Winbond Electronics Corporation W631GG6KB12J

Overview

W631GG6KB12J from Winbond is a 1G-bit DDR3 SDRAM organized as 8M × 8 banks × 16 bits, supporting DDR3-1600 (11-11-11) speed grade with CAS Latency options of 6, 7, 8, 9, 10, and 11. It operates at 1.5V ±0.075V, features 8 internal banks, 8-bit prefetch, and on-die termination (ODT), and is qualified for industrial-plus temperature range (−40°C to +105°C). It serves as main memory in embedded computing, networking processors, and industrial controllers requiring high-bandwidth, low-latency DRAM with extended thermal reliability.

For engineers reviewing the W631GG6KB12J datasheet, W631GG6KB12J pinout, W631GG6KB12J application, or W631GG6KB12J equivalent, this page delivers verified DDR3 timing parameters (tRCD = 13.75 ns min, tRP = 13.75 ns min), JEDEC-compliant ODT configurations (RTT_NOM = 60 Ω, RTT_WR = 120 Ω), ZQ calibration support, and industrial-plus thermal validation - all critical for memory subsystem design, signal integrity analysis, and long-life industrial BOM planning.

Technical Context

This DDR3 SDRAM implements a double-data-rate architecture synchronized to differential CK/CK# inputs, with bi-directional DQS/DQS# strobes edge-aligned on reads and center-aligned on writes. Its DLL aligns DQ and DQS transitions to clock edges, enabling stable 800 MHz operation (DDR3-1600).

The device supports programmable CAS Write Latency (CWL = 5–8), additive latency (AL = 0, CL−1, CL−2), posted CAS, auto-precharge, and multi-mode refresh including ASR and PASR. It uses SSTL_15 I/O interface and includes asynchronous RESET# for power-up initialization and reset recovery.

Key Specifications

Pinout & Package

W631GG6KB12J is housed in a 96-ball WBGA package (9 mm × 13 mm, 0.8 mm ball pitch) with RoHS-compliant lead-free construction. Ball layout follows JEDEC-standard DDR3 SDRAM footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with IS43TR16128B-125KBL and MT41K128M16HA-125:E, W631GG6KB12J uniquely delivers +105°C operation with full ASR/PASR, asynchronous RESET#, and ZQ calibration - making it the only drop-in option for fanless industrial and automotive domain controllers requiring guaranteed refresh stability and deterministic initialization at extreme temperatures.

Availability

W631GG6KB12J is available at Aetrix Electronics and suitable for industrial automation, networking infrastructure, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and extended temperature performance.

Supply support for W631GG6KB12J includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, SRAM, and DDR SDRAM for industrial, automotive, and communications markets.

The W631GG6KB series belongs to Winbond's industrial-grade DDR3 SDRAM product line, designed specifically for applications demanding extended temperature operation, robust initialization, and JEDEC-compliant signal integrity in harsh environments.

FAQ

What is the maximum operating frequency supported by W631GG6KB12J?

W631GG6KB12J supports DDR3-1600 operation, corresponding to a maximum clock frequency of 800 MHz (1600 MT/s data rate). This is validated under industrial-plus conditions (−40°C to +105°C) with tRCD and tRP minimums of 13.75 ns, and requires CL ≥ 6 and CWL ≥ 5 per JEDEC specification.

Does W631GG6KB12J support automatic refresh at +105°C?

Yes, W631GG6KB12J supports Auto Self-Refresh (ASR) at +105°C case temperature. When MR2[7:6] = 10b, the device doubles refresh frequency (tREFI = 3.9 µs) to maintain data retention, eliminating need for external refresh commands under extended thermal stress.

What is the function of the ZQ pin on W631GG6KB12J?

The ZQ pin on W631GG6KB12J connects to an external 240 Ω ±1 % precision resistor to ground. It enables factory and runtime calibration of output driver impedance (34 Ω) and on-die termination values (RTT_NOM = 60 Ω, RTT_WR = 120 Ω), ensuring signal integrity across voltage and temperature variations.

Can W631GG6KB12J be used with DDR3L controllers?

No - W631GG6KB12J is a standard DDR3 (1.5V) device, not DDR3L (1.35V). It requires VDD/VDDQ = 1.5V ±0.075V and is incompatible with DDR3L-only controllers that lack 1.5V support or level-shifting. Using it with DDR3L controllers may cause timing violations or damage due to voltage mismatch.

How does the RESET# pin function during power-up for W631GG6KB12J?

The RESET# pin on W631GG6KB12J initiates a mandatory power-up initialization sequence when asserted low after VDD/VDDQ stabilize. It resets internal state machines, clears mode registers, and triggers ZQ calibration - all before any command can be accepted, ensuring deterministic boot behavior in safety-critical systems.