Winbond Electronics Corporation W631GG6KB-11 TR

Overview

W631GG6KB-11 TR from Winbond is a 1 Gbit DDR3 SDRAM organized as 8M × 8 banks × 16 bits, supporting DDR3-1866 (933 MHz) operation with CL=13, tRCD=tRP=13.91 ns, and 1.5 V core/interface supply. It features eight internal banks, 8-bit prefetch, programmable CAS Write Latency (CWL=9), and on-die termination (ODT) for data/strobe lines. This device is used in high-bandwidth memory subsystems of networking routers and industrial control CPUs.

For engineers reviewing the W631GG6KB-11 TR datasheet, W631GG6KB-11 TR pinout, W631GG6KB-11 TR application, or W631GG6KB-11 TR equivalent, key selection criteria include DDR3-1866 timing compliance, -40°C to 95°C industrial temperature support (via 11I variant), WBGA-96 package compatibility, and ZQ calibration capability for impedance matching.

Technical Context

This DDR3 SDRAM implements a source-synchronous interface with differential CK/CK# and DQS/DQS# pairs, where inputs are latched at the crossing point of CK rising and CK# falling edges. All commands-including ACTIVE, READ, WRITE, PRECHARGE, and REFRESH-are synchronized to the CK edge, while data transfers occur on both edges of DQS/DQS#.

It supports DLL-aligned DQ-DQS timing, programmable additive latency (AL = 0, CL−1, CL−2), posted CAS, auto-precharge, and multiple power-down modes (Precharge Power Down, Active Power Down, Self-Refresh). Calibration features include write leveling and Multi-Purpose Register (MPR) readout for system-level timing alignment.

Key Specifications

Pinout & Package

W631GG6KB-11 TR uses a 96-ball Wafer-Level Ball Grid Array (WBGA) package measuring 9 mm × 13 mm with 0.8 mm ball pitch. The package supports fine-pitch routing and thermal performance suitable for compact industrial PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with MT41K128M16JT-125K and IS43TR16128B-125KBL, W631GG6KB-11 TR delivers highest bandwidth (DDR3-1866) at standard 1.5 V, making it optimal for performance-critical embedded systems requiring full JEDEC DDR3-1866 timing compliance without voltage derating.

Availability

W631GG6KB-11 TR is available at Aetrix Electronics and suitable for networking equipment, industrial PLCs, and medical imaging systems requiring stable component supply, long-lifecycle support, and industrial-grade temperature assurance.

Supply support for W631GG6KB-11 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions including NOR/NAND Flash, RAM, and trusted computing ICs.

The W631GG6KB belongs to Winbond's industrial-grade DDR3 SDRAM product line, designed specifically for embedded systems demanding extended temperature operation, robust power management, and JEDEC-compliant high-speed interface reliability.

FAQ

What is the maximum clock frequency supported by W631GG6KB-11 TR?

W631GG6KB-11 TR supports a maximum clock frequency of 933 MHz, corresponding to DDR3-1866 data rate (1866 Mb/s per pin). This is validated under JEDEC conditions with CL=13, tRCD=tRP=13.91 ns, and VDD/VDDQ=1.5 V ± 75 mV. Operation above this frequency violates AC timing specifications and is not guaranteed.

Does W631GG6KB-11 TR support industrial temperature range?

W631GG6KB-11 TR is rated for 0°C to 95°C case temperature. For true industrial operation down to -40°C, the pin-compatible W631GG6KB11I variant must be used - it shares identical electrical specs and timing but is characterized across -40°C ≤ TCASE ≤ 95°C with full JEDEC compliance.

What package type and ball count does W631GG6KB-11 TR use?

W631GG6KB-11 TR uses a 96-ball Wafer-Level Ball Grid Array (WBGA) package with 9 mm × 13 mm footprint and 0.8 mm ball pitch. This RoHS-compliant, lead-free package is optimized for space-constrained industrial PCBs and supports automated assembly with standard reflow profiles.

How is on-die termination configured on W631GG6KB-11 TR?

On-die termination (ODT) on W631GG6KB-11 TR is configured via Mode Registers MR1 and MR2. Supported termination values include RTT_NOM (60 Ω, 120 Ω) and RTT_WR (60 Ω, 120 Ω), selected using ODT pin state and MR1/2 bit fields. Dynamic ODT (Rtt_WR) can be enabled during write bursts to improve signal integrity.

Is ZQ calibration required for W631GG6KB-11 TR operation?

Yes, ZQ calibration is mandatory for W631GG6KB-11 TR to ensure accurate output driver strength and ODT impedance. It requires connection of a 240 Ω ±1% resistor from ZQ pin to VSS. Calibration is performed at power-up and may be repeated during operation to maintain ±10% impedance accuracy across voltage and temperature variations.