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Winbond Electronics Corporation W29N08GZBIBA

Part No.:
W29N08GZBIBA
Manufacturer:
Winbond Electronics Corporation
Category:
Memory
Package:
63-VFBGA
Datasheet:
AetrixW29N08GZBIBA.pdf
Description:
IC FLASH 8GBIT PAR 63VFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,299

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Product details

Overview

W29N08GZBIBA from Winbond is an 8G-bit (1GB) single-supply 1.8V SLC NAND Flash memory in 63-ball VFBGA package, organized as 8,192 erasable blocks of 135,168 bytes each, with 64 pages per block and 2,112-byte pages (2048+64 byte spare). It supports x8/x16 bus width, two-plane operations, Copy Back, and ONFI-compatible command set for embedded storage in space-constrained systems.

For engineers reviewing the W29N08GZBIBA datasheet, W29N08GZBIBA pinout, W29N08GZBIBA application, or W29N08GZBIBA equivalent, key selection criteria include 1.8V operation, 25μs random read latency, 250μs typical page program time, 2ms block erase time, 100,000 P/E cycles with 1-bit/528-byte ECC, and industrial temperature support (–40°C to +85°C).

Technical Context

This device implements a standard NAND interface with multiplexed I/O bus and five dedicated control signals (CLE, ALE, #CE, #RE, #WE) for command/address/data latching. Its internal architecture includes dual-plane memory array, cache register, data register, and high-voltage generator enabling concurrent operations across planes.

It executes ONFI-standard commands including PAGE READ (00h-30h), TWO PLANE READ (00h-00h-30h), RANDOM DATA OUTPUT (05h-E0h), PAGE PROGRAM (80h-10h), TWO PLANE PROGRAM, BLOCK ERASE (60h-D0h), and enhanced status reporting (78h), all compliant with 1.8V timing specifications.

Key Specifications

Parameter Value and Actual Design Meaning
Density 8G-bit (1,073,741,824 bytes) total capacity, realized via chip-stacked die configuration
Supply Voltage 1.7V–1.95V operation; enables low-power design in battery-backed or energy-sensitive embedded systems
Page Size 2,112 bytes (2048 main + 64 spare); spare area reserved for ECC metadata and bad-block management
Block Size 135,168 bytes (64 × 2,112-byte pages); defines minimum erasable unit for wear leveling and firmware updates
Random Read Time 25μs max; determines latency for small-data access in boot code or configuration retrieval
Page Program Time 250μs typical; impacts firmware update speed and logging throughput in real-time applications
Endurance 100,000 program/erase cycles with 1-bit/528-byte ECC; specifies usable lifetime under sustained write workloads
Data Retention 10 years at 25°C; guarantees nonvolatile storage integrity without refresh in offline or archival use cases

Pinout & Package

W29N08GZBIBA uses a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) package (package code B), footprint compatible with JEDEC MO-276AA, dimensions 9.0 mm × 11.0 mm × 1.0 mm (max), suitable for high-density PCB layouts.

Pin/Terminal Circuit Role Design Meaning
#CE Chip Enable Active-low global enable; places device in standby (20μA) when high, required for multi-chip select arbitration
#RE Read Enable Controls serial output timing; valid data appears after tREA (25ns) from falling edge, increments column address
#WE Write Enable Latches commands, addresses, and data on rising edge; synchronizes all input transfers to NAND protocol
ALE Address Latch Enable Signals that I/O bus carries row/column address; enables address register capture during #WE rise
CLE Command Latch Enable Signals that I/O bus carries command byte (e.g., 00h, 80h, 60h); enables command register capture during #WE rise
RY/#BY Ready/Busy Output Open-drain status indicator; low = active operation (read/program/erase), high = ready for next command
#WP Write Protect Hardware lock; low disables all program/erase commands, preventing accidental corruption during power transitions
I/O[0–7] Bidirectional Data Bus Multiplexed path for commands (8-bit), addresses (5-cycle), and data (2112-byte pages); supports x8 mode only in this variant
Vcc / Vss Power / Ground Four Vcc and four Vss balls ensure stable 1.8V supply delivery and noise immunity in high-speed switching

