Winbond Electronics Corporation W29N08GWBIBA TR

Overview

W29N08GWBIBA from Winbond is an 8G-bit (1GB) single-supply 1.8V SLC NAND Flash memory in 63-ball VFBGA package, organized as 8,192 blocks × 64 pages × 2,112 bytes/page (2,048B main + 64B spare), supporting x8/x16 bus width, two-plane operations, and Copy Back for embedded storage in space-constrained industrial systems.

For engineers reviewing the W29N08GWBIBA datasheet, W29N08GWBIBA pinout, W29N08GWBIBA application, or W29N08GWBIBA equivalent, this page delivers verified electrical specs (13mA active current, 25μs random read), timing parameters (35ns sequential read cycle), endurance (100,000 P/E cycles), package mapping (VFBGA B-code), and functional alternatives aligned to ONFI-compliant NAND interface requirements.

Technical Context

The W29N08GWBIBA implements a standard ONFI-compatible NAND interface with multiplexed I/O[0–7], five dedicated control signals (#CE, #RE, #WE, CLE, ALE), and status signaling via open-drain RY/#BY. It uses Single-Level Cell (SLC) technology with internal high-voltage generation for program/erase.

Its architecture supports concurrent two-plane operations (read, program, erase) and Copy Back-enabling page-to-page data relocation without host RAM buffering. The device includes OTP area and Block Lock features (contact Winbond), and requires external ECC (1-bit/528-byte) to meet 100,000-cycle endurance and 10-year data retention.

Key Specifications

Pinout & Package

W29N08GWBIBA is packaged in a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) with 0.5mm pitch, footprint 9mm × 11mm, compliant with JEDEC MO-276AA. Pin assignments support both x8 and x16 configurations; this variant (B-code) uses x8 bus width.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND Flash memory applications.

Compared with MT29F8G08ABABA and TC58NVG2S3ETA00, W29N08GWBIBA uniquely combines VFBGA miniaturization, two-plane concurrency, and Copy Back-making it optimal for next-gen embedded systems requiring high-density, low-latency, and host-offloaded NAND management.

Availability

W29N08GWBIBA is available at Aetrix Electronics and suitable for industrial HMIs, medical data loggers, and automotive infotainment systems requiring stable component supply, long-life qualification, and guaranteed traceable sourcing.

Supply support for W29N08GWBIBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.

The W29N08GWBIBA belongs to Winbond's W29N series of SLC NAND Flash memories, designed specifically for embedded systems demanding high reliability, low power, and ONFI-standard compatibility in space-constrained applications.

FAQ

What is the operating temperature range for W29N08GWBIBA?

W29N08GWBIBA is rated for industrial temperature operation from -40°C to +85°C. This range is validated per datasheet Section 2 and Table 10-2, making W29N08GWBIBA suitable for deployment in harsh environments such as factory automation controllers and outdoor telematics units without derating.

Does W29N08GWBIBA support x16 bus width?

No-W29N08GWBIBA is the x8 variant in Winbond's 63-ball VFBGA (B-code) package. While the same package family supports x16 (see Figure 3-3), W29N08GWBIBA specifically implements only the x8 configuration with I/O[0–7] active; I/O[8–15] are not bonded or functional in this part number.

What ECC requirement applies to W29N08GWBIBA?

W29N08GWBIBA requires external 1-bit-per-528-byte ECC correction to achieve its rated 100,000 program/erase cycles and 10-year data retention. The 64-byte spare area per page is allocated for storing ECC syndromes and metadata-no on-die ECC engine is present in W29N08GWBIBA.

Is W29N08GWBIBA pin-compatible with other Winbond NAND parts in the same package?

W29N08GWBIBA shares identical 63-ball VFBGA (B-code) mechanical footprint and pinout with other Winbond W29N-series parts in the same package variant, including W29N04GVBIA and W29N02GVBIA. Signal mapping (e.g., #CE, RY/#BY, I/O[0–7]) is consistent across these parts per Figures 3-2 and 3-3.

What does the 'BI' in W29N08GWBIBA indicate?

The 'BI' in W29N08GWBIBA denotes the industrial temperature grade (-40°C to +85°C) and 63-ball VFBGA package (B-code). Per Winbond's ordering guide (Table 15-1), 'BI' maps to Industrial temp and VFBGA; 'BA' suffix confirms tape-and-reel packaging-fully documented in Section 14 and Table 14-1 of the datasheet.