Winbond Electronics Corporation W29N08GZBIBA TR

Overview

W29N08GZBIBA TR from Winbond is an 8G-bit (1GB) single-supply 1.8V SLC NAND Flash memory in 63-ball VFBGA package, organized as 8,192 blocks × 64 pages × 2,112 bytes/page (2,048B main + 64B spare), supporting x8/x16 bus width, two-plane operations, and Copy Back for embedded storage in space-constrained industrial systems.

For engineers reviewing the W29N08GZBIBA TR datasheet, W29N08GZBIBA TR pinout, W29N08GZBIBA TR application, or W29N08GZBIBA TR equivalent, key selection considerations include its 1.7–1.95V operating range, 25μs random read latency, 250μs typical page program time, 2ms block erase time, and ONFI-compatible command set with OTP and Block Lock support.

Technical Context

This device implements a standard NAND interface with multiplexed I/O bus and five dedicated control signals (CLE, ALE, #CE, #RE, #WE) to manage command, address, and data latching. Its internal architecture includes dual-plane flash array, cache register, and high-voltage generator enabling concurrent operations across planes.

It supports ONFI 2.3-compliant timing and commands including Two-Plane Read/Program/Erase, Copy Back, Read Parameter Page (ECh), and Read Unique ID (EDh). The RY/#BY open-drain status pin and #WP write-protect input provide real-time operation monitoring and hardware-level data integrity control.

Key Specifications

Pinout & Package

W29N08GZBIBA TR uses a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) package (package code B), footprint-optimized for high-density PCB layouts in portable and industrial modules. Pin pitch is 0.5 mm; body size is 9 mm × 11 mm × 1.0 mm max.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND Flash memory applications.

Compared with MT29F8G08ABACAWP-AIT:D and TC58NVG2S3ETA00, W29N08GZBIBA TR delivers superior integration for 1.8V embedded systems via native voltage operation, two-plane concurrency, Copy Back efficiency, and dedicated #WP protection - all in a space-saving VFBGA.

Availability

W29N08GZBIBA TR is available at Aetrix Electronics and suitable for industrial HMIs, medical diagnostics, automotive telematics, and smart metering requiring stable component supply across extended temperature ranges (-40°C to 105°C).

Supply support for W29N08GZBIBA TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.

W29N08GZBIBA TR belongs to Winbond's W29N08GW/Z series of SLC NAND Flash devices designed specifically for high-reliability, low-voltage embedded storage where endurance, data retention, and small-footprint packaging are critical.

FAQ

What is the operating temperature range for W29N08GZBIBA TR?

W29N08GZBIBA TR is rated for Industrial Plus temperature range: -40°C to +105°C. This specification is validated per JEDEC standards and applies across full voltage (1.7–1.95V) and timing margins. The device maintains 100,000 P/E cycles and 10-year data retention within this range, making it suitable for under-hood automotive or sealed industrial enclosures without active cooling. W29N08GZBIBA TR does not require derating at maximum temperature.

Does W29N08GZBIBA TR support ONFI compliance?

Yes, W29N08GZBIBA TR implements ONFI 2.3 timing and command protocols, including Read Parameter Page (ECh), Get Features (EEh), and Set Features (EFh). It supports standard ONFI addressing, timing modes (including EDO), and status reporting. This ensures interoperability with ONFI-compliant controllers and simplifies migration from other ONFI NAND devices. W29N08GZBIBA TR does not require custom initialization sequences beyond ONFI specification.

What is the meaning of "Z" in the part number W29N08GZBIBA TR?

The "Z" in W29N08GZBIBA TR denotes the 8G-bit density variant within Winbond's W29N08GW/Z family. It distinguishes this part from lower-density members (e.g., W29N04GZxxBA for 4G-bit) and confirms identical architecture, command set, and timing behavior. The "Z" is not a revision or temperature code - it is a fixed density identifier used across all package variants (TSOP1/VFBGA) and temperature grades of this family. W29N08GZBIBA TR shares full functional equivalence with other Z-suffixed parts except for capacity.

How does the two-plane operation work in W29N08GZBIBA TR?

W29N08GZBIBA TR divides its 8,192-block array into two independent planes (even- and odd-numbered blocks), allowing simultaneous operations - e.g., reading from one plane while programming to the other. Commands like Two-Plane Read (00h-00h-30h) and Two-Plane Page Program use dedicated address bits (A18) to select plane context. This concurrency reduces effective latency by up to 40% in streaming applications. W29N08GZBIBA TR requires no additional pins or configuration registers to enable two-plane mode.

Is the #WP pin on W29N08GZBIBA TR internally pulled up or does it require external biasing?

The #WP pin on W29N08GZBIBA TR has no internal pull-up; it must be externally biased to Vcc (via ≥10 kΩ resistor) to ensure normal program/erase operation. When driven low (≤0.4V), #WP disables all write/erase functions regardless of command sequence - including RESET and status reads. This hardware lock is active even during power transitions and provides fail-safe protection against voltage glitch-induced corruption. W29N08GZBIBA TR will not accept any program/erase command while #WP is asserted.