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Winbond Electronics Corporation W29N08GVSIAA
- Part No.:
- W29N08GVSIAA
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
W29N08GVSIAA.pdf
- Description:
- IC FLASH 8GBIT PAR 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,184
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Product details
Overview
W29N08GVSIAA from Winbond is an 8G-bit (1GB) SLC NAND Flash memory IC designed for embedded storage in space-constrained systems. It operates on a single 2.7V–3.6V supply, delivers 25μA standby current, supports x8 multiplexed I/O interface, and organizes data into 8,192 blocks of 135,168 bytes each - ideal for firmware code shadowing and media data logging in industrial controllers.
For engineers reviewing the W29N08GVSIAA datasheet, W29N08GVSIAA pinout, W29N08GVSIAA application, or W29N08GVSIAA equivalent, key selection criteria include its TSOP1-48 package compatibility, ONFI-compliant command set (including Two-Plane Read/Program), 250μs typical page program time, and industrial-grade (-40°C to +85°C) temperature rating.
Technical Context
This device implements a standard NAND architecture with dedicated CLE/ALE control logic for command/address/data multiplexing over an 8-bit I/O bus. Its internal block diagram includes a high-voltage generator, cache register, and dual-plane operation capability enabling concurrent read/write across two independent memory planes.
It supports ONFI 2.3-compatible timing modes including Sequential Cache Read (25ns cycle), Random Data Output (25μs access), and Copy Back operations - all managed via status register polling (70h/78h) and open-drain RY/#BY signaling. The 2,112-byte page (2,048B main + 64B spare) enables robust ECC implementation with 1-bit/528-byte correction.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 8 G-bit (1,073,741,824 bytes usable); enables compact firmware storage without external expansion. |
| Supply Voltage | 2.7V–3.6V single rail; eliminates need for auxiliary voltage regulators in 3.3V system designs. |
| Page Size | 2,112 bytes (2,048B main + 64B spare); spare area reserved for ECC metadata and wear-leveling tags. |
| Block Size | 135,168 bytes (64 pages × 2,112B); defines minimum erasable unit for flash translation layer (FTL) management. |
| Endurance | 100,000 program/erase cycles (with 1-bit/528-byte ECC); supports long-life logging in industrial telemetry. |
| Data Retention | 10 years at 85°C; ensures firmware integrity across extended thermal stress in automotive/industrial deployments. |
| Random Read | 25 μs access time; meets real-time boot code fetch latency requirements in microcontroller-based systems. |
| Page Program | 250 μs typical; enables high-throughput firmware updates and field configuration writes. |
Pinout & Package
W29N08GVSIAA uses a 48-pin TSOP1 (12 mm × 20 mm) package with standard x8 NAND interface layout. All Vcc and Vss pins must be externally decoupled; DNU and N.C. pins are unconnected per design.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low global enable; places device in low-power standby (20μA) when high, required for multi-chip select decoding. |
| CLE | Command Latch Enable | Signals I/O bus content as command byte (e.g., 00h, 80h, 60h); latched on rising #WE edge. |
| ALE | Address Latch Enable | Signals I/O bus content as address byte; enables 5-cycle addressing for full 8G-bit address space. |
| #WE | Write Enable | Rising-edge clock for latching commands, addresses, and data; controls write strobe timing per ONFI spec. |
| #RE | Read Enable | Falling-edge triggered serial output enable; tREA = 25μs max delay before valid data appears on I/O[7:0]. |
| RY/#BY | Ready/Busy | Open-drain status indicator; low during active program/erase/read; requires external pull-up for host polling. |
| #WP | Write Protect | Active-low hardware lock; disables all program/erase when asserted, preventing accidental corruption. |
| I/O[0–7] | Bidirectional Data Bus | Multiplexed path for commands (1B), addresses (5B), and data (2112B/page); shared resource requiring precise timing control. |
Key Features
| Feature | Design Value |
|---|---|
| Two-Plane Operation | Enables concurrent read/write across independent memory planes, reducing effective latency by up to 50% in streaming applications. |
| Cache Read/Program | Overlaps data transfer with internal flash operations - sequential cache read achieves 25ns cycle time for burst throughput. |
| Copy Back Command | Permits page-to-page relocation within same die without host RAM buffering, simplifying wear-leveling and garbage collection. |
| ONFI 2.3 Compatibility | Ensures interoperability with standardized NAND controllers and FTL firmware stacks supporting parameter page (ECh) auto-negotiation. |
| Industrial Temperature Range | Rated for -40°C to +85°C operation, validated for use in programmable logic controllers and outdoor IoT gateways. |
Applications
| Industrial PLC Firmware Storage | Medical Device Log Buffer |
|---|---|
|
Use Scenario: Storing boot firmware and configuration parameters in DIN-rail mounted PLCs with no external storage interface. IC Role / Device Role / Timing Role: Primary nonvolatile code storage; accessed during cold boot and runtime firmware updates via SPI-to-NAND bridge controller. Use Value: 10-year data retention and 100K P/E cycles ensure reliable operation over 15+ year product lifecycle without field replacement. |
Use Scenario: Capturing timestamped sensor diagnostics and alarm history in portable ultrasound units with battery-backed operation. IC Role / Device Role / Timing Role: High-reliability circular buffer; leverages Two-Plane Read to sustain 2 MB/s continuous write during imaging sessions. Use Value: 25μs random read enables instant recall of last 100 fault events without interrupting real-time signal processing. |
| Automotive ADAS Event Recorder | Smart Meter Firmware Vault |
|
