.How does Aetrix verify that W29N08GVBIAA is sourced from the original manufacturer or authorized distributors?
All W29N08GVBIAA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N08GVBIAA meets industry standards.
7.What is the process for return or replacement of W29N08GVBIAA?
All W29N08GVBIAA units undergo pre-shipment inspection (PSI). If there is an issue with W29N08GVBIAA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N08GVBIAA part is unused and in its original packaging.
Return procedure for W29N08GVBIAA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29N08GVBIAA Tags
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