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Winbond Electronics Corporation W29N08GZSIBF
- Part No.:
- W29N08GZSIBF
- Manufacturer:
- Winbond Electronics Corporation
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
W29N08GZSIBF.pdf
- Description:
- IC FLASH 8GBIT PAR 48TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,692
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Product details
Overview
W29N08GZSIBF from Winbond is an 8G-bit (1GB) single-supply 1.8V SLC NAND Flash memory in 63-ball VFBGA package, supporting x8/x16 bus width, two-plane operations, and Copy Back command. It delivers 25μs random read access, 250μs typical page program time, and 100,000 program/erase cycles for embedded storage in space-constrained industrial systems.
For engineers reviewing the W29N08GZSIBF datasheet, W29N08GZSIBF pinout, W29N08GZSIBF application, or W29N08GZSIBF equivalent, key selection considerations include its 1.7–1.95V operating range, ONFI-compatible interface with CLE/ALE control, RY/#BY status signaling, and support for OTP and block lock features in industrial-plus temperature grade.
Technical Context
This device implements a standard NAND Flash architecture with multiplexed I/O bus, separate Command Latch Enable (CLE) and Address Latch Enable (ALE) signals, and open-drain Ready/Busy (RY/#BY) output. Its two-plane operation enables concurrent read/write across even- and odd-numbered block groups, improving throughput without external buffering.
The W29N08GZSIBF uses Single-Level Cell (SLC) technology organized into 8,192 erasable blocks (64 pages × 135,168 bytes each), with 2,048-byte main data + 64-byte spare area per page. It supports ONFI 2.3–compatible commands including GET/SET FEATURES (EEh/EFh), READ PARAMETER PAGE (ECh), and READ UNIQUE ID (EDh).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 8 G-bit (1,073,741,824 bytes) usable capacity with SLC reliability |
| Supply Voltage | 1.7 V to 1.95 V - enables direct integration with 1.8V logic domains without level shifting |
| Page Size | 2,112 bytes (2,048 main + 64 spare) - accommodates 4-bit/528-byte ECC for robust error correction |
| Block Size | 135,168 bytes (64 pages × 2,112 bytes) - defines minimum erase granularity and wear-leveling unit |
| Random Read Time | 25 μs - determines latency for firmware code fetch or small metadata access |
| Page Program Time | 250 μs (typ.) - sets write throughput ceiling for logging or configuration updates |
| Endurance | 100,000 P/E cycles - specifies lifetime under frequent update workloads with ECC support |
| Data Retention | 10 years at 85°C - guarantees nonvolatile storage integrity in extended industrial deployments |
Pinout & Package
W29N08GZSIBF is packaged in a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA), footprint code B, measuring 9 mm × 11 mm × 1.0 mm (max). All Vcc and Vss balls must be connected; DNU (Do Not Use) and N.C. (No Connect) balls are unconnected and may be left floating or tied to ground per layout guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| #CE | Chip Enable | Active-low global enable: high = standby (20 μA), low = active (13 mA); enables multi-chip addressing |
| #WE | Write Enable | Rising-edge latch control for commands, addresses, and data - synchronizes all input transfers |
| #RE | Read Enable | Falling-edge triggered serial output strobe; tREA = 25 ns max delay before valid I/O data appears |
| ALE | Address Latch Enable | High = latches column/row address bytes on next #WE rising edge; separates address from command/data |
| CLE | Command Latch Enable | High = latches command codes (e.g., 00h, 80h, 60h) on next #WE rising edge; isolates command protocol |
| RY/#BY | Ready/Busy Output | Open-drain signal: low = internal operation in progress (program/erase/read), high = ready for next command |
| #WP | Write Protect Input | Active-low hardware lock: prevents accidental program/erase when asserted; overrides software commands |
| I/O[0–7] | Bidirectional Data Bus | Multiplexed path for commands (8-bit), addresses (5 cycles × 8-bit), and data (2,112-byte pages) |
Key Features
| Feature | Design Value |
|---|---|
| Two-plane operation | Enables concurrent read or program across independent plane groups, doubling effective bandwidth without host overhead |
| Copy Back command | Permits page-to-page relocation within same die - reduces external buffer requirements during garbage collection |
| ONFI 2.3 compatibility | Ensures interoperability with standardized NAND controllers via documented timing, command set, and parameter page structure |
| OTP area support | Provides one-time programmable region for secure boot keys or calibration data - persistent across full erase cycles |
| Block Lock functionality | Allows selective hardware/software locking of individual blocks to prevent overwrite of critical firmware or configuration sectors |
Applications
| Industrial HMI Storage | Medical Device Firmware |
|---|---|
|
Use Scenario: Storing GUI assets, localized language packs, and runtime logs in panel-mounted HMIs operating continuously at 85°C. IC Role / Device Role / Timing Role: Nonvolatile code and data storage with deterministic 25μs random read for UI responsiveness and 2ms block erase for field-upgradable firmware. Use Value: 10-year data retention and 100K P/E cycles ensure reliable operation over product lifetime without recalibration or replacement. |
Use Scenario: Holding FDA-compliant bootloader, device calibration tables, and audit trail logs in portable diagnostic equipment. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage using #WP hardware lock and OTP for cryptographic keys; RY/#BY enables precise operation timing for safety-critical sequencing. Use Value: Block Lock prevents unauthorized firmware modification; ONFI compatibility simplifies controller qualification for regulatory submissions. |
| Smart Meter Firmware | Automated Test Equipment |
|
Use Scenario: Hosting metrology firmware, tariff tables, and encrypted usage history in ANSI C12.22–compliant electricity meters deployed outdoors. IC Role / Device Role / Timing Role: Industrial-plus grade (-40°C to +105°C) NAND with two-plane reads accelerating firmware patch validation during OTA updates. Use Value: 1.7–1.95V supply range matches meter power rails; Copy Back reduces SRAM buffer needs during field firmware migration. |