Use Scenario: Recording pre-crash CAN bus snapshots and camera metadata in Tier-1 black box modules operating under engine bay thermal stress. IC Role / Device Role / Timing Role: Shock-tolerant storage element; uses #WP pin hardwired to chassis ground to prevent corruption during power transients. Use Value: TSOP1-48 package withstands 50g mechanical shock; 85°C rating maintains integrity during sustained 125°C ambient exposure (derated). |
Use Scenario: Securing utility firmware updates and tariff tables in ANSI C12.22-compliant smart meters deployed in tropical climates. IC Role / Device Role / Timing Role: Tamper-resistant update partition; leverages OTP area (contact Winbond) for cryptographic key storage. Use Value: 2.7V min Vcc allows operation during brown-out conditions; 20μA standby draws <1% of meter's total quiescent power budget. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F8G08ABACAWP-AITX | 8G-bit MLC NAND; 3.3V; 48-pin TSOP1; slower endurance (3K P/E cycles); requires stronger ECC (4-bit/512B). | Lower cost per GB but unsuitable for firmware storage due to reduced reliability; better for high-volume media caching. | Select only if application tolerates shorter lifespan and can implement BCH-4 ECC; not drop-in compatible for SLC-critical firmware roles. |
| TC58NVG2S3ETA00 | 8G-bit SLC NAND; 3.3V; 48-pin TSOP1; identical page/block structure; supports ONFI 2.3 but lacks Two-Plane operation. | Same industrial temp range and endurance, but higher latency in sequential workloads due to missing cache acceleration. | Valid alternative where Two-Plane and Cache features are unused; pinout matches but timing margins differ slightly in high-speed modes. |
Compared with MT29F8G08ABACAWP-AITX and TC58NVG2S3ETA00, W29N08GVSIAA provides superior endurance and deterministic latency via Two-Plane/Cache support - critical for real-time embedded firmware execution, not just bulk storage.
Availability
W29N08GVSIAA is available at Aetrix Electronics and suitable for industrial PLCs, medical diagnostic loggers, automotive event recorders, and smart meter firmware vaults requiring stable component supply across 10+ year production lifecycles.
Supply support for W29N08GVSIAA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and TrustME® secure memory products.
W29N08GVSIAA belongs to Winbond's industrial-grade SLC NAND family, engineered for deterministic performance and long-term reliability in mission-critical embedded storage - not general-purpose data storage.
FAQ
What is the operating temperature range specified for W29N08GVSIAA?
W29N08GVSIAA is rated for industrial temperature operation from -40°C to +85°C. This specification is validated per JEDEC JESD22-A104 and applies to all electrical characteristics in the datasheet, including program/erase timing and data retention. The TSOP1-48 package construction supports this range without derating.
Does W29N08GVSIAA support ONFI-compliant initialization and parameter exchange?
Yes, W29N08GVSIAA implements ONFI 2.3 specifications, including Read Parameter Page (ECh command) to auto-negotiate timing modes, vendor-specific feature sets, and geometry information. Host controllers can use this to configure optimal tRC, tREA, and tPROG values without hardcoded assumptions.
How many I/O pins does W29N08GVSIAA use for command, address, and data transfer?
W29N08GVSIAA uses eight bidirectional I/O pins (I/O[0–7]) for multiplexed command, address, and data transfer. Commands are latched via CLE, addresses via ALE, and data transferred serially - all synchronized to #WE and #RE edges per standard NAND protocol.
What is the purpose of the DNU pins on the W29N08GVSIAA TSOP1 package?
DNU (Do Not Use) pins on W29N08GVSIAA - such as pins 1, 4, 5, 7, 11, 15, 16, 25, 27, 28, 31, 32, 35, 36, 39, 40, 43, 44, 45, and 48 in the 48-pin TSOP1 layout - must remain unconnected. They are reserved for future ONFI compatibility and have no internal connection or function in W29N08GVSIAA.
Can W29N08GVSIAA perform simultaneous read and write operations?
Yes, W29N08GVSIAA supports Two-Plane operation, allowing concurrent read from one plane while programming or erasing another. This is implemented via dedicated internal plane addressing (bit A28) and requires explicit command sequencing (00h-00h-30h for read, 80h-10h for program), not automatic arbitration.
W29N08GVSIAA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 8Gbit
- Memory Organization:
- 1G x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns, 700µs
- Access Time:
- 25 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
W29N08GVSIAA FAQ
1.How can I place an order for W29N08GVSIAA through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N08GVSIAA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N08GVSIAA reliable?
The price and inventory of W29N08GVSIAA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N08GVSIAA is usually 5 days.
3.What payment methods are accepted for W29N08GVSIAA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N08GVSIAA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N08GVSIAA?
W29N08GVSIAA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N08GVSIAA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N08GVSIAA?
For technical support, including W29N08GVSIAA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N08GVSIAA requirements.
6.How does Aetrix verify that W29N08GVSIAA is sourced from the original manufacturer or authorized distributors?
All W29N08GVSIAA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N08GVSIAA meets industry standards.
7.What is the process for return or replacement of W29N08GVSIAA?
All W29N08GVSIAA units undergo pre-shipment inspection (PSI). If there is an issue with W29N08GVSIAA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N08GVSIAA part is unused and in its original packaging.
Return procedure for W29N08GVSIAA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29N08GVSIAA Tags
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