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Winbond Electronics Corporation W29N08GZSIBA
- Part No.:
- W29N08GZSIBA
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
W29N08GZSIBA.pdf
- Description:
- IC FLASH 8GBIT PAR 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:3,130
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Product details
Overview
W29N08GZSIBA from Winbond is an 8G-bit (1GB) single-supply 1.8V SLC NAND Flash memory in stacked-die configuration, organized as 8,192 erasable blocks of 135,168 bytes each, with 64 pages per block and 2,112-byte pages (2,048B main + 64B spare). It supports x8/x16 bus width, ONFI-compatible command set including Copy Back and Two-Plane operations, and targets embedded code shadowing, media storage, and solid-state applications.
For engineers reviewing the W29N08GZSIBA datasheet, W29N08GZSIBA pinout, W29N08GZSIBA application, or W29N08GZSIBA equivalent, key selection criteria include its 1.7–1.95V Vcc range, 25μs random read latency, 250μs typical page program time, 100,000 P/E cycles with 1-bit/528-byte ECC, and support for industrial temperature (−40°C to +85°C) operation in TSOP1 or VFBGA packages.
Technical Context
This device implements a standard NAND interface with multiplexed I/O bus and five dedicated control signals (CLE, ALE, #CE, #RE, #WE) for command/address/data separation. Its internal architecture includes dual-plane operation capability, a cache register for accelerated sequential access, and hardware-based Ready/Busy signaling via open-drain RY/#BY.
It supports ONFI 2.3–compatible commands including GET/SET FEATURES (EFh/EEh), READ PARAMETER PAGE (ECh), and READ UNIQUE ID (EDh), with programmable features at address 80h (e.g., timing modes) and 81h (e.g., protection settings). Block lock and OTP functions are available but require Winbond coordination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 8G-bit (1,073,741,824 bytes) in stacked-die configuration; enables compact high-capacity storage without external parallel bus expansion. |
| Vcc Range | 1.7V to 1.95V; compatible with low-voltage SoC I/O domains and reduces power supply complexity in battery-powered or space-constrained designs. |
| Page Size | 2,112 bytes (2,048B main + 64B spare); spare area reserved for ECC metadata, wear-leveling tags, and bad-block management. |
| Block Size | 135,168 bytes (64 × 2,112-byte pages); defines minimum erase granularity and influences firmware-level block management overhead. |
| Random Read | 25 μs max; determines latency for small, non-sequential accesses such as boot code fetch or metadata lookup. |
| Page Program | 250 μs typical; impacts write throughput in logging, firmware update, or file-system journaling use cases. |
| Endurance | 100,000 program/erase cycles (with 1-bit/528-byte ECC); defines usable lifetime under sustained write workloads in industrial logging or telemetry. |
| Data Retention | 10 years at 25°C; ensures long-term reliability for archival storage or infrequently updated configuration data. |
Pinout & Package
W29N08GZSIBA is available in two package variants: 48-pin TSOP1 (12×20 mm, package code S) and 63-ball VFBGA (package code B). Both support x8 and x16 configurations; pin assignments differ between bus widths and packages, with shared core control signals and multiplexed I/O.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low chip select; places device in standby (20 μA) when high, enabling multi-chip addressing and power gating. |
| #WE | Write Enable | Rising-edge latch control for commands, addresses, and data; synchronizes all input transfers to NAND protocol timing windows. |
| #RE | Read Enable | Controls serial output from data register; each pulse increments column address for burst reads and defines tREA timing window. |
| ALE | Address Latch Enable | Signals that I/O bus carries row/column address data; latched on rising #WE edge to route to internal address register. |
| CLE | Command Latch Enable | Signals that I/O bus carries command codes (e.g., 00h, 30h, 80h); latched on rising #WE edge to load command register. |