Key Features

Feature Design Value
Two-plane operation Enables concurrent read/program between even- and odd-numbered block planes, doubling effective bandwidth for sequential access
Copy Back command Permits page-to-page relocation within same die without external buffering, reducing host RAM overhead in garbage collection
ONFI-compliant interface Ensures interoperability with standard NAND controllers and avoids proprietary driver development in Linux/Yocto BSPs
1.8V-only operation Eliminates need for dual-voltage regulators; simplifies power design and reduces BOM cost in portable and IoT edge devices
Industrial temperature range Rated –40°C to +85°C; validated for deployment in automotive infotainment, industrial HMIs, and outdoor telemetry units

Applications

Embedded Boot Storage Industrial Data Logging

Use Scenario: Storing bootloader, kernel image, and root filesystem for ARM Cortex-A/MIPS-based industrial gateways.

IC Role / Device Role / Timing Role: Nonvolatile code storage with fast random read (25μs) to accelerate boot sequence and reduce system startup time.

Use Value: Enables sub-500ms cold boot by supporting direct XIP-like access patterns via NAND controller's cache register and two-plane burst reads.

Use Scenario: Capturing sensor readings (temperature, vibration, pressure) at 100Hz in factory-floor PLCs with local retention.

IC Role / Device Role / Timing Role: High-endurance write buffer; leverages 100,000 P/E cycles and 250μs page program to sustain continuous logging without premature wear-out.

Use Value: Eliminates need for external wear-leveling controller; built-in block management and Copy Back simplify firmware implementation.

Medical Device Firmware Smart Meter Firmware & Logs

Use Scenario: Holding certified firmware images and calibration data in Class II medical instruments requiring traceable, tamper-resistant storage.

IC Role / Device Role / Timing Role: Secure, long-retention (10-year) storage with hardware #WP pin to prevent runtime corruption during power faults or ESD events.

Use Value: Meets IEC 62304 software lifecycle requirements by enabling field-upgradable binaries with guaranteed data integrity over product lifetime.

Use Scenario: Storing tariff tables, consumption history, and firmware patches in ANSI C12.22-compliant smart electricity meters operating in uncontrolled environments.

IC Role / Device Role / Timing Role: Temperature-hardened (–40°C to +85°C) nonvolatile memory supporting frequent partial writes and secure erase of sensitive usage records.

Use Value: Delivers deterministic 2ms block erase and ECC-managed reliability without requiring meter MCU to manage bad-block remapping.

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND flash memory applications.

Alternative Part Technical Difference Application Difference Selection Advice
MT29F8G08ABABH4-IT 8G-bit, 3.3V operation; different voltage domain, no 1.8V compatibility; uses 48-pin TSOP1 package Requires level-shifting circuitry and separate 3.3V rail; unsuitable for 1.8V-only designs or space-constrained layouts Select only if existing board already supports 3.3V NAND and TSOP1 footprint; not drop-in for W29N08GZBIBA
TC58NVG2S3HTAI0 8G-bit, 1.8V, x8 interface; Toshiba (Kioxia) part with identical VFBGA-63 package and ONFI 2.3 compliance Same pinout and command set; differs in timing parameters (e.g., 30μs random read vs. 25μs) and ECC requirements (4-bit BCH) Valid alternative where layout reuse is critical; verify timing margins and ECC engine compatibility before substitution

Compared with MT29F8G08ABABH4-IT, W29N08GZBIBA eliminates voltage translation complexity; compared with TC58NVG2S3HTAI0, it offers faster random read and simpler ECC (1-bit/528-byte), easing integration in resource-limited microcontrollers.

Availability

W29N08GZBIBA is available at Aetrix Electronics and suitable for embedded boot storage, industrial data logging, medical device firmware, and smart meter applications requiring stable component supply, long-term lifecycle support, and industrial-grade reliability.