Use Scenario: Storing test pattern libraries, calibration coefficients, and pass/fail result histories in benchtop ATE systems requiring rapid reconfiguration. IC Role / Device Role / Timing Role: High-endurance SLC NAND serving as deterministic storage backend - 250μs page program enables sub-millisecond pattern loading. Use Value: 64-page blocks align with ATE memory mapping; spare area hosts ECC metadata ensuring bit-error-free pattern replay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar NAND Flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MT29F8G08ABADAWP-AIT:D | 8G-bit SLC NAND in 63-ball VFBGA, 3.3V supply (not 1.8V); ONFI 2.3 compliant but requires level-shifting interface | Targeted at legacy 3.3V controller platforms; lacks industrial-plus temperature rating (-40°C to +85°C only) | Select if existing design uses 3.3V I/O and cannot accommodate voltage translation; verify timing margins with 3.3V tREA/tRP |
| TC58NVG2S3ETA00 | 8G-bit SLC NAND in 48-pin TSOP-I, 1.8V supply; supports similar command set but no two-plane or Copy Back operations | Suitable for cost-sensitive, lower-throughput applications where board space permits larger TSOP package | Choose when PCB layout constraints favor TSOP over VFBGA and concurrent plane operations are unnecessary |
Compared with MT29F8G08ABADAWP-AIT:D and TC58NVG2S3ETA00, W29N08GZSIBF uniquely combines 1.8V operation, VFBGA miniaturization, two-plane concurrency, and industrial-plus temperature support - making it optimal for next-generation compact, high-reliability embedded systems.
Availability
W29N08GZSIBF is available at Aetrix Electronics and suitable for industrial HMI storage, medical device firmware, smart meter firmware, and automated test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for W29N08GZSIBF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Winbond Electronics is a Taiwan-based semiconductor manufacturer specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and audio codecs, with global manufacturing and quality certifications.
The W29N series targets high-reliability embedded NAND applications demanding SLC endurance, industrial temperature operation, and ONFI-standardized interoperability - particularly in medical, energy, and automation markets.
FAQ
What is the operating temperature range for W29N08GZSIBF?
W29N08GZSIBF is rated for Industrial Plus temperature operation from -40°C to +105°C. This specification is confirmed in the device's ordering information table and electrical characteristics section, enabling deployment in harsh environments such as outdoor smart meters and under-hood automotive subsystems where ambient temperatures exceed standard industrial limits.
Does W29N08GZSIBF support ONFI compliance?
Yes, W29N08GZSIBF supports ONFI 2.3 compatibility, including standardized command definitions, timing parameters, and the READ PARAMETER PAGE (ECh) command that returns ONFI-defined identification and feature data. This ensures interoperability with ONFI-aware controllers without custom driver development.
What package type is used for W29N08GZSIBF?
W29N08GZSIBF uses a 63-ball Very Fine-Pitch Ball Grid Array (VFBGA) package with footprint code B, measuring 9 mm × 11 mm × 1.0 mm maximum height. Pin assignments match the x8 configuration shown in Figure 3-2 of the datasheet, and all Vcc/Vss balls must be properly connected per layout guidelines.
How many program/erase cycles does W29N08GZSIBF guarantee?
W29N08GZSIBF guarantees 100,000 program/erase cycles when used with 4-bit-per-528-byte ECC correction, as specified in the Features section and validated under JEDEC JESD22-A117 stress conditions. This endurance rating applies across the full industrial-plus temperature range and is integral to its SLC NAND architecture.
What is the purpose of the RY/#BY pin on W29N08GZSIBF?
The RY/#BY pin on W29N08GZSIBF is an open-drain Ready/Busy output that signals active internal operations: low indicates ongoing program, erase, or read execution; high confirms completion and readiness for the next command. Its timing is defined by tR (max 200 ns) and is essential for synchronous host controller coordination without polling overhead.
W29N08GZSIBF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Winbond Electronics Corporation
- Series:
- -
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NAND (SLC)
- Memory Size:
- 8Gbit
- Memory Organization:
- 1G x 8
- Memory Interface:
- ONFI
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 35ns, 700µs
- Access Time:
- 25 ns
- Voltage - Supply:
- 1.7V ~ 1.95V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP
W29N08GZSIBF FAQ
1.How can I place an order for W29N08GZSIBF through Aetrix?
Please submit a Request for Quotation (RFQ) for W29N08GZSIBF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for W29N08GZSIBF reliable?
The price and inventory of W29N08GZSIBF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for W29N08GZSIBF is usually 5 days.
3.What payment methods are accepted for W29N08GZSIBF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for W29N08GZSIBF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for W29N08GZSIBF?
W29N08GZSIBF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your W29N08GZSIBF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for W29N08GZSIBF?
For technical support, including W29N08GZSIBF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your W29N08GZSIBF requirements.
6.How does Aetrix verify that W29N08GZSIBF is sourced from the original manufacturer or authorized distributors?
All W29N08GZSIBF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that W29N08GZSIBF meets industry standards.
7.What is the process for return or replacement of W29N08GZSIBF?
All W29N08GZSIBF units undergo pre-shipment inspection (PSI). If there is an issue with W29N08GZSIBF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The W29N08GZSIBF part is unused and in its original packaging.
Return procedure for W29N08GZSIBF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
W29N08GZSIBF Tags
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M24C02-WMN6TP
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