| RY/#BY | Ready/Busy Output | Open-drain status indicator; low during active program/erase/read operations, used for polling or interrupt-driven flow control. |
| #WP | Write Protect Input | Hardware lock: drives low to disable all program/erase commands, preventing accidental corruption during power transitions or debug. |
| I/O[0–7] / I/O[0–15] | Multiplexed Data Bus | Bi-directional bus for command, address, and data transfer; x8 mode uses I/O[0–7], x16 mode adds I/O[8–15] in VFBGA variant. |
Key Features
| Feature | Design Value |
|---|---|
| Two-Plane Operation | Enables concurrent read/program operations across even/odd block planes, doubling effective bandwidth for sequential streaming or background copy. |
| Copy Back Command | Permits page-to-page relocation within same die without external buffering-reduces host RAM usage and accelerates garbage collection in FTL implementations. |
| ONFI-Compatible Interface | Supports standardized timing, command set, and parameter page (ECh) for interoperability with ONFI-aware controllers and simplified driver development. |
| Hardware Write Protect | Dedicated #WP pin provides fail-safe, voltage-level-based inhibition of program/erase - critical for bootloader partitions and factory calibration data. |
| Dual-Bus Width Support | Single part number supports both x8 and x16 configurations via package-specific pin mapping, reducing BOM count across product variants. |
Applications
| Industrial HMI Storage | Embedded Boot Media |
|---|---|
|
Use Scenario: Storing firmware images, GUI assets, and configuration databases in panel-mounted HMIs operating in −40°C to +85°C environments. IC Role / Device Role / Timing Role: Non-volatile code and data storage with direct XIP-capable read access and deterministic 25μs random read latency. Use Value: Eliminates need for external NOR flash or SRAM shadowing; leverages 100K-cycle endurance for field-upgradable firmware. |
Use Scenario: Hosting boot code and kernel initramfs for ARM Cortex-A/M series SoCs in medical diagnostics and test equipment. IC Role / Device Role / Timing Role: Primary boot medium interfaced via NAND controller IP; supports ONFI parameter page auto-negotiation for timing setup. Use Value: Reduces BOM cost vs. eMMC while maintaining 10-year data retention for safety-critical calibration tables. |
| Telematics Data Logger | Smart Meter Firmware Archive |
|
Use Scenario: Capturing GPS traces, CAN bus logs, and sensor snapshots in automotive telematics units with limited PCB area. IC Role / Device Role / Timing Role: High-density sequential write buffer using Two-Plane programming to sustain >2 MB/s logging throughput. Use Value: Achieves 8GB capacity in 63-ball VFBGA (8.5×7.5 mm), enabling compact module design without SD card slot or connector. |
Use Scenario: Archiving firmware revisions, tariff tables, and tamper logs in ANSI C12.22-compliant smart electricity meters deployed for 15+ years. IC Role / Device Role / Timing Role: Long-life firmware archive with hardware #WP protection against unauthorized updates during field servicing. Use Value: Guarantees 10-year data retention at 85°C ambient and withstands 100K P/E cycles required for daily meter firmware patching. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F8G08ABABH4-IT | 8G-bit, 3.3V, x8 only, 48-TSOP; no Two-Plane or Copy Back; ONFI 2.1 | Requires level-shifting for 1.8V hosts; lacks concurrent plane ops for high-throughput logging | Select when legacy 3.3V controller compatibility is mandatory and bandwidth demands are ≤10 MB/s |
| TC58NVG2S3HTAI0 | 8G-bit, 1.8V, x8/x16, 63-VFBGA; Toshiba toggle-mode DDR interface; 20μs random read | Uses toggle DDR timing instead of asynchronous NAND; requires different controller timing setup | Choose for higher random read performance and DDR bandwidth, if controller supports toggle-mode protocol |
Compared with MT29F8G08ABABH4-IT and TC58NVG2S3HTAI0, W29N08GZSIBA offers native 1.8V asynchronous operation with Two-Plane and Copy Back support-making it optimal for cost-sensitive, space-constrained industrial controllers where firmware flexibility and moderate throughput are prioritized over peak DDR speed.