Supply support for W29N08GZBIBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and TrustME® secure memory products.

W29N08GZBIBA belongs to Winbond's W29N08GW/Z series of SLC NAND Flash devices, designed specifically for high-reliability embedded applications demanding low-voltage operation, extended temperature tolerance, and standardized ONFI interoperability.

FAQ

What is the operating voltage range for W29N08GZBIBA?

W29N08GZBIBA operates strictly within 1.7V to 1.95V. It is not 3.3V-tolerant and requires a dedicated 1.8V power rail. Operation outside this range may cause data corruption or permanent damage. The device draws 13mA typical during active read/write and only 20μA in CMOS standby mode, making it suitable for low-power embedded systems.

Does W29N08GZBIBA support x16 bus width?

No, W29N08GZBIBA (package code B, suffix 'BI') is configured for x8 operation only. Although the datasheet references x16 pin assignments for the same VFBGA package, this specific part number is specified and tested exclusively for 8-bit data interface. Attempting x16 mode will result in undefined behavior and is not supported.

What is the meaning of 'Z' in W29N08GZBIBA?

The 'Z' in W29N08GZBIBA denotes the device's feature set and revision level per Winbond's ordering nomenclature - specifically indicating support for ONFI 2.3 commands, two-plane operation, Copy Back, and industrial temperature grade (–40°C to +85°C). It distinguishes this variant from earlier 'W' or 'X' versions with differing command subsets or qualification levels.

How many valid blocks does W29N08GZBIBA guarantee?

W29N08GZBIBA guarantees a minimum of 7,936 valid blocks (out of 8,192 total) at shipment, with up to 256 initial invalid blocks pre-mapped per datasheet Table 12-1. Bad block management is handled transparently via the spare area and standard ONFI parameter page; no host-side remapping logic is required for basic operation.

Is W29N08GZBIBA pin-compatible with other Winbond NAND parts in VFBGA-63?

W29N08GZBIBA shares the same 63-ball VFBGA mechanical footprint and pinout as other Winbond W29N08GW/Z variants in package code B, including identical signal placement for #CE, #RE, #WE, CLE, ALE, RY/#BY, #WP, I/O[0–7], Vcc, and Vss. However, functional compatibility depends on command set support and timing - always validate against the target controller's NAND driver stack.

W29N08GZBIBA Specifications

Product attributes
Attribute value
Manufacturer:
Winbond Electronics Corporation
Series:
-
Package/Case:
63-VFBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NAND (SLC)
Memory Size:
8Gbit
Memory Organization:
1G x 8
Memory Interface:
ONFI
Clock Frequency:
-
Write Cycle Time - Word, Page:
35ns, 700µs
Access Time:
25 ns
Voltage - Supply:
1.7V ~ 1.95V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
63-VFBGA (9x11)

W29N08GZBIBA FAQ

1.How can I place an order for W29N08GZBIBA through Aetrix?

Please submit a Request for Quotation (RFQ) for W29N08GZBIBA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for W29N08GZBIBA reliable?

The price and inventory of W29N08GZBIBA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N08GZBIBA is usually 5 days.

3.What payment methods are accepted for W29N08GZBIBA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N08GZBIBA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for W29N08GZBIBA?

W29N08GZBIBA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your W29N08GZBIBA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for W29N08GZBIBA?

For technical support, including W29N08GZBIBA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N08GZBIBA requirements.

6.How does Aetrix verify that W29N08GZBIBA is sourced from the original manufacturer or authorized distributors?

All W29N08GZBIBA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N08GZBIBA meets industry standards.

7.What is the process for return or replacement of W29N08GZBIBA?

All W29N08GZBIBA units undergo pre-shipment inspection (PSI). If there is an issue with W29N08GZBIBA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The W29N08GZBIBA part is unused and in its original packaging.

Return procedure for W29N08GZBIBA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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