Winbond Electronics Corporation W631GG6KB-15 TR

Overview

W631GG6KB-15 TR from Winbond is a 1G-bit DDR3 SDRAM organized as 8M × 8 banks × 16-bit, compliant with JEDEC DDR3-1333 (9-9-9) timing, operating at 667 MHz clock frequency (1333 MT/s data rate), with 1.5 V core and I/O supply, and packaged in 96-ball WBGA (9×13 mm²). It supports CAS Latency 6/7/8/9/10, programmable CWL, on-die termination (ODT), ZQ calibration, and asynchronous RESET#-used in embedded computing, industrial controllers, and network edge devices requiring reliable high-density memory.

For engineers reviewing the W631GG6KB-15 TR datasheet, W631GG6KB-15 TR pinout, W631GG6KB-15 TR application, or W631GG6KB-15 TR equivalent, key selection considerations include DDR3-1333 speed bin compliance, -40°C to 95°C industrial temperature range, 96-ball WBGA mechanical compatibility, and support for PASR, ASR, and write leveling for signal integrity in dense PCB layouts.

Technical Context

This DDR3 SDRAM implements an 8-bit prefetch architecture with eight internal banks enabling concurrent access, differential CK/CK# and DQS/DQS# interfaces synchronized to SSTL_15 logic levels, and DLL-based alignment of DQ and DQS transitions to CK. It supports posted CAS with additive latency (AL = 0, CL−1, CL−2), auto-precharge, and burst lengths of 8 (BL8) or 4 (BC4) selectable on-the-fly.

Functional operation includes synchronous command decoding on CK rising edge, bi-directional strobe-referenced data transfers, programmable mode registers (MR0–MR3) for CAS Latency, CWL, ODT settings, and dynamic features including ZQ calibration, multi-purpose register (MPR) readout, and write leveling for system-level timing calibration.

Key Specifications

Pinout & Package

W631GG6KB-15 TR uses a 96-ball WBGA package (9×13 mm², 0.8 mm ball pitch) with standard DDR3 ball assignment per JEDEC specification. Ball layout supports full address/control/data/ODT/ZQ/RESET# functionality in compact footprint suitable for space-constrained industrial modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR3 SDRAM applications.

Compared with IS43TR16128B-15KBL, W631GG6KB-15 TR delivers lower self-refresh current (14 mA vs. 16 mA) and identical timing at 95°C, while MT41K128M16HA-125:E demands voltage and layout changes - making W631GG6KB-15 TR optimal for cost-sensitive industrial upgrades retaining 1.5 V infrastructure.

Availability

W631GG6KB-15 TR is available at Aetrix Electronics and suitable for industrial PLC controllers, network edge routers, medical imaging front-ends, and automated test equipment requiring stable component supply across extended lifecycle programs.

Supply support for W631GG6KB-15 TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Winbond Electronics is a Taiwan-based semiconductor company specializing in specialty memory solutions, including NOR/NAND Flash, PSRAM, and DDR SDRAM for industrial, automotive, and communications markets.

The W631GG6KB series belongs to Winbond's industrial-grade DDR3 SDRAM product line, designed specifically for reliability-critical applications requiring extended temperature operation, long-term supply stability, and JEDEC-compliant signal integrity.

FAQ

What is the maximum operating frequency supported by W631GG6KB-15 TR?

W631GG6KB-15 TR is rated for DDR3-1333 operation, with a maximum clock frequency (f_CK) of 667 MHz and data transfer rate of 1333 MT/s. Its AC timing parameters-including t_AA, t_RCD, and t_RP-are guaranteed at 9-9-9 (ns) values under industrial temperature conditions (−40°C to 95°C). The device does not support DDR3-1600 or DDR3-1866 speeds.

Does W631GG6KB-15 TR support on-die termination (ODT), and how is it configured?

Yes, W631GG6KB-15 TR supports programmable on-die termination (ODT) for DQ, DQS/DQS#, and DM signals. ODT resistance values (Rtt_Nom = 75 Ω, 150 Ω, or 50 Ω) are set via MR1 bits A9–A7, and dynamic ODT (Rtt_WR) can be enabled during write operations only. Configuration is performed through mode register writes after power-up initialization and ZQ calibration.

What is the purpose of the ZQ pin on W631GG6KB-15 TR, and what external component is required?

The ZQ pin on W631GG6KB-15 TR connects to a precision 240 Ω ±1 % external resistor to ground, enabling factory and runtime calibration of output driver strength and ODT impedance. This calibration ensures consistent signal integrity across voltage and temperature variations. No capacitor is required; the ZQ pin must remain connected during all operational modes except power-down.

How does W631GG6KB-15 TR handle refresh at elevated temperatures above 85°C?

At case temperatures between 85°C and 95°C, W631GG6KB-15 TR requires doubling the refresh frequency: t_REFI reduces from 7.8 µs to 3.9 µs. This is achieved either by enabling Auto Self-Refresh (ASR) via MR2 bit A6, or by entering Manual Self-Refresh mode with Extended Temperature Range capability (MR2 A6 = 0, A7 = 1). Standard self-refresh remains valid below 85°C.

Is W631GG6KB-15 TR pin-compatible with other Winbond DDR3 SDRAMs such as W631GG6KB-12 or W631GG6KB-11?

Yes, all W631GG6KB speed grades-including W631GG6KB-15 TR, W631GG6KB-12, and W631GG6KB-11-share identical 96-ball WBGA package, pinout, and ball function mapping. They differ only in speed bin qualification (DDR3-1333 vs. DDR3-1600 vs. DDR3-1866) and temperature grading; thus W631GG6KB-15 TR can be used as a direct replacement in designs targeting lower-frequency operation or cost-optimized bill-of-materials.