Availability
W29N08GZSIBA is available at Aetrix Electronics and suitable for industrial HMI storage, embedded boot media, telematics data logging, smart meter firmware archiving, and medical device configuration storage requiring stable component supply across extended temperature ranges and multi-year production cycles.
Supply support for W29N08GZSIBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and mobile DRAM, serving industrial, automotive, and consumer markets since 1987.
W29N08GZSIBA belongs to Winbond's W29N series of SLC NAND Flash devices designed specifically for reliable, long-lifecycle embedded storage in space- and power-constrained systems requiring industrial-grade temperature operation and robust ECC-ready architecture.
FAQ
What is the operating voltage range for W29N08GZSIBA?
W29N08GZSIBA operates from 1.7V to 1.95V, optimized for 1.8V nominal systems. This narrow Vcc range reduces power supply filtering requirements and simplifies integration with low-voltage SoCs and PMICs commonly used in portable and industrial embedded designs. The device draws only 13mA during active read or program operations and drops to 20μA in CMOS standby mode.
Does W29N08GZSIBA support both x8 and x16 bus widths?
Yes, W29N08GZSIBA supports both x8 and x16 configurations, implemented via distinct pin mappings in the 63-ball VFBGA package. In x8 mode, I/O[0–7] are used; in x16 mode, I/O[0–15] are active. The 48-pin TSOP1 variant supports x8 only. Bus width selection is determined by package type and board layout-not by software configuration.
What NAND commands does W29N08GZSIBA support beyond the standard set?
W29N08GZSIBA supports extended ONFI 2.3–compatible commands including COPY BACK (35h/85h/10h), TWO PLANE READ (00h-00h-30h), TWO PLANE PROGRAM, GET FEATURES (EEh), and SET FEATURES (EFh). These enable advanced FTL functions like background garbage collection and configurable timing modes-without requiring host-side buffering or complex software emulation.
How is endurance specified for W29N08GZSIBA, and what ECC is required?
W29N08GZSIBA guarantees 100,000 program/erase cycles when used with 1-bit-per-528-byte ECC correction. This specification assumes proper wear-leveling firmware and adherence to recommended block management practices. The spare area of each 2,112-byte page (64 bytes) is intended for storing ECC syndromes, logical-to-physical mapping, and bad-block flags.
What package options are available for W29N08GZSIBA, and how do they differ in pinout?
W29N08GZSIBA is offered in 48-pin TSOP1 (12×20 mm, package code S) and 63-ball VFBGA (package code B). The TSOP1 supports x8 only; the VFBGA supports both x8 and x16 via different ball assignments. Pin functions (e.g., CLE, ALE, #CE) are identical across packages, but I/O pin counts and locations vary-requiring separate PCB layouts for each variant.
W29N08GZSIBA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 8Gbit
- Memory Organization:
- 1G x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 40 MHz
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
W29N08GZSIBA FAQ
1.How can I place an order for W29N08GZSIBA through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N08GZSIBA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N08GZSIBA reliable?
The price and inventory of W29N08GZSIBA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N08GZSIBA is usually 5 days.
3.What payment methods are accepted for W29N08GZSIBA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N08GZSIBA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N08GZSIBA?
W29N08GZSIBA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N08GZSIBA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N08GZSIBA?
For technical support, including W29N08GZSIBA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N08GZSIBA requirements.
6.How does Aetrix verify that W29N08GZSIBA is sourced from the original manufacturer or authorized distributors?
All W29N08GZSIBA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N08GZSIBA meets industry standards.
7.What is the process for return or replacement of W29N08GZSIBA?
All W29N08GZSIBA units undergo pre-shipment inspection (PSI). If there is an issue with W29N08GZSIBA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N08GZSIBA part is unused and in its original packaging.
Return procedure for W29N08GZSIBA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29N08GZSIBA Tags
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